DLA SMD-5962-94709-1994 MICROCIRCUIT LINEAR CMOS BANG-BANG CONTROLLER MONOLITHIC SILICON《枪战控制互补金属氧化物半导体硅单片电路线型微电路》.pdf

《DLA SMD-5962-94709-1994 MICROCIRCUIT LINEAR CMOS BANG-BANG CONTROLLER MONOLITHIC SILICON《枪战控制互补金属氧化物半导体硅单片电路线型微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-94709-1994 MICROCIRCUIT LINEAR CMOS BANG-BANG CONTROLLER MONOLITHIC SILICON《枪战控制互补金属氧化物半导体硅单片电路线型微电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDREVSHEETREVSHEETREV STATUS REVOF SHEETS SHEET 1 2345678910PMIC N/A PREPARED BY RAJESH PITHADIADEFENSE ELECTRONICS SUPPLY CENTERSTANDARDMICROCIRCUITDRAWINGCHECKED BYRAJESH PITHADIADAYTON, OHIO 45444THIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAPPR

2、OVED BYMICHAEL FRYEMICROCIRCUIT, LINEAR, CMOS, BANG-BANGCONTROLLER, MONOLITHIC SILICON AND AGENCIES OF THEDEPARTMENT OF DEFENSEDRAWING APPROVAL DATE94-09-13AMSC N/AREVISION LEVEL SIZEACAGE CODE672685962-94709SHEET1 OF 10DESC FORM 193JUL 94 5962-E304-94DISTRIBUTION STATEMENT A. Approved for public re

3、lease; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-94709DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET2DESC FORM 193AJUL 941. SCOPE1.1 Scope. This drawing fo

4、rms a part of a one part - one part number documentation system (see 6.6 herein). Two productassurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and achoice of case outlines and lead finishes are available and are reflected in th

5、e Part or Identifying Number (PIN). Device classM microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use ofMIL-STD-883 in conjunction with compliant non-JAN devices”. When available, a choice of Radiation Hardness Assurance(RHA) levels

6、are reflected in the PIN.1.2 PIN. The PIN shall be as shown in the following example:5962 - 94709 01 M P XG01G01 G01G01 G01G01G01G01 G01G01 G01G01G01G01 G01 G01 G01 G01Federal RHA Device Device Case Lead stock class designator type class outline finishdesignator (see 1.2.1) (see 1.2.2) designator (s

7、ee 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number1.2.1 RHA designator. Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levelsand shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked shall meet the MIL-I-38535 specified RHA lev

8、els and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.1.2.2 Device type(s). The device type(s) identify the circuit function as follows:Device type Generic number Circuit function01 1041 BANG-BANG Controller1.2.3 Device class designator. The device class

9、designator is a single letter identifying the product assurance level asfollows:Device class Device requirements documentationM Vendor self-certification to the requirements for non-JAN class B microcircuits inaccordance with 1.2.1 of MIL-STD-883Q or V Certification and qualification to MIL-I-385351

10、.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleP GDIP1-T8 or CDIP2-T8 8 Dual-in-line1.2.5 Lead finish. The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MI

11、L-I-38535 forclasses Q and V. Finish letter “X” shall not be marked on the microcircuit or its packaging. The “X” designation is for use inspecifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.Provided by IHSNot for ResaleNo reproduction or ne

12、tworking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-94709DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET3DESC FORM 193AJUL 941.3 Absolute maximum ratings. 1/Total supply voltage (V+ to V-). 18 VInput voltage. V+ + 0.3 V to V- - 0.3 VOutput sh

13、ort circuit duration. ContinuousStorage temperature range -55G01C to +150G01CLead temperature (soldering, 10 seconds) 300G01CJunction temperature (TJ). 150G01CThermal resistance, junction-to-case (G02JC). see MIL-STD-1835Thermal resistance, junction-to-ambient (G02JA) 100G01C/W1.4 Recommended operat

14、ing conditions.Supply voltage range 2.8 V to 15 VAmbient operating temperature range (TA) -55G01C to +125G01C2. APPLICABLE DOCUMENTS2.1 Government specification, standards, bulletin, and handbook. Unless otherwise specified, the following specification, standards, bulletin,and handbook of the issue

