DLA SMD-5962-95777 REV A-1998 MICROCIRCUIT DIGITAL RADIATION HARDEDED HIGH SPEED CMOS TRIPLE 3-INPUT NAND GATE MONOLITHIC SILICON《高速抗辐射互补金属氧化物半导体三重3输入与非硅单片电路线型微电路》.pdf

《DLA SMD-5962-95777 REV A-1998 MICROCIRCUIT DIGITAL RADIATION HARDEDED HIGH SPEED CMOS TRIPLE 3-INPUT NAND GATE MONOLITHIC SILICON《高速抗辐射互补金属氧化物半导体三重3输入与非硅单片电路线型微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-95777 REV A-1998 MICROCIRCUIT DIGITAL RADIATION HARDEDED HIGH SPEED CMOS TRIPLE 3-INPUT NAND GATE MONOLITHIC SILICON《高速抗辐射互补金属氧化物半导体三重3输入与非硅单片电路线型微电路》.pdf（25页珍藏版）》请在麦多课文档分享上搜索。

1、NOTICE OF REVISION (NOR)THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED.1. DATE(YYMMDD)98-06-12Form ApprovedOMB No. 0704-0188Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewinginstructions, searching exi

2、sting data sources, gathering and maintaining the data needed, and completing and reviewing thecollection of information. Send comments regarding this burden estimate or any other aspect of this collection of information,including suggestions for reducing this burden, to Department of Defense, Washi

3、ngton Headquarters Services, Directoratefor Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to theOffice of Management and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503.PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EIT

4、HER OF THESE ADDRESSED. RETURN COMPLETEDFORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITYNUMBER LISTED IN ITEM 2 OF THIS FORM.2. PROCURINGACTIVITY NO.3. DODAAC4. ORIGINATORb. ADDRESS (Street, City, State, Zip Code)Defense Supply Center, Columbus3990 East Broad S

5、treetColumbus, OH 43216-50005. CAGE CODE672686. NOR NO.5962-R123-98a. TYPED NAME (First, Middle Initial,Last)7. CAGE CODE672688. DOCUMENT NO.5962-957779. TITLE OF DOCUMENTMICROCIRCUIT, DIGITAL, RADIATION HARDENED, HIGH SPEED CMOS,TRIPLE 3-INPUT NAND GATE, MONOLITHIC SILICON10. REVISION LETTER11. ECP

6、 NO.No users listed.a. CURRENT-b. NEWA12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIESAll13. DESCRIPTION OF REVISIONSheet 1: Revisions ltr column; add “A“.Revisions description column; add “Changes in accordance with NOR 5962-R123-98“.Revisions date column; add “98-06-12“.Revision level block

7、; add “A“.Rev status of sheets; for sheets 1, 4, and 16 through 22, add “A“.Sheet 4: Add new paragraph which states; “3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A tothis document.“Revision level block; add “A“.Sheets 16 through 22: Add attached appendix A.CONTINU

8、ED ON NEXT SHEETS14. THIS SECTION FOR GOVERNMENT USE ONLYa. (X one)X (1) Existing document supplemented by the NOR may be used in manufacture.(2) Revised document must be received before manufacturer may incorporate this change.(3) Custodian of master document shall make above revision and furnish r

9、evised document.b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FORGOVERNMENTDSCC-VASc. TYPED NAME (First, Middle Initial, Last)RAYMOND L. MONNINd. TITLECHIEF, MICROELECTRONICS TEAMe. SIGNATURERAYMOND L. MONNINf. DATE SIGNED(YYMMDD)98-06-1215a. ACTIVITY ACCOMPLISHING REVISIONDSCC-VASb. REVISION COMPLETED (

10、Signature)TIN H. LEc. DATE SIGNED(YYMMDD)98-06-12DD Form 1695, APR 92 Previous editions are obsolete.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-95777DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REV

