DLA SMD-5962-94612 REV H-2006 MICROCIRCUIT HYBRID MEMORY FLASH ERASABLE PROGRAMMABLE READ ONLY MEMORY 512K X 32-BIT《512K X 32位动画可擦除 可程序化只读存储器 数字混合微型电路》.pdf

《DLA SMD-5962-94612 REV H-2006 MICROCIRCUIT HYBRID MEMORY FLASH ERASABLE PROGRAMMABLE READ ONLY MEMORY 512K X 32-BIT《512K X 32位动画可擦除 可程序化只读存储器 数字混合微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-94612 REV H-2006 MICROCIRCUIT HYBRID MEMORY FLASH ERASABLE PROGRAMMABLE READ ONLY MEMORY 512K X 32-BIT《512K X 32位动画可擦除 可程序化只读存储器 数字混合微型电路》.pdf（41页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Corrected dimension D2 for case outlines U, X, and 4. Corrected dimensions D/E and D1/E1 for case outline Y. -sld 98-10-02 K.A. Cottongim E Added case outline 9. Added device type 05. Added vendor cage 0EU86 for device types 01 through 03 in the

2、Standard Microcircuit Drawing Source Approval Bulletin. Figure 1; Made corrections to case outline M. Added thermal resistance ratings for all case outlines to paragraph 1.3 . sld 00-05-11 Raymond Monnin F Added case outline A. Updated drawing to current requirements of MIL-PRF-38534. -sld 03-02-21

3、Raymond Monnin G Added case outline B. Added note to paragraph 1.2.4. -sld 03-10-10 Raymond Monnin H Table I; For COE capacitance test, changed the maximum limit from 32 pF to 36 pF and for the CWE and CAD tests changed the maximum limit from 32 pF to 34 pF for the case outline N only. Updated drawi

4、ng to the current requirements. -sld 06-02-03 Raymond Monnin REV H H SHEET 35 36 REV H H H H H H H H H H H H H H H H H H H H SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV H H H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED

5、 BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Michael C. Jones COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Kendall A. Cottongim MICROCIRCUIT, HYBRID, MEMORY, FLASH ERASABLE/PROGRAMMABLE READ ONLY MEMORY, 512K x 32-BIT THIS DRAWING IS AVA

6、ILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 96-07-31 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 67268 5962-94612 SHEET 1 OF 36 DSCC FORM 2233 APR 97 5962-E251-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license

7、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94612 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of

8、 case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 94612 01 H A X Federal RHA Dev

9、ice Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and sha

10、ll be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time 01 F512K32-150 EPROM FLASH, 512K x 32-bit 150 ns 02 F512K32-120 EPROM FL

11、ASH, 512K x 32-bit 120 ns 03 F512K32-090 EPROM FLASH, 512K x 32-bit 90 ns 04 F512K32-070 EPROM FLASH, 512K x 32-bit 70 ns 05 F512K32-060 EPROM FLASH, 512K x 32-bit 60 ns 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All

12、levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This le

13、vel is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In

14、-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with ex

15、ception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality clas

16、s. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94612 DEFENSE SUPPLY CENTER CO

17、LUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style A See figure 1 68 Co-fired ceramic, single cavity, quad flatpack

18、B See figure 1 68 Co-fired ceramic, single cavity, quad flatpack M 1/ See figure 1 68 Co-fired ceramic, single/dual cavity, quad flatpack N See figure 1 68 Co-fired ceramic, single cavity, quad flatpack, low capacitance T See figure 1 68 Co-fired ceramic, single cavity, low profile,quad flatpack U S

19、ee figure 1 66 Co-fired ceramic, hex-in-line, single cavity, with standoffs X See figure 1 66 Co-fired ceramic, hex-in-line, single cavity, without standoffs Y See figure 1 68 Co-fired ceramic, single cavity, quad flatpack, with tie bars Z See figure 1 68 Co-fired ceramic, single cavity, ultra low p

20、rofile, quad flatpack 4 See figure 1 66 Co-fired ceramic, 1.075“, hex-in-line, single cavity, with standoffs 9 1/ See figure 1 68 Co-fired ceramic, single cavity, ultra low profile, quad flatpack 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings.