15、listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation,form a part of this drawing to the extent specified herein.SPECIFICATIONMILITARYMIL-I-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSMILITARYMIL-STD-8

16、83 - Test Methods and Procedures for Microelectronics.MIL-STD-973 - Configuration Management.MIL-STD-1835 - Microcircuit Case Outlines.BULLETINMILITARYMIL-BUL-103 - List of Standardized Military Drawings (SMDs).HANDBOOKMILITARYMIL-HDBK-780 - Standardized Military Drawings.(Copies of the specificatio

17、n, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functionsshould be obtained from the contracting activity or as directed by the contracting activity.)2.2 Order of precedence. In the event of a conflict between the text of this drawing and the re

18、ferences cited herein, the text of this drawingtakes precedence.3. REQUIREMENTS3.1 Item requirements. The individual item requirements for device class M shall be in accordance with 1.2.1 of MIL-STD-883, “Provisions forthe use of MIL-STD-883 in conjunction with compliant non-JAN devices” and as spec

19、ified herein. The individual item requirements for deviceclasses Q and V shall be in accordance with MIL-I-38535, the device manufacturers Quality Management (QM) plan, and as specified herein.1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation

20、at the maximum levels maydegrade performance and affect reliability.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-94709DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET4DESC FORM 193AJUL 9

21、43.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specifiedin MIL-STD-883 (see 3.1 herein) for device class M and MIL-I-38535 for device classes Q and V and herein.3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1

22、.2.4 herein.3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.3.2.3 Block diagram(s). The block diagram(s) shall be as specified on figure 2.3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, theele

23、ctrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the fullambient operating temperature range.3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electricaltests f

24、or each subgroup are defined in table I.3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordancewith MIL-STD-883 (see 3.1 herein). In addition, the manufacturers PIN may also be marked as listed in MIL-BUL-103. Markingfor device class

25、es Q and V shall be in accordance with MIL-I-38535.3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a “C” as required in MIL-STD-883(see 3.1 herein). The certification mark for device classes Q and V shall be a “QML” or “Q” as required in MIL-I-38535.3.6 Certifica

26、te of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in orderto be listed as an approved source of supply in MIL-BUL-103 (see 6.7.2 herein). For device classes Q and V, a certificate ofcompliance shall be required from a QML-38535 listed manufacture

27、r in order to supply to the requirements of this drawing (see6.7.1 herein). The certificate of compliance submitted to DESC-EC prior to listing as an approved source of supply for thisdrawing shall affirm that the manufacturers product meets, for device class M, the requirements of MIL-STD-883 (see

28、3.1herein), or for device classes Q and V, the requirements of MIL-I-38535 and the requirements herein.3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein)or for device classes Q and V in MIL-I-38535 shall be provided with each l

29、ot of microcircuits delivered to this drawing.3.8 Notification of change for device class M. For device class M, notification to DESC-EC of change of product (see 6.2herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.3.9 Verification and review fo

30、r device class M. For device class M, DESC, DESCs agent, and the acquiring activity retainthe option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be madeavailable onshore at the option of the reviewer.3.10 Microcircuit group assignment for

31、device class M. Device class M devices covered by this drawing shall be inmicrocircuit group number 74 (see MIL-I-38535, appendix A).4. QUALITY ASSURANCE PROVISIONS4.1 Sampling and inspection. For device class M, sampling and inspection procedures shall be in accordance with MIL-STD-883 (see 3.1 her

32、ein). For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-I-38535 and the device manufacturers QM plan.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-94709DEFENSE ELECT

33、RONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET5DESC FORM 193AJUL 94TABLE I. Electrical performance characteristics.Test SymbolConditions-55G01C G01 TA G01+125G01CV+ = 5 Vunless otherwise specifiedGroup AsubgroupsDevicetypeLimits UnitMin MaxSet point error 1/ 2/ SPE V+ = 2.8 V to 6 VDelta

