DLA SMD-5962-93228 REV B-2005 MICROCIRCUIT DIGITAL CMOS TEST BUS CONTROLLER MONOLITHIC SILICON《硅单片 测试总线收发器 氧化物半导体数字微型电路》.pdf
《DLA SMD-5962-93228 REV B-2005 MICROCIRCUIT DIGITAL CMOS TEST BUS CONTROLLER MONOLITHIC SILICON《硅单片 测试总线收发器 氧化物半导体数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-93228 REV B-2005 MICROCIRCUIT DIGITAL CMOS TEST BUS CONTROLLER MONOLITHIC SILICON《硅单片 测试总线收发器 氧化物半导体数字微型电路》.pdf(18页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R281-94 94-10-07 Monica L. Poelking B Update boilerplate to MIL-PRF-38535 requirements. Update figure 4 waveforms and notes. - CFS 05-05-09 Thomas M. Hess REV SHET REV B B B SHEET 15 16 17 REV STATUS REV B B B
2、B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED Thomas M. Hess DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas M. Hess COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVE
3、D BY Monica L. Poelking MICROCIRCUIT, DIGITAL, CMOS, TEST BUS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-10-18 CONTROLLER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-93228 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E307-05 Provided by IHSNot for Re
4、saleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class leve
5、ls consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected i
6、n the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93228 01 M X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device
7、 classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non
8、-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT8990 Test bus controller 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follow
9、s: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outlin
10、e(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 68 Ceramic quad flat pack Y CMGA15-P69 69 Pin grid array 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535
11、, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maxi
12、mum ratings. 1/ Supply voltage range (VCC) -0.5 V to 7.0 V dc Input voltage range -0.5 V dc to VCCOutput voltage range -0.5 V dc to VCCInput clamp current 20 mA Output clamp current 20 mA Continuous output current 25 mA Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds)
13、. +300C Thermal resistance, junction-to-case (JC): Case outline X 1.856C/W Case outline Y See MIL-STD-1835 Power dissipation (PD) 980 mW 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V VCC 5.5 V High level input voltage (VIH) 2 V minimum Low level input voltage (VIL) . 0.8 V m
14、aximum Input voltage (VIN) 0 V to VCCOutput voltage (VOUT). 0 V to VCCHigh level output current (IOH) -8 mA Low level output current (IOL) 8 mA Ambient operating temperature range (TA). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specif
15、ication, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Spe
16、cification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings
17、. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent
18、 damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93228 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O
19、HIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents which are DOD adopted are those listed in the issue of the DOD
20、ISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents cited in the solicitation. INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS (IEEE) IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Arch
21、itecture. (Applications for copies should be addressed to the Institute of Electrical and Electronics Engineers, 445 Hoes Lane, Piscataway, NJ 08854-4150.) (Non-Government standards and other publications are normally available from the organizations that prepare or distribute the documents. These d
22、ocuments may also be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes appl
23、icable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Managemen
24、t (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction,
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