DLA SMD-5962-93025-1996 MICROCIRCUIT DIGITAL FAST CMOS OCTAL NONINVERTING TRANSPARENT LATCH WITH CURRENT LIMITING RESISTORS AND THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS AND LIMITE.pdf

《DLA SMD-5962-93025-1996 MICROCIRCUIT DIGITAL FAST CMOS OCTAL NONINVERTING TRANSPARENT LATCH WITH CURRENT LIMITING RESISTORS AND THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS AND LIMITE.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-93025-1996 MICROCIRCUIT DIGITAL FAST CMOS OCTAL NONINVERTING TRANSPARENT LATCH WITH CURRENT LIMITING RESISTORS AND THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS AND LIMITE.pdf（18页珍藏版）》请在麦多课文档分享上搜索。

1、SMD-5962-93025 9999996 O084433 8T7 U LTR DESCRIPTION DATE (Y R-MO-DA) APPROVED PMIC NIA REV SHEET REV SHEET STANDARD MICROCIRCUIT DRAWING 15 16 17 THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 96-01

2、 -06 REVISION LEVEL AMSC NIA NONINVERTING TRANSPARENT LATCH WITH OUTPUTS, TTL COMPATIBLE INPUTS AND LIMITEC OUTPUT VOLTAGE SWING, MONOLITHIC SILICON CURRENT LIMITING RESISTORS AND THREE-STAT1 SIZE CAGE CODE A 67268 5962-93025 DESC FORM 193 JUL 94 PREPARED BY Thanh V. Nguyen DEFENSE ELECTRONICS SUPPL

3、Y CENTER DAYTON, OHIO 45444 CHECKED BY Thanh V. Nguyen I MICROCIRCUIT, DIGITAL, FAST CMOS, OCTAL I 1 SHEET 1 OF 17 5962-E261-96 DISTRIBUTION STATEMENT A Approved for public release; distribution is unlimited Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH

4、S-,-,-SflD-5962-93025 W 9999996 0084432 733 D STAN DARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1. SCOPE 1.1 m. I _ This drawing forms a part of a one part - one part mniber docmentation system (see 6.6 herein). Two product assurance classes consisting of military h

5、igh reliability (device classes P and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or identifying Nunber (PIN). 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-83 in conjunction with compliant non-JAN

6、devices88. available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. Device class M microcircuits represent non-JAN class B microcircuits in accordance with Wen I 1.2 m. The PIN shall be as shown in the following exanple: Federal RHA 93025_ 1 Device 1 Device 1 Case 4

7、. Lead Il stock class designator type c 1 ass outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) LA (see 1.2.3) V Drawing nunber 1.2.1 BtlB desianatoc . Device class M RHA marked devices shall meet the MIL-1-38535 appendix A specified RHA levels and shall be marked

8、with the appropriate RHA designator. MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. non-RHA device. Device classes Q and V RHA marked devices shaL1 met the A dash (-) indicates a 1.2.2 Device tmem . The device type(s) shall identify the circuit function as

9、follous: Revice tm ircuit function o1 54FCT2373T Octal noninverting transparent latch with current limiting resistors and three-state outputs, TTL compatible inputs and limited output voltage suing 02 54FCT23nAT Octal noninverting transparent latch with current limiting resistors and three-state out

10、puts, TTL compatible inputs and limited output voltage suing 03 54FCT2373CT Octal noninverting transparent latch with current limiting resistors and three-state outputs, TTL compatible inputs and limited output voltage suing 1.2.3 Device class desisnator . The device class designator shall be a sing

11、le letter identifying the product assurance level as follous: Device class I Device rwui r-rlfS99cwntatioii SIZE 5962-93025 A REVISION LEVEL SHEET 2 “ Vendor self-certic- CO the requirements for non-JAN class B microci ,ts in accordance with 1.2.1 of MIL-STD-883 P or V Certification and qualificatio

12、n to MlC-1-38535 1.2.4 outLiu . The case outline(s1 shall be as designated in MIL-STD-1835, and as follows: DescriDtive desisnu v R S 2 GDIP1-120 or CDIP2-TZO 20 Dual-in-line GDFP2-F2O or CDFP3-F20 20 Flat pack CPCC1 -N2O 20 Leadless chip carrier 1.2.5 Lead finish . The lead finish shall be as speci

13、fied in MIL-STD-883 (see 3.1 herein) for class M or MIL-1-38535 for classes P and V. Finish letter 88X81 shalt not be marked on the microcircuit or its packaging. The 18X81 I designation is for use in specifications when lead finishes A, 8, and C are considered acceptable and interchangeable Provide