21、 2/ Supply voltage range (VCC) 3/ . -2.0 V dc to +7.0 V dc Signal voltage range (VG)(any pin except A9 ) 3/ -2.0 V dc to +7.0 V dc Power dissipation (PD) . 1.32 W Maximum at 5 MHz Thermal resistance, junction-to-case (JC): Case outlines A, M and Z. 10.2C/W Case outlines U and 4 10.63C/W Case outline

22、s X and Y . 6.5C/W Case outline N . 12.36C/W Case outline B and 9 4.57C/W Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds). +300C Data retention 10 years minimum Endurance (write/erase cycles) 10,000 cycles minimum A9 voltage for sector protect (VID) 4/. -2.0 V dc to

23、+14.0 V dc 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input low voltage range (VIL) -0.5 V dc to +0.8 V dc Input high voltage range (VIH) +2.0 V dc to VCC+ 0.5 V dc Case operating temperature range (TC). -55C to +125C A9 voltage for sector protect +11.5 V

24、 dc to +12.5 V dc 1/ Due to the short leads of case outlines M (single cavity) and case outline 9, caution should be taken if the system application is to be used where extreme thermal transitions can occur. Case outline A can be used if longer leads are necessary. 2/ Stresses above the absolute max

25、imum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ Minimum DC voltage on input or I/O pins is -0.5 V. During voltage transitions, input may overshoot VSSto -2.0 V for periods of up to 20 ns. Maximum DC vol

26、tage on output and I/O pins is VCC+ 0.5 V. During voltage transitions, outputs may overshoot to VCC+ 2.0 V for periods of up to 20 ns. 4/ Minimum DC input voltage on A9 pin is -0.5 V. During voltage transitions, A9 may overshoot VSSto -2.0 V for periods of up to 20 ns. Maximum DC input voltage on A9

27、 is +13.5 V which may overshoot to +14.0 V for periods of up to 20 ns. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94612 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 D

28、SCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the soli

29、citation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HA

30、NDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Bu

31、ilding 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific ex

32、emption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the devic

33、e manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In additi

34、on, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s)

35、. The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3. 3.2.4 Timing diagram(s). The timing diagram(s) shall be as

36、specified on figures 4, 5, and 6 . 3.2.5 Block diagram. The block diagram shall be as specified on figure 7. 3.2.6 Output load circuit. The output load circuit shall be as specified on figure 8. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance

37、 characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. Provided b

38、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94612 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 3.5 Programming procedure. The programming procedure shall b

39、e as specified by the manufacturer and shall be available upon request. 3.6 Marking of Device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.7 Da

40、ta. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data

41、should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.8 Certificate of compliance. A ce

42、rtificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.9 Certificate of conforma

43、nce. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. 3.10 Endurance. A reprogrammability test shall be completed as part of the vendors reliability monitors. This reprogrammability test shall be done for the initia

44、l characterization and after any design process changes which may affect the reprogrammability of the device. The methods and procedures may be vendor specific, but shall guarantee the number of program/erase cycles listed in section 1.3 herein over the full military temperature range. The vendors p

45、rocedure shall be kept under document control and shall be made available upon request of the acquiring or preparing activity. 3.11 Data retention. A data retention stress test shall be completed as part of the vendors reliability monitors. This test shall be done for initial characterization and af

46、ter any design process change which may affect data retention. The methods and procedures may be vendor specific, but shall guarantee the number of years listed in section 1.3 herein over the full military temperature range. The vendors procedure shall be kept under document control and shall be mad

47、e available upon request of the acquiring or preparing activity. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall no

48、t affect the form, fit, or function as described herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-94612 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions 1/ 2/ -55C TC+125C unless otherwise specified Group A subgroups Device types Min Max Unit DC parameters Input leakage current ILIV