DLA SMD-5962-93253 REV D-2009 MICROCIRCUIT DIGITAL ADVANCED CMOS QUAD BUFFER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes to table I; added RHA data. Editorial changes throughout. 94-12-22 M. L. Poelking B Changes in accordance with NOR 5962-R372-97. 97-07-08 Monica L. Poelking C Incorporate revision B. Add device type 02. Add radiation features for device t

2、ype 01. Add case outline X. Add vendor CAGE number F8859. Update boilerplate to MIL-PRF-38535 requirements. LTG 02-07-10 Thomas M. Hess D Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 09-10-23 Thomas M. Hess REV SHET REV D D D D D D D D D SHEET 15 16 17 18 19 20 21 2

3、2 23 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thomas J. Ricciuti DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS

4、AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Thomas J. Ricciuti APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED CMOS, QUAD BUFFER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 94-06-06 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-93253 SHEET 1 OF

5、23 DSCC FORM 2233 APR 97 5962-E032-10 Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93253 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class level

6、s consisting of high reliability (device classes B, Q and M) and space application (device classes S and V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is r

7、eflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93253 01 M C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designato

8、r. Device classes B, S, Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-)

9、indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC125 Quad buffer with three-state outputs 02 54AC125 Quad buffer with three-state outputs 1.2.3 Device class designator. The device class d

10、esignator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A B, S, Q or V Cer

11、tification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack X CDFP3-F14 14 Flat

12、pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes B, S, Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93253 DEFENSE SUPPLY CENT

13、ER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+0.5 V dc DC input dio

14、de current (IIK) (VIN= -0.5 V to VCC+0.5 V) 20 mA DC output diode current (IOK) (VOUT= -0.5 V to VCC+0.5 V) 20 mA DC output current (IOUT) . 50 mA DC VCCor GND current (ICC, IGND) . 50 mA time the number of outputs Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500

15、 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ 4/ Supply voltage range (VCC) +3.0 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage ra

16、nge (VOUT) +0.0 V dc to VCCMaximum low level input voltage (VIL) . 0.90 V dc at VCC= 3.0 V dc 1.08 V dc at VCC= 3.6 V dc 1.35 V dc at VCC= 4.5 V dc 1.65 V dc at VCC= 5.5 V dc Minimum high level input voltage (VIH) 2.10 V dc at VCC= 3.0 V dc 2.52 V dc at VCC= 3.6 V dc 3.15 V dc at VCC= 4.5 V dc 3.85

17、V dc at VCC= 5.5 V dc Case operating temperature range (TC). -55C to +125C Input edge rate (V/t) minimum: (VINfrom 30% to 70% of VCC) . 125 mV/ns Maximum low level output current (IOL) 12 mA at VCC= 3.0 V and 3.6 V 24 mA at VCC= 4.5 V and 5.5 V Maximum high level output current (IOH) -12 mA at VCC=

18、3.0 V and 3.6 V -24 mA at VCC= 4.5 V and 5.5 V 1.5 Radiation features. Maximum total dose available (dose rate = 50 300 rads (Si)/s): Device type 01 100 Krads (Si) Single Event Latch-up (SEL) 100 MeV-cm2/mg 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Exten

19、ded operation at the maximum levels may degrade performance and affect reliability. The maximum junction temperature may be exceeded for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND.

20、 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back up systems. Data retention implies no input transitio

21、ns and no stored data loss with the following conditions: VIH 70 percent of VCC, VIL 30 percent of VCC, VOH 70 percent of VCCat 20 A, VOL 30 percent of VCCat 20 A. Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93253 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-39

22、90 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these document

23、s are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Compone

24、nt Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbi

25、ns Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. ELECTRONIC INDUSTRIES ALLIANC

26、E (EIA) JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXXX and 54/74ACTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). 2.3 Order of p

27、recedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item req

28、uirements. The individual item requirements for device classes B, S, Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as descr

29、ibed herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

30、 in MIL-PRF-38535 and herein for device classes B, S, Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Tru

31、th table. The truth table shall be as specified on figure 2. Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93253 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 3.2.4 Logic diagram. The logic diagram shall be as sp

32、ecified on figure 3. 3.2.5 Ground bounce waveforms and test circuit. The ground bounce waveforms and test circuit shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.2.7 Radiation exposure circui

33、t. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified

34、 herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The el

35、ectrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

36、has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes B, S, Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.

37、3.5.1 Certification/compliance mark. The certification mark for device classes B, S, Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes B, S, Q

38、 and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of s

39、upply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes B, S, Q and V, the requirements of MIL-PRF-38535 and herein or for devi

40、ce class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes B, S, Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits deliver

41、ed to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For de

42、vice class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Devic

43、e class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A). Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93253 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 9

44、7 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions -55C TC+125C 2/ 3/ 3.0 V VCC 5.5 V unless otherwise specified Device type 4/ and device class VCCGroup A subgroups Limits 5/ Unit Min Max High level output voltage 3006 VOH16/ For all inputs

45、 affecting output under test VIN= VIHor VILFor all other inputs VIN= VCCor GND IOH= -50 A All All 3.0 V 1, 2, 3 2.9 V VOH26/ All All 4.5 V 1, 2, 3 4.4 VOH37/ 8/ For all inputs affecting output under test VIN= VIHor VILFor all other inputs VIN= VCCor GND IOH= -50 A All All 5.5 V 1, 2, 3 5.4 V M 01 B,

46、 S, Q, V 1 5.4 D 5.4P, L, R 5.4 VOH46/ For all inputs affecting output under test VIN= VIHor VILFor all other inputs VIN= VCCor GND IOH= -12 mA All All 3.0 V 1, 2, 3 2.4 V VOH57/ 8/ For all inputs affecting output under test VIN= VIHor VILFor all other inputs VIN= VCCor GND IOH= -24 mA All All 4.5 V

47、 1, 2, 3 3.7 V M 01 B, S, Q, V 1 3.7 D 3.7P, L, R 3.7 VOH66/ For all inputs affecting output under test VIN= VIHor VILFor all other inputs VIN= VCCor GND IOH= -24 mA All All 5.5 V 1, 2, 3 4.7 V VOH77/ 8/ 9/ For all inputs affecting output under test VIN= VIHor VILFor all other inputs VIN= VCCor GND

48、IOH= -50 mA All All 5.5 V 1, 2, 3 3.85 V M 01 B, S, Q, V 1 3.85 D 3.85P, L, R 3.85 See footnotes at end of table. Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93253 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions -55C TC+125C 2/ 3/ 3.0 V VCC 5.5 V unless otherwise specified Device type 4/ and device class VCCGroup A subgroups L