14、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-93025 999999b 0084433 b7T 1.3 - ua3J Supply voltage range (V 1 -0.5 V dc to +7.0 V dc DC input voltage range IN) . -0.5 V dc to Vcc + 0.5 V dc DC output voltage range (V ) -0.5 V dc to Vcc + 0.5 V dc

15、$/ DC input claw current (I ?(VIN = -0.5 V ) . -20 mA t2O mA DC output source current (pK 1 (per output) . -30 mA OC output sink current (I,?“ (per output) +70 mA DC V current (Icc) . 1260 mA GrA current (IcND) +550 mA Storage tenperature range (T . -65.C to +150*C Lead temperature (soldering, secon

16、ds) . +300C Thermal resistance, junction-to-case (eJc) . See MIL-STD-1835 Junction tenperature (TJ) +175C nerximm power dissipation (Po) 500 inU OC output clemp current (1 1 (VwT = -0.5 V and +7.0 VI . Case tenperature under bias fAs) . -65C to +135“C - au 1.4 Supply voltage range (Vc 1 +4.5 V dc to

17、 +5.5 V dc Input voltage range (VIN$ +O.O V dc to Vcc Output voltage range (VwT) . +O.O V dc to Vcc Maximm low level input voltage (VIL) 0.8 V Minim high level input voltage (VI ) 2.0 V Case operating temperature range (T,! -55C to +125C Maximm input rise or fall rate (At/AV): 5 ns/V Maxim high leve

18、l output current (Io ) . -12 mA 12 nd (from VIN = 0.3 V to 2.7 V, 2.7 V to 0.3 V) Maximm low level output current (IoL! 1.5 pisital 1Mc testim for device classes Q and y. Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) XX percent 5/ 2. APPLICABLE DOCWENTS 2.1

19、-ds. wetin. and handbook . . Unless otheruise specified, the following specification, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specif

20、ied herein. SPECIFICATION MI CI TARY MIL-1-38535 - Integrated Circuits, Manufacturing, General Specification for. 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. maxim Levels may degrade performance and affect reliability. Extended operation at the u Unless ot

21、herwise noted, all voltages are referenced to GND. z/ The limits for the parameters specified herein shall apply over the full specified Vcc range and case temperature range of -55C to +125“C. For Vcc 2 6.5 V, the upper limit on the range is limited to 7.0 V. Values will be added when they become av

22、aitable. 4./ 5/ - SIZE STANDARD A 5962-93025 MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET 3 DISC FORM 193A JUlQ4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-93025 9999996 0084434 506 SIZE

23、 A STAN DARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL STANDARDS 5962-93025 SHEET 4 MI LI TARY MI L-STD-883 - Test Methods and Procedures for Microelectronics. MIL -STD -973 - Configuration Management. MIL-STD-1835 - Microcircuit Case Outlines BULLETIN

24、MILI TARY MIL-BUL-103 - List of Standardized Military Drawings (SMDIS). HANDBOOK Mi LI TARY DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-9302S b 0084435 442 . 3.6 Certificate of wliancq For device class M, a certific

25、ate of conpliance shall be required frm a _. manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.2 herein). classes P and V, a certificate of conpliance shall be required from a PMC-38535 listed manufacturer in order to supply to the requirements of this drawin

26、g (see 6.7.1 herein). listing as an approved source of swly for this drawing shall affirm that the manufacturers product meets, for device class M the requirements of MIL-STD-883 (see 3.1 herein), or for device classes P and V, the requirements of MIL-1-38535 and the requirements herein. For device

27、The certificate of conpliance submitted to DESC-EC prior to . 3.7 Certificate of confor- A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein) or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing

28、. (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973. 3.8 mtificamn of we for device cw . 3.9 skew between any two switching inputs signals (tsk): includes a 47 pF chip capacitor (-0 percent, +20 percent) and at least 3 pF of equivalent c

29、apacitance from tke test jig and probe. termination shall be the 50n characteristic irrpedance of the coaxial connector to the oscilloscope. a. b. For monitored outputs, the 50n For input signal generators incapabte of maintaining these values of tr and tf, the i 250 ps. FIGURE 4. Ground bounce load

30、 circuit and waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-5962-93025 99999b 008441.13 517 W STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICSSUPPLYCENTER DAYTON, OHIO 45444 SIZE A 5962-93025 REVISION LEVEL SHEET 13 3.0 1.5 v 2.7 V

31、t 0.0 voq3 4- t - - PLZ PZL OUTPUT ENABLE CONTROL INPUT OUTPUT + 0.3 V “OH VOH - 0.3 V OUTPUT 1.5 v CNO FIGURE 5. Cuitchina uaveforms and test circuit. DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-J 1 - UNDER v,T - - DEVICE T