11、ISION LEVELASHEET16DSCC FORM 2234APR 97Document No: 5962-95777Revision: AAPPENDIX A NOR No: 5962-R123-98APPENDIX A FORMS A PART OF SMD 5962-95777 Sheet: 2 of 8 10. SCOPE10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the QualifiedManufacturers Lis

12、t (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturersapproved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devicesusing chip and wire designs in accordance with MIL-PRF-38534 are specified herei

13、n. Two product assurance classesconsisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part orIdentification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN.10.2 PIN. The PIN sh

14、all be as shown in the following example:5962 R 95777 01 V 9 AFederal RHA Device Device Die DieStock class designator type class code Detailsdesignator (see 10.2.1) (see 10.2.2) designator (see 10.2.4)(see 10.2.3) Drawing Number 10.2.1 RHA designator. Device classes Q and V RHA identified die shall

15、meet the MIL-PRF-38535 specified RHA levels. Adash (-) indicates a non-RHA die.10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:Device type Generic number Circuit function01 HCS10 Radiation hardened, SOS,high speed CMOS, triple3-input NAND gate.10.2.3 Device c

16、lass designator.Device class Device requirements documentationQ or V Certification and qualification to the die requirements of MIL-PRF-38535.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-95777DEFENSE SUPPLY CE

17、NTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET17DSCC FORM 2234APR 97Document No: 5962-95777Revision: AAPPENDIX A NOR No: 5962-R123-98APPENDIX A FORMS A PART OF SMD 5962-95777 Sheet: 3 of 8 10.2.4 Die Details. The die details designation shall be a unique letter which designates the dies

18、physical dimensions,bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for eachproduct and variant supplied to this appendix.10.2.4.1 Die Physical dimensions.Die Types Figure number01 A-110.2.4.2 Die Bonding pad locations and Elec

19、trical functions.Die Types Figure number01 A-110.2.4.3 Interface Materials.Die Types Figure number01 A-110.2.4.4 Assembly related information.Die Types Figure number01 A-110.3 Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details.10.4 Recommended operating condition

20、s. See paragraph 1.4 within the body of this drawing for details.20. APPLICABLE DOCUMENTS20.1 Government specifications, standards, bulletin, and handbooks. Unless otherwise specified, the followingspecifications, standards, bulletin, and handbook of the issue listed in that issue of the Department

21、of Defense Index ofSpecifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-95777DEFENSE SUPPLY CENTER

22、 COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET18DSCC FORM 2234APR 97Document No: 5962-95777Revision: AAPPENDIX A NOR No: 5962-R123-98APPENDIX A FORMS A PART OF SMD 5962-95777 Sheet: 4 of 8 SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specifica

23、tion for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 - Test Method Standard Microcircuits.HANDBOOKDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings.(Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specificacquisition

24、functions should be obtained from the contracting activity or as directed by the contracting activity).20.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, thetext of this drawing shall take precedence.30. REQUIREMENTS30.1 Item Requir

25、ements. The individual item requirements for device classes Q and V shall be in accordance withMIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. Themodification in the QM plan shall not effect the form, fit or function as described herein.

26、30.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be asspecified in MIL-PRF-38535 and the manufacturers QM plan, for device classes Q and V and herein.30.2.1 Die Physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1

27、 and on figure A-1.30.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall beas specified in 10.2.4.2 and on figure A-1.30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1.

28、30.2.4 Assembly related information. The assembly related information shall be as specified in 10.2.4.4 and figure A-1.30.2.5 Truth table. The truth table shall be as defined within paragraph 3.2.3 of the body of this document.30.2.6 Radiation exposure circuit. The radiation exposure circuit shall b

29、e as defined within paragraph 3.2.6 of the body ofthis document.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-95777DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET19DSCC FORM 2234APR

30、97Document No: 5962-95777Revision: AAPPENDIX A NOR No: 5962-R123-98APPENDIX A FORMS A PART OF SMD 5962-95777 Sheet: 5 of 8 30.3 Electrical performance characteristics and post- irradiation parameter limits. Unless otherwise specified herein, theelectrical performance characteristics and post-irradia

31、tion parameter limits are as specified in table I of the body of thisdocument.30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testingsufficient to make the packaged die capable of meeting the electrical performance requirements in table I.

