DLA SMD-5962-93215 REV A-2004 MICROCIRCUIT LINEAR STEPPER MOTOR DRIVER CIRCUIT MONOLITHIC SILICON《硅单片 步进电动机驱动器电路 线性微型电路》.pdf

《DLA SMD-5962-93215 REV A-2004 MICROCIRCUIT LINEAR STEPPER MOTOR DRIVER CIRCUIT MONOLITHIC SILICON《硅单片 步进电动机驱动器电路 线性微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-93215 REV A-2004 MICROCIRCUIT LINEAR STEPPER MOTOR DRIVER CIRCUIT MONOLITHIC SILICON《硅单片 步进电动机驱动器电路 线性微型电路》.pdf（13页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. Drawing updated to reflect current requirements. - gt 04-02-06 Raymond Monnin REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 P

2、MIC N/A PREPARED BY Sandra B. Rooney DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Sandra B. Rooney COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING

3、 APPROVAL DATE 93-10-22 MICROCIRCUIT, LINEAR, STEPPER MOTOR DRIVER CIRCUIT, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-93215 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E092-04 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHS

4、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93215 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance

5、class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are

6、reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93215 01 Q E X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designa

7、tor. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indi

8、cates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1517 Stepper motor driver 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as

9、 follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case

10、 outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q an

11、d V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93215 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR

12、97 1.3 Absolute maximum ratings. 1/ Second level supply, VSS+40 V Phase output supply, VMM. +40 V Logic supply, VCC+7 V Logic input voltage, VIN. -3 V to +7 V Logic input current, IIN. 10 mA Output current, each phase, IPHASE. +500 mA Output current, emitter follower, ISECOND. -500 mA Maximum power

13、dissipation, PD: 2/ Case outline E . 1 W Case outline 2 . 1.75 W Junction temperature, TJ+150C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case outline E . 110C/W Case outline 2 . 70C/W Storage temperature range -55C to +150C 1.4 Recomme

14、nded operating conditions. Supply voltage range, VCC+4.75 V dc to +5.25 V dc Second level supply range, VSS+10 V dc to +40 V dc Operating temperature range . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and hand

15、books form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPAR

16、TMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List

17、of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ Stresses

18、above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ For E package, derate 9 mW/C above 25C. For 2 package, derate 14 mW/C above 25C. Provided by IHSNot for ResaleNo reproduction or net

19、working permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93215 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the referenc

20、es cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in acco

21、rdance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with

22、MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and here

23、in for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagrams. The block diagrams shall be as specified on figure 2. 3.3 Electrical performance c

24、haracteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. T

25、he electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103. For p

26、ackages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordanc

27、e with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML” or “Q” as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ a

28、s required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compl

29、iance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets

30、, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MI

31、L-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change a

32、s defined in MIL-PRF-38535, appendix A. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onsho

33、re at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 53 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

34、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93215 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C VCC= +5 V, VSS= +20 V Group A subgroups Device type Li

35、mits Unit unless otherwise specified Min Max Logic supply current ICCVINH= 0.4 V 1,2,3 01 60 mA Input low voltage VINLDIR, STEP, HSM ,and INH terminals 1,2,3 01 0.8 V Input high voltage VINHDIR, STEP, HSM ,and INH terminals 1,2,3 01 2.0 V Input low current IINLDIR, STEP, HSM ,and INH terminals, VIN=

36、 0 V 1,2,3 01 -400 A Input high current IINHDIR, STEP, HSM ,and INH terminals, VIN= 5 V 1,2,3 01 20 A Phase output saturation voltage VOSATPB2, PB1, PA1, and PA2terminals, IPHASE= 350 mA 1,2,3 01 0.85 V Phase output leakage current IOPLPB2, PB1, PA1, and PA2terminals, VMM= 39 V 1,2,3 01 500 A Follow

37、er saturation voltage to VSSVFSATLAand LBterminals IPHASE= 350 mA 1,2,3 01 -2 V Follower leakage current IFLLAand LBterminals VIN= 0 V 1,2,3 01 500 A Output low voltage, A, BVOLB and Aterminals, IOL= 1.06 mA 1,2,3 01 0.4 V Second-level on time tONLAand LBterminals see figure 3 9,10,11 01 275 375 s L

38、ogic input setup time tSDIR and HSM terminals See figure 4 9,10,11 01 400 ns Logic input hold time tHDIR and HSM terminals See figure 4 9,10,11 01 0 ns STEP pulse width tPSTEP terminal see figure 4 9,10,11 01 800 ns Timing resistor value RTRC terminal 4,5,6 01 1 100 k Timing Capacitor CTRC terminal

39、4,5,6 01 0.1 500 nF Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93215 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outline E

40、2 Terminal number Terminal connection 1 PB2NC 2 PB1PB23 GND PB14 PA1GND 5 PA2PA16 DIR NC 7 STEP PA28 BDIR 9 ASTEP 10 HSM B11 INH NC 12 RC A13 LAHSM 14 LBINH 15 VSSRC 16 VCCNC 17 - LA18 - LB19 - VSS20 - VCCNC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction

41、 or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93215 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Block diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted

42、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93215 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. Pin numbers apply to the E package. FIGURE 3. Second-level on time test circuit. Provided by IHSNot for Resal

43、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93215 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 FIGURE 4. Timing waveforms. Provided by IHSNot for ResaleNo reproduction or ne

44、tworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93215 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL A SHEET 10 DSCC FORM 2234 APR 97 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling a

45、nd inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be

46、 in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with

47、 method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, D, or E. The test circuit shall be maintained by the manufacturer under d

48、ocument revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature