DLA SMD-5962-95640 REV F-2006 MICROCIRCUIT LINEAR DUAL QUAD RAIL-TO-RAIL LOW POWER OPERATIONAL AMPLIFIER MONOLITHIC SILICON《双重或四重杆对杆低功率运算放大器硅单片电路线型微电路》.pdf

《DLA SMD-5962-95640 REV F-2006 MICROCIRCUIT LINEAR DUAL QUAD RAIL-TO-RAIL LOW POWER OPERATIONAL AMPLIFIER MONOLITHIC SILICON《双重或四重杆对杆低功率运算放大器硅单片电路线型微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-95640 REV F-2006 MICROCIRCUIT LINEAR DUAL QUAD RAIL-TO-RAIL LOW POWER OPERATIONAL AMPLIFIER MONOLITHIC SILICON《双重或四重杆对杆低功率运算放大器硅单片电路线型微电路》.pdf（14页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device class N and plastic small outlines X and Y. Make changes to 1.2.3, 1.2.4, 1.3, table I, figure 1, figure 2, and table II. 95-07-20 M. A. FRYE B Add device types 03 and 04. Technical and editorial changes throughout. 96-02-02 M. A. FRYE

2、 C Add case outlines X and Y to device types 03 and 04. Make changes to 1.2.6 and editorial changes throughout. ro 97-10-20 R. MONNIN D Make change to device type 03 manufacturers PIN as specified under 1.2.6. ro 97-11-14 R. MONNIN E Make changes to IIOand IIBtests as specified in table I herein. -

3、ro 01-01-31 R. MONNIN F Drawing updated to reflect current requirements. - ro 06-02-08 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY RICK OFFICER DEFENSE S

4、UPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL FRYE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-05-15 MICROCIRCUIT, LINEAR,

5、 DUAL/QUAD, RAIL-TO-RAIL, LOW POWER, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-95640 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E187-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO

6、CIRCUIT DRAWING SIZE A 5962-95640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents three product assurance class levels consisting of space application (device class V), high reliability (device classes

7、 M and Q), and nontraditional performance environment (device class N). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. For device class

8、 N, the user is cautioned to assure that the device is appropriate for the application environment. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95640 01 Q C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1

9、.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes N, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specif

10、ied RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 TLC2252 Rail-to-rail, very low power, dual, operational amplifie

11、r02 TLC2254 Rail-to-rail, very low power, quad, operational amplifier03 TLC2252A Rail-to-rail, very low power, dual, operational amplifier with enhanced VIO 04 TLC2254A Rail-to-rail, very low power, quad, operational amplifier with enhanced VIO1.2.3 Device class designator. The device class designat

12、or is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A N Certification and qua

13、lification to MIL-PRF-38535 with a nontraditional performance environment (encapsulated in plastic) Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-9564

14、0 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835, JEDEC Publication 95, and as follows: Outline letter Descriptive designator Terminals Package style Document C GDIP1

15、-T14 or CDIP2-T14 14 Dual-in-line MIL-STD-1835 D GDFP1-F14 or CDFP2-F14 14 Flat pack MIL-STD-1835 H GDFP1-F10 or CDFP2-F10 10 Flat pack MIL-STD-1835 P GDIP1-T8 or CDIP2-T8 8 Dual-in-line MIL-STD-1835 X MS-012AA 8 Plastic small outline JEP 95 Y MS-012AB 14 Plastic small outline JEP 95 2 CQCC1-N20 20

16、Square leadless chip carrier MIL-STD-1835 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes N, Q, and V or MIL-PRF-38535, appendix A for device class M. 1.2.6 Device class N manufacturer PIN. For device class N, plastic encapsulated microcircuits (PEMs) the follo

17、wing manufacturer PIN (see 3.5.1 herein) shall be marked: Standard Microcircuit 1/ Drawing PIN Manufacturer PIN 5962-9564001NXD 2252M 5962-9564002NYD TLC2254M 5962-9564003NXD 2252A 5962-9564004NYD TLC2254AM 1.3 Absolute maximum ratings. 2/ Supply voltage range (VDD) -8.0 V dc to +8.0 V dc 3/ Differe

