DLA SMD-5962-95577 REV B-2008 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 36-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change in accordance with the notice of revision 5962-R130-96. - jak 96/05/22 Monica L. Poelking B Redrawn with changes. Update the boilerplate to the current requirements of MIL-PRF-38535. - jak 08-12-17 Thomas M. Hess REV SHET REV B B B SHEET 1

2、5 16 17 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerby STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE

3、FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-04-17 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 36-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A

4、 CAGE CODE 67268 5962-95577 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E075-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95577 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHE

5、ET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents three product assurance class levels consisting of space application (device class V) high reliability (device classes Q and M) and nontraditional performance environment (device class N). A choice of case outlines and lead finish

6、es are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. For device class N, the user is cautioned to assure that the device is appropriate for the application environment. 1.2 PIN. The

7、PIN is as shown in the following example: 5962 - 95577 01 N X D Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes N, Q, and V RHA

8、 marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 D

9、evice type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABT32245 36-bit bus transceiver with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the p

10、roduct assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A N Certification and qualification to MIL-PRF-38535 with nontra

11、ditional performance environment (encapsulated in plastic) Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835, JEDEC Publication 95, and as follows: Outline letter Descriptive designator Terminals Package style Documen

12、t X MS-026 100 Plastic thin quad JEDEC Pub 95 flat package 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes N, Q, and V or MIL-PRF-38535, appendix A for device class M. 1.2.5.1 Lead finish D. Lead finish D shall be designated by a single letter as follows: Finis

13、h letter Process D Palladium Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95577 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum

14、ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (except I/O ports) (VIN). -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) -0.5 V dc to +5.5 V dc 4/ DC output current (IOL) (per output). +96 mA DC input clamp current (IIK) (VIN= 0.0 V). -18 mA DC

15、output clamp current (IOK) (VOUT 0.0 V). -50 mA Storage temperature range (TSTG) -65C to +150C Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) 11.6C/W Junction temperature (TJ) . +175C Maximum power dissipation (at TA= +55C in still air) (PD) . 1.2 W 5/ 1.4 R

16、ecommended operating conditions. 2/ 3/ Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Input voltage range (VIN) . +0.0 V dc to VCCOutput voltage range (VOUT) +0.0 V dc to VCCMaximum low level input voltage (VIL ) 0.8 V Minimum high level input voltage (VIH ) . 2.0 V Maximum high level output cu

17、rrent (IOH) -24 mA Maximum low level output current (IOL) . +48 mA Maximum input rise or fall rate (V/t) (outputs enabled) . 10 ns/V Case operating temperature range (TC) -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the m

18、aximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C, unless otherwise specified. 4/ The

19、input negative voltage rating may be exceeded provided that the input clamp current rating is observed 5/ The maximum package power dissipation is calculated using a junction temperature of 150C and a board trace length of 75 millimeters. Provided by IHSNot for ResaleNo reproduction or networking pe

20、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95577 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, st

21、andards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification

22、for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies o

23、f these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specifi

24、ed herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONICS INDUSTRIES ALLIANCE (EIA) JEP 95 - Registered and Standard Outlines for Semiconductor Devices (Copies of this document are available online at www.jedec.org/ or from the

25、Electronics Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable

26、 laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes N, Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (

27、QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, an

28、d physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Ter

29、minal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Block diagram. The block diagram shall be as specified on figure 3. 3.2.5 Ground bounce waveforms and test circuit. The ground bounce waveforms a

30、nd test circuit shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95577 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97

31、 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation

32、parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. Th

33、e part shall be marked with the PIN listed in 1.2 herein. Marcking for device class M shall beIn addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5

34、962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes N, Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. For device class N only, the date code

35、format may be modified as a traceable date code in lieu of the inspection lot date code for case outline “X”. 3.5.1 Certification/compliance mark. The certification mark for device classes N, Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall b

36、e a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes N, Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certific

37、ate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers p

38、roduct meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes N, Q and V in MIL-PRF-38535 or for devic

39、e class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required f

40、or any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onsh

41、ore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 126 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro

42、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95577 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol VCCLimits 4/ Unit Test conditions 2/ -55C TC +

43、125C +4.5 V VCC +5.5 V unless otherwise specified Group A subgroups 3/ Min Max 4.5 V 1, 2, 3 2.5 IOH= -3.0 mA 5.0 V 1, 2, 3 3.0 High level output voltage 3006 VOHFor all inputs affecting output under test, VIN= 2.0 V or 0.8 V IOH= -24 mA 4.5 V 1, 2, 3 2.0 V Low level output voltage 3007 VOLFor all i

44、nputs affecting output under test, VIN= 2.0 V or 0.8 V IOL= 48 mA 4.5 V 1, 2, 3 0.55 V Negative input clamp voltage 3022 VIC- For input under test, IIN= -18 mA 4.5 V 1 -1.2 V Control inputs For input under test, VIN= VCC5.5 V 1, 2, 3 +1.0 Control inputs For input under test, VIN= GND 5.5 V 1, 2, 3 -

45、1.0 A A or B ports For input under test VIN= VCC5.5 V 1, 2, 3 +20.0 Input current IIN5/ A or B ports For input under test, VIN= GND 5.5 V 1, 2, 3 -20.0 A A or B ports For input under test, VIN= 0.8 V 5.5 V 1, 2, 3 100 A Input current IIN(hold) 5/ A or B ports For input under test, VIN= 2.0 V 5.5 V 1

46、, 2, 3 -100 A Three-state output leakage current, high 3021 IOZH6/ VOUT= 2.7 V, mOE 2.0 V 5.5 V 1, 2, 3 +10.0 A Three-state output leakage current, low 3020 IOZL6/ VOUT= 0.5 V, mOE 2.0 V 5.5 V 1, 2, 3 -10.0 A High-state leakage current ICEXFor output under test, VOUT= 5.5 V Outputs at high logic sta

47、te 5.5 V 1, 2, 3 +50.0 A Output current 3011 IO7/ VOUT= 2.5 V 0.0 V 1 -50 -180 mA Quiescent supply current delta, TTL input level 3005 ICC8/ For input under test, VIN= 3.4 V For all other inputs, VIN= VCCor GND 5.5 V 1, 2, 3 +1.0 mA Quiescent supply current, outputs high 3005 ICCH+3.0 mA Quiescent s

48、upply current, outputs low 3005 ICCL+20.0 Quiescent supply current, outputs disabled 3005 ICCZFor all inputs, VIN= VCCor GND IOUT= 0.0 A 5.5 V 1, 2, 3 +2.0 mA Input capacitance 3005 CINControl inputs, TC= +25C VIN= 2.5 V or 0.5 V See 4.4.1b 5.0 V 4 3.5 pF See footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95577 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electri