34、 = 5 mV1, 2, 3 01 G020.5 mVV+ = 6 V to 15 VDelta = 5 mVG023 mVDeadband error 1/ 3/ DBE V+ = 2.8 V to 6 VDelta = 5 mV1, 2, 3 01 G021 mVV+ = 6 V to 15 VDelta = 5 mVG026 mVEquivalent input resistance4/RIN fs = 1 kHz 1, 2, 3 01 10 MG03Input voltage range VIN 1, 2, 3 01 GND V+ VPower supply ON current 5/

35、IS(ON) V+ = 5 V, VPP ON 1, 2, 3 01 3 mAPower supply OFF current 5/IS(OFF) V+ = 5 V, VPP OFF 1, 2, 3 01 5 G04AResponse time 6/ TD V+ = 5 V 9 01 60 100 G04sON/ OFF output logic 1outputVOH V+ = 4.75 V,IOUT = -360 G04A1, 2, 3 01 2.4 VON/ OFF output logic 0outputVOL V+ = 4.75 V,IOUT = 1.6 mA1, 2, 3 01 0.

36、45 V1/ Applies over input voltage range limit and includes gain uncertainty.2/ Set point error = (VU + VL)/2) - set point (where VU = upper band limit and VL = lower band limit). Set point error depends upon the bias applied to the DELTA pin. The relationship of the DELTA pin to the set point error

37、test is: Set point error is G020.5 mV G02 0.1 percent of DELTA for V+ = 2.8 V to 6 V; set point error is G023 mV G02 0.1 percent of DELTA for V+ = 6 V to 15 V.3/ Deadband error = (VU - VL) - 2 x DELTA (where VU = upper band limit and VL = lower band limit). Deadband error depends upon the bias appli

38、ed to the DELTA pin. The relationship of the DELTA pin to the Deadband error test is: Deadband error is G021 mV G02 0.2 percent of DELTA for V+ = 2.8 V to 6 V; Deadband error is G026 mV G02 0.2 percent of DELTA for V+ = 6 V to 15 V.4/ Guaranteed, if not tested, to the limits specified in table I. RI

39、N = 1/(fs x 66 pF).5/ Average supply current = TD x IS(ON) x fs + (1 - TD x fs) x IS(OFF).6/ Response time is set by an internal oscillator and is independent of overdrive voltage. TD = VPP pulse width.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-

40、STANDARDMICROCIRCUIT DRAWINGSIZEA5962-94709DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET6DESC FORM 193AJUL 94Device type 01Case outline PTerminal number Terminal symbol12345678ON/ OFFVINSET POINTGNDDELTAOSCVPPV+FIGURE 1. Terminal connections.Provided by IHSNot for ResaleNo

41、reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-94709DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET7DESC FORM 193AJUL 94FIGURE 2. Block diagram.Provided by IHSNot for ResaleNo reproduction or networking permitted withou

42、t license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-94709DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET8DESC FORM 193AJUL 944.2 Screening. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on alldevices prio

43、r to quality conformance inspection. For device classes Q and V, screening shall be in accordance with MIL-I-38535, and shall beconducted on all devices prior to qualification and technology conformance inspection.4.2.1 Additional criteria for device class M.a. Burn-in test, method 1015 of MIL-STD-8

44、83.(1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level control andshall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs,biases, and power dissipation, as appl

45、icable, in accordance with the intent specified in test method 1015.(2) TA= +125G01C, minimum.b. Interim and final electrical test parameters shall be as specified in table II herein.4.2.2 Additional criteria for device classes Q and V.a. The burn-in test duration, test condition and test temperatur

46、e, or approved alternatives shall be as specified in the devicemanufacturers QM plan in accordance with MIL-I-38535. The burn-in test circuit shall be maintained under document revision levelcontrol of the device manufacturers Technology Review Board (TRB) in accordance withMIL-I-38535 and shall be

47、made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs,outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.b. Interim and final electrical test parameters shall be as

48、specified in table II herein.c. Additional screening for device class V beyond the requirements of device class Q shall be as specified inappendix B of MIL-I-38535.4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-I-38535. Inspections to be performed shall be those specified in MIL-I-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1through 4.4.4).4.4 Conformance inspection. Quality conformance inspection for device class M shall be in accordance with MIL-STD-883, (see 3.1 her