18、ntial input voltage (VID) -16.0 V dc to +16.0 V dc 4/ Input voltage range (VIN) -VDD- 0.3 V to +VDD3/ Input current, each input (IIN) . +5.0 mA to -5.0 mA Output current (IOUT) +50.0 mA to -50.0 mA Total current into +VDD. +50.0 mA to -50.0 mA Total current into -VDD. +50.0 mA to -50.0 mA Duration o

19、f short circuit current at or below +25C . Unlimited 5/ Operating free-air temperature range (TA) . -55C to +125C Storage temperature range (TSTG) -65C to +150C Lead temperature (soldering 10 seconds) +260C Maximum junction temperature (TJ) . +150C _ 1/ The SMD PIN is provided for cross reference in

20、formation, see 3.5.2 herein. 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ All voltage values, except differential voltages, are with respect to the midpoint between

21、+VDDand -VDD. 4/ Differential voltages are at the noninverting input with respect to the inverting input. Excessive current flows if the input is brought below -VDD-0.3 V. 5/ The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dis

22、sipation rating is not exceeded. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 1.3 Absolute maxi

23、mum ratings Continued. 2/ Maximum power dissipation (PD): 6/ Cases C and 2 1375 mW Case D and H 700 mW Case P 1050 mW Case X 725 mW Case Y 950 mW Thermal resistance, junction-to-case (JC): Cases C, D, H, P, 2 . See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage (VDD) 2.2 V dc to 8

24、.0 V dc Input voltage range (VIN) -VDDto +VDD- 1.5 V Common-mode input voltage (VIC) . -VDDto +VDD- 1.5 V Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form

25、a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE S

26、TANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are availa

27、ble online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specif

28、ied herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation. ELECTRONICS INDUSTRIES ALLIANCE (EIA) JEP 95 - Registered and Standard Outlines for Semiconductor Devices (Copies of this document are available online at www.jedec.org/ or from the Electronics

29、 Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). _ 6/ Above TA= +25C, derate by the folowing factors; cases C and 2 at 11.0 mW/C, cases D and H at 5.5 mW/C, case P at 8.4 mW/C, case X at 5.8 mW/C, and case Y at 7.6 mW/C. Provided by IHSNot for ResaleNo reproduction or networki

30、ng permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references ci

31、ted herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes N, Q, and V shall be in accor

32、dance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with M

33、IL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes N, Q, and V or MIL-PRF-38535, appendix A and h

34、erein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specifi

35、ed herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. T

36、he electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufact

37、urer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes N, Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix

38、A. 3.5.1 Certification/compliance mark. The certification mark for device classes N, Q, and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes N, Q,

39、and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of su

40、pply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes N, Q, and V, the requirements of MIL-PRF-38535 and herein or for device

41、class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes N, Q, and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to

42、 this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device

43、class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device cla

44、ss M devices covered by this drawing shall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OH

45、IO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A 1/ subgroups Device type Limits 2/ Unit Min MaxInput offset voltage VIOVDD= 2.5 V, VIC= 0 V, 1 01,02 1500 V RS= 50 , V

46、OUT= 0 V 03,04 850 2,3 01,02 1750 03,04 1000 VDD= 5 V, VIC= 0 V, 1 01,02 1500 RS= 50 , VOUT= 0 V 03,04 850 2,3 01,02 1750 03,04 1000 Input offset current IIOVDD= 2.5 V, VIC= 0 V, 2 All 1000 pA RS= 50 , VOUT= 0 V, TA= +125C VDD= 5 V, VIC= 0 V, 1000 RS= 50 , VOUT= 0 V, TA= +125C Input bias current IIB

47、VDD= 2.5 V, VIC= 0 V, 2 All 1000 pA RS= 50 , VOUT= 0 V, TA= +125C VDD= 5 V, VIC= 0 V, 1000 RS= 50 , VOUT= 0 V, TA= +125C Common-mode input voltage range VICRVDD= 5 V, |VIO| 5 mV, 1 All 0 to 4 V RS= 50 2,3 0 to 3.5 VDD= 5 V, |VIO| 5 mV, 1 -5 to 4 RS= 50 2,3 -5 to 3.5 See footnotes at end of table. Pr

48、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95640 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A 1/ subgroups Device type Limits 2/ Unit Min MaxHigh level output voltage VOHVDD= 5 V, VIC= 2.5 V, 1 All 4.9 V IOH= -75 A 2,3 4.8 VDD= 5 V,