32、 - TEST f 0 RL SIZE A STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 5962-93025 REVISION LEVEL SHEET 14 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SflD-5962-930Z5 9999996 0084445 391 STANDARD MICROCIRCUIT DRAW

33、ING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 4W 4.4 Gotlfo- . Ouality conformance inspection for device class H shall be in accordance uith MIL-STD-883 (see 3.1 herein) and as specified herein. Inspections to be performed for device class H shall be those specified in method 5005 of MIL-STD-88

34、3 and herein for groups A, 6, c, D, and E inspections (see 4.4.1 through 4.4.4). Technology conformance inspection for classes P and V shall be in accordance uith MIL-1-38535 including groups A, E, C, D, and E inspections and as specified herein except where option 2 of MIL-1-38535 permits alternate

35、 in-line control test i ng . 4.4.1 A m. a. b. C Tests shall be as specified in table II herein. afyect capacitance. CI, and Cou shall be measured between the designated terminal and GND at a frequency of 1 MHz. For CI” and COUT, test ali applicable pins on five devices with zero failures. shell acco

36、rdance with table I herein. C a3conditions specified herein. guaranteed, if not tested, to the limits and conditions specified in table I herein. shall submit to DESC-EC the device functions listed in each functional group and the test results for each device tested. For device class H, subgroups 7

37、and 8 tests shall be sufficient to verify the truth table in figure 2 herein. The test vectors used to verify the truth table shall, at a minim, test all functions of each input and output. All possible input to output logic patterns per function shall be guaranteed, if not tested, to the truth tabl

38、e in figure 2 herein. For device classes O and V, subgroups 7 and 8 shall include verifying the functionality of the device; these tests shall have been fault graded in accordance with MIL-STD-883, test method 5012 (see 1.5 herein). initial qual%ication, after process or design changes which may aff

39、ect the performance of the device, and any changes to the test fixture. V device. outputs. Test 5 devices assembled in the uorst case package type supplied to this docunent. tested, to the limits established for the worst case package. determined by the menufacturer. measured peak values for each de

40、vice tested and detailed oscilloscope plots for each VoLp,.Vo ”, VOHp, and VRHv from one sanple part per function. The plot shall contain the waveforms of both a suitcking output and t e output under test. Each device manufacturer shall test product on the fixtures they currently use. When a new fix

41、ture is used, the device manufacturer shall inform DESC-EC of this change and test the 5 devices on both the new and old test fixtures. The device manufacturer shall then submit to DESC-EC data from testing on both fixtures that shall include all measured peak values for each device tested and detai

42、led oscilloscope plots for each VoLp, VOLV. VOHP, and VOHV from one sample part per function. switching output and the output under test. For VoLp, VOLV. Vo p, and VOHV, a device manufacturer may qualify devices by functional groups. functional group sttall be conposed of function types, that by des

43、ign, will yield the same test values when tested in accordance uith table I herein. VoLp, VOLV. V and VOHV tests. group to the Pirnits and conditions specified herein. group shall be guaranteed, if not tested, to the limits and conditions specified in table i herein. The device manufacturer shall su

44、bmit to DESC-EC the device functions listed in each functional group and the test results, along with the oscilloscope plots, for each device tested. and CgJT shall be measured only for initial qualification and after process or design changes which my a device manufacturer may qualify devices by fu

45、nctional groups. A specific functional group ccmposed of function types, that by design, will yield the same capacitance values when tested in The device manufacturer shall set a functional group limit for the CI and tests, lhe device manufacturer may then test one device function from a functional

46、group to the !itnits All other device functions in that particular functional group shall be The device manufacturer c. d. Ground and V bounce tests are required for all device classes. These tests shall be performed only for VOL”, VOHp, and VOHV shall be measured for the worst case outputs of the A

47、ll other outputs shelfL& guaranteed, if not tested, to the limits established for the WrSt case All other package types shall be guaranteed, if not The device manufacturer will submit to DESC-EC data that shall include all The worst case outputs tested are to be determined by the manufacturer. lhe p

48、ackage type to be tested shall be The plot shall contain the waveforms of both a A specific The device manufacturer shall set a functional group limit for the The device manufacturer may then test one device function from a functional All other device functions in that particular functional 4.4.2 Cr

49、ow C inswction. The group C inspection end-point electrical parameters shall be as specified in table II herein. SIZE A 5962-93025 SHEET REVISION LEVEL 15 4.4.2.1 Additional cr iteria for de vice class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under docunent revision level co