DLA SMD-5962-92106-1993 MICROCIRCUIT DIGITAL CMOS ADDRESS PROCESSOR 2 MONOLITHIC SILICON《硅单块 地址处理器2 互补金属氧化物半导体 数字微型电路》.pdf

《DLA SMD-5962-92106-1993 MICROCIRCUIT DIGITAL CMOS ADDRESS PROCESSOR 2 MONOLITHIC SILICON《硅单块 地址处理器2 互补金属氧化物半导体 数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-92106-1993 MICROCIRCUIT DIGITAL CMOS ADDRESS PROCESSOR 2 MONOLITHIC SILICON《硅单块 地址处理器2 互补金属氧化物半导体 数字微型电路》.pdf（41页珍藏版）》请在麦多课文档分享上搜索。

1、DESCRIPTION LTR SHEET SHEET DATE (YR-MO-DA) APPROVED REV STATUS OF SHEETS SIZE A PMIC N/A STAIUDARDI ZED MILITARY DRAWIMG CAGE CODE 5962-92106 67268 THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A ESC FORM 193 JUL 91 *- SHEET - PREPARED BY Phu

2、H Nguyen CHECKED BY Tim H Noh APPROVED BY Monica L Poelking DRAWING APPROVAL DATE 93-03-1 7 REVISION LEVEL DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 MICROCIRCUIT, DIGITAL, CMOS, ADDRESS PROCESSOR 2, MONOLITHIC SILICON 5962-E612-92 DISTRIBUTION STATEMENT A. Approved for public release; dis

3、tribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SflD-Sb2-92LUb b 0038937 = 1.1 Scope. This drawing forms a part of a one part - one part number documentation system bee 6.6 herein). Two product assurance classes consisting of

4、military high reliability (device classes 8, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class H microcircuits represent non-JAN class E microcircuits in acco

5、rdance with 1.2.1 of MIL-STD-883, “Provisions for the use of RIL-STD-883 in conjunction with compliant non-JAN devices“. When , available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 m. The PIN shall be as shown in the following example: X - 2 - o1 V I I I l I

6、 I 5962 H 92106 - I I I I I I I Lead Case Devi ce Devi ce II Federal RHA stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes H, E, and S RHA inarked devices shall me

7、et the MIL-H-38510 specified RHA levels and shall be marked with the appropriate RHA designator. the HIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. non-RHA device. Device classes Q and V RHA marked devices shall meet A dash (-1 indicates a 1.2.2 Device type

8、Cs). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function o1 AP2 Address processor 2 assurance Level as follows: 1.2.3 Device class desiqnator. The device class designator shall be a single letter identifying the product 1. SCOPE STANDARDIZED

9、 SIZE MILITARY DRAWING h DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL 5962-92106 SHEET 2 Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of HIL-STD-883 B or S Q or V Certi

10、fication and qualification to MIL-M-38510 Certification and qualification to HIL-1-38535 1.2.4 Case outline(s). The case outline(s) shall be as designated in HIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style 2 See figure 1 220 Ceramic, unformed-lead, chip car

11、rier 1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, E, and S or MIL-1-38535 for classes Q and V. Finish letter “X“ shall not be marked on the microcircuit or its packaging. for use in specifications when lead finishes A, E, and C are considered acceptable and

12、interchangeable without preference. The “X“ designation is DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5b2-92LOb m b 0038938 824 m STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1.3 Ab

13、solute maximum ratings. I/ SIZE 5962-92106 A REVISION LEVEL SHEET 3 Supply voltage range (V ) . DC input voltage range NIN) DC output voltage range (VRUT) . Output voltage applied to igh Z state . Maximum power dissipation (PD) . Storage temperature range . Lead temperature (soldering, 10 sec) Therm

14、al resistance, junction-to-case (QJc) . Maximum junction temperature (TJ) -0.5 V dc to +7.0 V dc -0.5 V dc to VDD + 0.5 V dc -0.5 V dc to VDD + 0.5 V dc -0.5 V dc to VDD + 0.5 V dc 2.030 W -65OC to +15OoC +250C 4OC/U +175OC 1.4 Recommended operatins conditions. Supply voltage range (VDDI . Supply vo

15、ltage (Vss) 0.0 V dc High Level input voltage range (VI 1 4.5 V dc minimum to 5.5 V dc maximum 2.2 V dc to V + 0.5 V de LOW level input voltage range (vI Y Case operating temperature range 1) . -55OC to +125C -0.5 v dc to 808 v dc 1.5 Digital Loqic testing for device classes Q and V. Fault coverage

16、measurement of manufacturing logic tests (MIL-STD-883, test method 5ffl2) 98.80 percent 2. APPLICABLE DOCUMENTS 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that is

17、sue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MIL-M-38510 - Microcircuits, General Specification for. MIL-1-38535 - Integrated Circuits, Manufacturing, General

18、Specification for. STANDARDS MILITARY MIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers. MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-1835 - Microcircuit Case Outlines. BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SM

19、DIS). HANDBOOK MILITARY MIL-HDBK-780 - Standardized Military Drawings. - - 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. maximum levels may degrade performance and affect reliability. Extended operation at the Provided by IHSNot for ResaleNo reproduction or

20、networking permitted without license from IHS-,-,-SMD-59b2-72LOb m 9999996 0038939 7b0 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 (Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition

21、 functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issue of the documents which are DoD adopted

22、are those listed in the issue of the DODISS cited in the solicitation. Unless otherwise specified, the issws of documents not listed in the DODISS are the issues of the documents cited in the solicitation. ELECTRONICS INDUSTRIES ASSOCIATION (EIA) JEDEC Standard No 17 - A Standard Test Procedure for

