DLA SMD-5962-95604 REV F-2012 MICROCIRCUIT LINEAR DUAL HIGH SPEED LOW POWER FEEDBACK AMPLIFIER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case X which is a 16 lead flat pack. Make changes to 1.2.4, 1.3, 3.2.1, 3.2.2, figure 1, slew rate test, and footnote 1 as specified in table I herein. 99-02-10 R. MONNIN B Add Table IIB and delete figure 1. ro 01-03-29 R. MONNIN C Add radiat
2、ion hardened requirements. ro 01-08-07 R. MONNIN D Drawing updated to reflect current requirements. -rrp 05-09-07 R. MONNIN E Add device types 02 and 03. Make change to paragraphs 1.2.2, 1.2.4, 1.3, and 1.5. Make change to Table I and figure 1. Make change to Table IIA, Table IIB, and paragraph 4.4.
3、4.1. Delete paragraphs 4.4.4.1.1 and 4.4.4.2. -rrp 11-11-15 C. SAFFLE F Add paragraph 3.1.1 and appendix A for microcircuit die. - ro 12-04-19 C. SAFFLE REV SHEET REV F F F F F F F SHEET 15 16 17 18 19 20 21 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14
4、PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY RAYMOND MONNIN MICRO
5、CIRCUIT, LINEAR, DUAL, HIGH SPEED, LOW POWER, FEEDBACK AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 96-08-01 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-95604 SHEET 1 OF 21 DSCC FORM 2233 APR 97 5962-E145-12 Provided by IHSNot for ResaleNo reproduction or networking permitted withou
6、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95604 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
7、and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following ex
8、ample: 5962 F 95604 01 V P A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-3853
9、5 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) ide
10、ntify the circuit function as follows: Device type 1/ Generic number Circuit function 01 LM6172 Dual, high speed, low power, voltage feedback amplifier 02 LM6172 Radiation hardened, dual, high speed, low power, voltage feedback amplifier 03 LM6172 Radiation hardened, dual, high speed, low power, vol
11、tage feedback amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B mi
12、crocircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in
13、-line X 1/ GDFP1-G16 16 Flat pack with gull wing leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. _ 1/ For case outline X, package material for device types 01 is aluminum nitride and package materia
14、l for device types 02 and 03 is aluminum oxide. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95604 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolut
15、e maximum ratings. 2/ Supply voltage (VS) . 36 V Differential input voltage . 10 V 3/ Output short circuit to ground Continuous 4/ Power dissipation (PD) 1.03 W Storage temperature range . -65C to +150C Junction temperature (TJ) . +150C Lead temperature (soldering, 5 seconds) . +260C Thermal resista
16、nce, junction-to-case (JC): Case P . 2C/W Case X (Device type 01) . 6C/W 1/ Case X (Device types 02 and 03) 7C/W 1/ Thermal resistance, junction-to-ambient (JA): Case P . 100C/W still air 46C/W 500 LFPM air flow Case X (Device type 01) 124C/W still air 74C/W 500 LFPM air flow 1/ Case X (Device type
17、02 and 03) 135C/W still air 85C/W 500 LFPM air flow 1/ 1.4 Recommended operating conditions. Supply voltage (VS) . 5.5 V to 36 V Ambient operating temperature range (TA) . -55C to +125C 1.5 Radiation features. 5/ Maximum total dose available (dose rate = 50 300 rads(Si)/s) : Device types 01 and 02 3
18、00 krads(Si) Maximum total dose available (dose rate = .010 rad(Si)/s): Device type 03 . 100 krads(Si) _ 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ Differential in
19、put voltage is measured at VS= 15V. 4/ Continuous short circuit operation can result in exceeding the maximum allowed junction temperature of +150C. 5/ For device types 01 and 02, these parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiat
20、ion end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL- STD-883, method 1019, condition A. For device type 03, this part has been tested and does not demonstrate low dose rate sensitivity. Radiation end point limits for the noted parameters are guara
21、nteed for the conditions specified in MIL-STD-883, method 1019, condition D. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95604 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC
22、 FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicit
23、ation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF
24、DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philade
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