DLA SMD-5962-93267 REV B-2002 MICROCIRCUIT LINEAR MICROPROCESSOR SUPERVISORY CIRCUIT MONOLITHIC SILICON《硅单片 微处理器监控电路 线性微型电路》.pdf

《DLA SMD-5962-93267 REV B-2002 MICROCIRCUIT LINEAR MICROPROCESSOR SUPERVISORY CIRCUIT MONOLITHIC SILICON《硅单片 微处理器监控电路 线性微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-93267 REV B-2002 MICROCIRCUIT LINEAR MICROPROCESSOR SUPERVISORY CIRCUIT MONOLITHIC SILICON《硅单片 微处理器监控电路 线性微型电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R244-94. 94-07-22 M. A. FRYE B Drawing updated to reflect current requirements. rrp 02-10-22 R. MONNIN REV SHET REV SHET REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED

2、 BY Sandra Rooney DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Sandra Rooney COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, MICROPROCESSOR SUPERVISORY CIRCUIT, MONOLITHIC SI

3、LICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-12-02 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-93267 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E004-03 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo

4、 reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93267 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels con

5、sisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the

6、 PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93267 01 M P X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device clas

7、ses Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA

8、device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 MAX705 Microprocessor supervisory circuit 02 MAX706 Microprocessor supervisory circuit 03 MAX707 Microprocessor supervisory circuit 04 MAX708 Microprocessor super

9、visory circuit 05 MAX813 Microprocessor supervisory circuit 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883

10、 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package st

11、yle P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted w

12、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93267 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.3 V dc to +6.0 V dc All other inputs -0.3 V dc to (VCC+

13、 0.3 V) 2/ Input current: VCC. +10 mA GND . +10 mA Output current (all outputs) . +10 mA Storage temperature range . -65C to +160C Power dissipation (PD) . 640 mW 3/ Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, juncti

14、on-to-ambient (JA) . +100C/W 1.4 Recommended operating conditions. Supply voltage (VCC) . 1.2 V dc to 5.5 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbook

15、s form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMEN

16、T OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of S

17、tandard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of pre

18、cedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute

19、 maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ The input voltage limits on PFI and MR can be exceeded if the input current is less than 10 mA. 3/ Derate linearly at 8 mW/C above TA= +70C.Provided b

20、y IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93267 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item r

21、equirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requi

22、rements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for devic

23、e classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and po

24、stirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requ

25、irements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103. For packages where marking o

26、f the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. M

27、arking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-3

28、8535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required

29、 from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q

30、and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A

31、 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38

32、535, appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the

33、 reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 105 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO

34、CIRCUIT DRAWING SIZE A 5962-93267 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit M

35、in Max Operating voltage range VCC1,2,3 All 1.2 5.5 V Supply current ICC1,2,3 All 500 A RESET AND WATCHDOG TIMER 01,03, 05 4.50 4.75 Reset threshold VRT1,2,3 02,04 4.25 4.50 V ISOURCE= 800 A VCC - 1.5 ISINK= 3.2 mA 0.4 Reset output voltage VRSTLISINK= 100 A, VCC= 1.2 V 1,2,3 01,02,03,04 0.3 V ISOURC

36、E= 800 A 03,04,05 VCC- 1.5 ISINK= 1.2 mA 03,04 0.4 ISOURCE= 4 A, VCC= 1.2 V 0.9 Reset output voltage VRSTHISINK= 3.2 mA 1,2,3 05 0.4 V WDI input threshold logic low WDIVILVCC= 5 V 1,2,3 01,02,05 0.8 V WDI input threshold logic high WDIVIHVCC= 5 V 1,2,3 01,02,05 3.5 V WDI = VCC150 WDI input current W

37、DIINWDI = 0 V 1,2,3 01,02,05 -150 A WDOVOHISOURCE= 800 A VCC - 1.5 WDO output voltage WDOVOLISINK= 1.2 mA 1,2,3 01,02,05 0.4 V Reset pulse width tRS9,10,11 All 140 280 ms Watchdog timeout period tWD9,10,11 01,02,05 1.0 2.25 s WDI pulse width tWPVIL= 0.4 V, VIH= (VCC)(0.8) V 9,10,11 01,02,05 50 ns MA

38、NUAL RESET MR pull-up current MRIPUMR = 0 V 1,2,3 All 100 600 A MR input threshold logic low MRVIL1,2,3 All 0.8 V MR input threshold logic high MRVIH1,2,3 All 2.0 V MR to reset out delay tMD3/ 9,10,11 All 250 ns MR pulse width tMR9,10,11 All 150 ns See footnotes at end of table. Provided by IHSNot f

39、or ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93267 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol

40、 Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max POWER FAIL DETECTOR PFI input threshold PFIVTHVCC= +5 V 1,2,3 All 1.20 1.30 V PFI input current PFIIN1,2,3 All -25 +25 nA ISOURCE= 800 A VCC -1.5 PFO output voltage PFOVOISINK= 3.2 mA 1,2,3 A

41、ll 0.4 V 1/ For device types 01, 03, and 05, VCC= +4.75 V to +5.5 V, unless otherwise specified and for device types 02 and 04, VCC= +4.5 V to +5.5 V, unless otherwise specified. 2/ The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used for th

42、ese limits. Negative current shall be defined as conventional current flow out of a device terminal. 3/ Applies to both RESET in device types 01 through 04 and RESET in device types 03 through 05. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and i

43、nspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in

44、accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with met

45、hod 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document

46、revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA= +125C, minimum. b. Interim an

47、d final electrical test parameters shall be as specified in table II herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93267 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHE

48、ET 7 DSCC FORM 2234 APR 97 NC = No connection FIGURE 1. Terminal connections. Device type 01,02 03,04 05 01,02 03,04 05 Case outline P 2 Terminal number Terminal symbol 1 MR MR MR NC NC NC 2 VCCVCCVCCMR MR MR 3 GND GND GND NC NC NC 4 PFI PFI PFI NC NC NC 5 PFO PFO PFO VCCVCCVCC6 WDI NC WDI NC NC NC 7 RESET RESET RESET GND GND GND 8 WDO RESET WDO NC NC NC 9 - - - NC NC NC 10 - - - PFI PFI PFI 11 - - - NC NC NC 12 - - - PFO PFO PFO 13 - - - NC NC NC 14 - - - NC NC NC 15 - - - WDI NC WDI 16 - - - NC NC NC 17 -