23、the characterization of LATCH-UP in CIMOS Integrated Circuits. (Applications for copies should be addressed to the Electronic Industries Association, Mo1 Pennsylvania Avenue, N.U., Washington, DC 20006-1813.) IBM VLSI SYSTEMS, FSD, NANASSAS, VA PP525-845 - Engineering and Manufacturing Test Specific

24、ation. (Applications for copies should be addresses to the Internationel Business Machine Corporation, Federal Secto- Division, 9500 Godwin Drive, Manassa, VA 22110.) AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM) ASTM Standard F1192-88 - Standard Guide for the Measurement of Single Event Phenome

25、na from Heavy Ion Irradiation of Semiconductor Devices. (Applications for copies should be addressed to the American Society for Testing and Haterials, 1916 Race Street, Philadelphia, PA 19103-1187.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the referen

26、ces cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 The individual item requirements for device class il shall be in accordance with 1.2.1 of HIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein.

27、The individual item requirements for device classes B and S shall be in accordance with NIL-il-38510 and as specified herein. included in this SMD. MIL-1-38535, the device manufacturers Quality Management (QM) plan, and as specified herein. Item requirements. For device classes Ei and S, a full elec

28、trical characterization table for each device type shall be lhe individual item requirements for device classes Q and V shall be in accordance with 3.2 Desiqn, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-M-38510 for device cla

29、sses ti, B, and S and MIL-1-38535 for device classes Q and V and herein. 3.2.1 3.2.2 Terminal connections. 3.2.3 Block diwram. 3.2.4 Switchina waveforms and test circuits. Case outline(s1. The case outline(s) shall be in accordance with 1.2.4 herein and figure I. The terminal connections shall be as

30、 specified on figure 2. The block diagram shall be as specified on figure 3. The switching waveforms and test circuits shall be as specified on figure 4. 3.2.5 Radiation exposure circuit. 3.3 Elect ri Ca 1 performance character i st i cs and post i r radi at i m parameter limits. The radiation expos

31、ure circuit shall be as specified on figure 5. Un less otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the full case operating temperature range. The electrical test requirements shall be th

32、e subgroups specified in table II. 3.4 Electrical test requirements. The electrical tests for each subgroup are defined in tables IA and IB. SIZE 5962-92106 A REVISION LEVEL SHEET 4 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-

33、,-SMD-5962-92LOb 9999996 0038940 482 = STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). MIL-BUL-103. Q and V

34、 shall be in accordance with MIL-1-38535. In addition, the nianufacturers PIN may also be marked as listed in Marking for device classes Ei and S shall be in accordance with MIL-M-38510. Marking for device classes 3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a

35、 “C“ as required in MIL-STD-883 (see 3.1 herein). in MIL-M-38510. The certification mark for device classes B and S shall be a “J“ or “JAN“ as required The certification mark for device classes Q and V shall be a “QML“ as required in MIL-1-38535. 5962-92106 SIZE A SHEET REVISION LEVEL 3.6 Certificat

36、e of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order

37、 to supply to the requirements of this drawing (see 6.7.2 herein). The certificate of compliance submitted to DESC-EC prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class M, the requirements of MIL-STD-883 (see 3.1 here

38、in), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. For device 3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein) or device classes B and S in MIL-M-38510 or for device classes Q and

39、 V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of chanrie for device class M. For device class M, notification to DESC-EC of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as def

40、ined in MIL-STD-480. 3.9 Verification and review for device class M. For device class M, DESC, DESCs agent, and the acquiring activity Offshore documentation retain the option to review the manufacturers facility and applicable required documentation. shall be made available onshore at the option of

41、 the reviewer. 3.10 Microcircuit qroup assignment for device classes M, B, and S. Device classes M, 8, and S devices covered by this drawing shall be in microcircuit group number 105 (see MIL-M-38510, appendix E). 3.11 Serialization for device class S. All device class S devices shall be serialized

42、in accordance with MIL-M-38510. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device class M, sampling and inspection procedures shall be in accordance with section 4 of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). sampling and inspection procedures shall b

43、e in accordance with MIL-M-38510 and method 5005 of MIL-STD-883, except as modified herein. MIL-1-38535 and the device manufacturers QM plan. For device classes B and S, For device classes Q and Y, sampling and inspection procedures shall be in accordance with 4.2 Screening. For device class M, scre

44、ening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. For device classes B and S, screening shall be in accordance with method 5O4 of MIL-STD-883, and shall be conducted on all devices prior to qualification and q

45、uality conformance inspection. For device classes Q and V, screening shall be in accordance with MIL-1-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device classes M, B, and S. a. Burn-in test, method 1015 of

46、MIL-STD-883. (1) Test condition A, 8, C, D, or E. manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. qualifying activity. biases, and power dissipation, as applicable, in accordance with the intent specified in test met

47、hod 1015. For device class M, the test circuit shall be maintained by the For device classes B and S, the test circuit shall be submitted to the For device classes M, B, and S, the test circuit shall specify the inputs, outputs, (2) T = +125OC, minimum. A b. Interim and final electrical test paramet

48、ers shall be as specified in table II herein. DESC FCRM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Conditions -55C I T : 50% 3v VAL IO ov OUTPUTS “OL NOTES: 1. 2. Capacitance value, CL, shall be defined in conditions column of table

49、IA. Tolerances for the resistors and capacitors shall be *IO% of rated values. FIGURE 4. Switching waveforms and test circuits. 5962-92106 REVISION LEVEL STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A - -. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-