DLA SMD-5962-93227 REV E-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL BUFFER DRIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

《DLA SMD-5962-93227 REV E-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL BUFFER DRIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-93227 REV E-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL BUFFER DRIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf（19页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes IAW NOR 5962-R189-94. tvn 94-05-24 Monica L. Poelking B Changes IAW NOR 5962-R260-94. jak 95-08-16 Monica L. Poelking C Changes IAW NOR 5962-R067-96. jak 96-04-26 Monica L. Poelking D Update boilerplate to MIL-PRF-38535. Add note to parag

2、raph 1.4. jak 00-12-06 Thomas M. Hess E Update the boilerplate paragraphs to current requirements as specified in MIL-PRF-38535. - jak 09-04-08 Thomas M. Hess REV SHEET REV E E E E SHEET 15 16 17 18 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A

3、PREPARED BY Joseph A. Kerby STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL

4、 BUFFER/DRIVER WITH THREE-STATE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-03-30 OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-93227 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E237-09 Provided by IHSNot for ResaleNo rep

5、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93227 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consist

6、ing of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.

7、 1.2 PIN. The PIN is as shown in the following example: 5962 - 93227 01 Q R A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes

8、 Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA dev

9、ice. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABT241 Octal buffer/driver with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifyin

10、g the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

11、 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. Th

12、e lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93227 DEFENSE SUPPLY CENTER COLUMBUS

13、COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to +5.5 V dc 4/ DC input clamp current (

14、IIK) (VIN 0.0 V). -18 mA DC output clamp current (IOK) (VOUT 0.0 V). -50 mA DC output current (IOL) (per output). +96 mA Storage temperature range (TSTG). -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (

15、TJ) +175C Maximum power dissipation (PD) . 500 mW 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCC Maximum low level input voltage (VIL) +0.8 V Minimum high level i

16、nput voltage (VIH). +2.0 V Case operating temperature range (TC). -55C to +125C Maximum input rise and fall rate (t/V) 5 ns/V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) +48 mA _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the

17、 device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C.

18、 4/ The input and output negative voltage ratings may be exceeded provided that the input and output clamp current ratings are observed. 5/ Unused inputs must be held high or low to prevent them from floating. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

19、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93227 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

20、 part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE ST

21、ANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are availab

22、le online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise

23、 specified, the issues of these documents are those cited in the solicitation or contract. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Q

24、uality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Desig

25、n, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.

26、4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce test circuit and waveforms. The ground

27、 bounce test circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MIC

28、ROCIRCUIT DRAWING SIZE A 5962-93227 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics a

29、nd postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table

30、 I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the devi

31、ce. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark

32、 for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

33、listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance

34、 submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Cer

35、tificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. .8 Notification of change for device class M. For device class

36、M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to rev

37、iew the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 126

38、See MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93227 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrica

39、l performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified Device type VCCGroup A subgroups Limits 3/ Unit Min Max High level output voltage 3006 VOH1For all inputs affecting output under test VIH= 2.0 V or VI

40、L= 0.8 V IOH= -3 mA All 4.5 V 1, 2, 3 2.5 V VOH2For all inputs affecting output under test VIH= 2.0 V or VIL= 0.8 V IOH= -3 mA All 5.0 V 1, 2, 3 3.0 VOH3For all inputs affecting output under test VIH= 2.0 V or VIL= 0.8 V IOH= -24 mA All 4.5 V 1, 2, 3 2.0 Low level output voltage 3007 VOLFor all inpu

41、ts affecting output under test VIH= 2.0 V or VIL= 0.8 V IOL= 48 mA All 4.5 V 1, 2, 3 0.55 V Three-state output leakage current high 3021 IOZH4/ 5/ For control inputs affecting output under test, VIN= VIHor VIL VIH= 2.0 V VIL= 0.8 V VOUT= 2.7 V All 5.5 V 1, 2, 3 10.0 A Three-state output leakage curr

42、ent low 3020 IOZL4/ 5/ For control inputs affecting output under test, VIN= VIHor VIL VIH= 2.0 V VIL= 0.8 V VOUT= 0.5 V All 5.5 V 1, 2, 3 -10.0 A Negative input clamp voltage 3022 VIC-For input under test IIN= -18 mA All 4.5 V 1, 2, 3 -1.2 V Off-state leakage current IOFFFor output under test VINor

43、VOUT= 4.5 V All other pins at 0.0 V All 0.0 V 1 100.0 A High-state leakage current ICEXFor output under test VOUT= 5.5 V Outputs at high logic state All 5.5 V 1, 2, 3 50.0 A Input current high 3010 IIHFor input under test VIN= VCCAll 5.5 V 1, 2, 3 +2.0 A Input current low 3009 IILFor input under tes

44、t VIN= GND All 5.5 V 1, 2, 3 -2.0 A Output current 3011 IOUT 6/ VOUT= 2.5 V All 5.5 V 1, 2, 3 -50.0 -180.0 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93227 DEFENSE SUPPL

45、Y CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C 4.5 V VCC 5.5 V unless otherwise specified Device type VCCGroup A subgro

46、ups Limits 3/ Unit Min Max Data inputs, outputs enabled All 5.5 V 1, 2, 3 2.5 mA Data inputs, outputs disabled All 5.5 V 1, 2, 3 50 A Quiescent supply current delta, TTL input levels 3005 ICC7/ For input under test, VIN= 3.4 V For all other inputs VIN= VCCor GND Control inputs All 5.5 V 1, 2, 3 2.5

47、mA Quiescent supply current, output high 3005 ICCHVIN= VCCor GND IOUT= 0.0 A All 5.5 V 1, 2, 3 250.0 A Quiescent supply current, output low 3005 ICCLVIN= VCCor GND IOUT= 0.0 A All 5.5 V 1, 2, 3 30.0 mA Quiescent supply current, output three-state 3005 ICCZVIN= VCCor GND IOUT= 0.0 A All 5.5 V 1, 2, 3

48、 250.0 A Input capacitance CINSee 4.4.1c TC= +25C 3012 All 5.0 V 4 10.0 pF Output capacitance COUTSee 4.4.1c TC= +25C 3012 All 5.0 V 4 16.0 pF Low level ground bounce VOLPnoise 8/ All 5.0 V 4 800 mV Low level ground bounce VOLVnoise 8/ All 5.0 V 4 -1350 mV High level VCCbounce noise VOHP8/ All 5.0 V 4 1500 mV High level VCCbounce noise VOHV/ VIH= 3.0 V VIL= 0.0 V TA= +25C See figure 4 See 4.4.1d All 5.0 V 4 -780 mV Functional test 9/ VIL= 0.8 V VIH= 2.0 V All 4.5 V 7, 8 L H 3014 Verify output VOUT See 4.4.1b All 5.5 V 7, 8 L H See footnot