32、30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to acustomer, shall be identified with the wafer lot number, the certification mark, the manufacturers identification and the PINlisted in 10.2 herein. The certification mark shall be a “

33、QML” or “Q” as required by MIL-PRF-38535.30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from aQML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate ofcompliance submitted to

34、 DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that themanufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein.30.7 Certificate of conformance. A certificate of conformance as required for device

35、 classes Q and V in MIL-PRF-38535shall be provided with each lot of microcircuit die delivered to this drawing.40. QUALITY ASSURANCE PROVISIONS40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be inaccordance with MIL-PRF-38535 or as modified in t

36、he device manufacturers Quality Management (QM) plan. Themodifications in the QM plan shall not effect the form, fit or function as described herein.40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in themanufacturers QM plan. As a minim

37、um it shall consist of:a) Wafer Lot acceptance for Class V product using the criteria defined within MIL-STD-883 TM 5007.b) 100% wafer probe (see paragraph 30.4).c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 TM2010or the alternate procedures al

38、lowed within MIL-STD-883 TM5004.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-95777DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET20DSCC FORM 2234APR 97Document No: 5962-95777Revisio

39、n: AAPPENDIX A NOR No: 5962-R123-98APPENDIX A FORMS A PART OF SMD 5962-95777 Sheet: 6 of 8 40.3 Conformance inspection.40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see30.5 herein). RHA levels for device classes Q and V shall

40、 be as specified in MIL-PRF-38535. End point electrical testing ofpackaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs4.4.4.1, 4.4.4.1.1, 4.4.4.2, 4.4.4.3, and 4.4.4.4.50. DIE CARRIER50.1 Die carrier requirements. The requirements fo

41、r the die carrier shall be in accordance with the manufacturers QM planor as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanicaland electrostatic protection.60. NOTES60.1 Intended use. Microcircuit die conforming to this drawing are

42、intended for use in microcircuits built in accordance withMIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications andlogistics purposes.60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43216-5000 or tele

43、phone(614)-692-0674.60.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined withMIL-PRF-38535 and MIL-HDBK-1331.60.4 Sources of Supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendor

44、s listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA andhave agreed to this drawing.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-95777DEFENSE SUPPLY CENTER COLUMBUS

45、COLUMBUS, OHIO 43216-5000REVISION LEVELASHEET21DSCC FORM 2234APR 97Document No: 5962-95777Revision: AAPPENDIX A NOR No: 5962-R123-98APPENDIX A FORMS A PART OF SMD 5962-95777 Sheet: 7 of 8 FIGURE A-1o DIE PHYSICAL DIMENSIONSDie Size: 2200 x 2240 microns.Die Thickness: 21 +/- 2 mils.G01 DIE BONDING PA

46、D LOCATIONS AND ELECTRICAL FUNCTIONSThe following metallization diagram supplies the locations and electrical functions of the bonding pads. The internalmetallization layout and alphanumeric information contained within this diagram may or may not represent the actual circuitdefined by this SMD.NOTE

47、: Pad numbers reflect terminal numbers when placed in Case Outlines C, X (see Figure 1).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-95777DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELAS

48、HEET22DSCC FORM 2234APR 97Document No: 5962-95777Revision: AAPPENDIX A NOR No: 5962-R123-98APPENDIX A FORMS A PART OF SMD 5962-95777 Sheet: 8 of 8 o INTERFACE MATERIALSTop Metallization: SiAl 11.0kA +/- 1kABackside Metallization NoneGlassivationType: SiO2Thickness 13.0kA +/- 2.6kASubstrate: Silicon on Sapphire (SOS)o ASSEMBLY RELATED INFORMATIONSubstrate Potential: InsulatorSpecial assemblyinstructions: Bond pad #14 (VCC) first.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING BULLETINDATE: 98-06-12Approved so