DLA SMD-5962-92097 REV B-1995 MICROCIRCUIT DIGITAL FILTER MICROPROCESSOR MONOLITHIC SILICON《硅单块 微处理器 过滤器数字微型电路》.pdf

《DLA SMD-5962-92097 REV B-1995 MICROCIRCUIT DIGITAL FILTER MICROPROCESSOR MONOLITHIC SILICON《硅单块 微处理器 过滤器数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-92097 REV B-1995 MICROCIRCUIT DIGITAL FILTER MICROPROCESSOR MONOLITHIC SILICON《硅单块 微处理器 过滤器数字微型电路》.pdf（19页珍藏版）》请在麦多课文档分享上搜索。

1、I - = 999999b 00b7897 299 DEFENSE LOGISTICS AGENCY DEFENSEELECTRONICSSUPPLYCENTER 1507 WILMINGTON PIKE DAYTON, OH 45444- 5765 N IKPLY REFER TD DESC-ELDC (Mr. Hess/(AV 986) 513-296-85261tmh) 2 c #R 1335 SUBJECT: Notice of Revision (NOR) 5962-R105-95 for Standard Microcircuit Drawing (SMD) 5962-92097.

2、 MilitarylIndustry Distribution The enclosed NOR is approved for use effective as of the date of the NOR. In accordance with MIL-STD-100 SMD holders should, as a minimum, handwrite those changes described in the NOR to sheet 1 of the subject SMD. After completion, the NOR should be attached to the s

3、ubject SMD for future reference. Those companies who were listed as approved sources of supply prior to this action have agreed to actions taken on devices for which they had previously provided DESC a certificate of compliance. This is evidenced by an existing active current certificate of complian

4、ce on file at DESC alon3 with a DESC record of verbal coordination. The certificate of compliance for these devices is considered concurrence with the new revision unless DESC is otherwise notified. DESC has received and accepted a certificate of compliance from Logic Devices, Cage code 65896, for 5

5、962-9209701MYX and 5962-9209702MYX, and vendor similiar part number LF43891GMB20 and LF43891GMB25 respectively. This action will be reflected in the next revision of MIL-BUL-103. If you have comments or questions, please contact Tom Hess at (AV)986-8526 /(513)296-8526. - A 1 Encl MONICA L. POELKING

6、Chief, Custom Microelectronics Branch Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-W 999999b 00b7898 i125 4. ORIGINATOR a. TYPED NAME (First, Middle Initial, b. ADDRESS (Street-, City, State, Zip Code) . 5. CAGE CODE 7. CAGE CODE Defense Electroni

7、cs Supply Center 67268 1507 Wilmington Pike OH 45444-5765 67268 Last) NOTICE OF REVISION (NOR) 6. NOR NO. 8. DOCUMENT NO. 5962-92097 5962-R105-95 1. DATE I (YYMMDD) MICROCIRCUIT, DIGITAL, FILTER, MICROPROCESSOR, MONOLITHIC SILICON Form Approved I OMB No. 0704-0188 10. REVISION LETTER b. NEW a. CURRE

8、NT 95-03-30 This revision described below has been authorized for the document listed. a. (X one) 2. PROCUR NG ACTIVIY NO. X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document rmst be received before manufacturer may incorporate this change. (3) Custodian

9、of master document shall mke above revision and furnish revised document. b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT DESC-ELDC c. TYPED NAME (First, Middle Initial, Last) Monica L. Poelking I A I 8 I 12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES Al 1 13. DESCRIPTION OF REVISIO

10、N d. TITLE Chief, Custom Microelectronics Branch 15a. ACTIVITY ACCOMPLISHING REVISION DESC-ELDC e. SIGNATURE f. DATE SIGNED (YYMHDD) Monica L. Poelking 95-03-30 b. REVISION COMPLETED (Signature) c. DATE SIGNED ( Y Y MMDD) Thomas M. Hess 95-03-30 Mi Fom 1695, APR 92 Previous editions are obsolete Pro

11、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-m 9999996 0067899 Oh1 Defense Electronics Supply Center 1507 Wilmington Pike Dayton, OH 45444-5270 Last) NOTICE OF REVISION (NOR) 67268 5962-R233-93 7. CAGE CODE 8. DOCUMENT NO. 5962-92097 67268 Form Appro

12、ved OM6 NO. 0704-0188 I 1. DATE 93-10-08 I OF DOCMENTMICROCIRCUIT, DIGITAL, FILTER MICROPROCESSOR, MNOL ITHIC SIL ICON This revision described below has been authorized for the document listed. I 11. ECP NO. 10. REVISION LETTER a. CURRENT b. NEU 4. ORIGINATOR I b. ADORESS (Street, City, State, Zip C

13、ode) I 5. CAGE CODE I 6. NOR WO. a. (X one) X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised document. b. A

14、CTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT OESC-ECC I I 12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES Al 1 c. TYPED NAME (First, Middle Initial, Last) MONICA L. POELKING 13. DESCRIPTION OF REVISION d. TITLE CHIEF, CUSTOM MICROELECTRONICS 15a. ACTIVITY ACCOMPLISHING REVISION DESC-E

15、CC Sheet 1: Revisions ltr column; add “A“. Revisions description column; add “Changes in accordance with NOR 5962-R233-93“. Revisions date column; add “93-10-08“. Revision level block: add “A“. Rev status of sheets: For sheets 1 and 12 add “A“. e. SIGNATURE MONICA L. POELKING b. REVISION COMPLETED (

16、Signature) CHRISTOPHER A. RAUCH Sheet 12: FIGURE 3. Timinq waveforms - Continued. OUTPUT RISE AND FALL TIMES Delete: VIH ADD: 2.OV Delete: VIL ADD: 0.8V A.C. TESTING INPUT, OUTPUT WAVEFORM Change footnote FROM: . and measured at 2.5V. TO: . and measured at 2.0V. Revison level Add “A“ f. DATE SIGNE0

17、93-10-08 c. DATE SIGNED 93-10-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- m 99999b 0067900 b03 - LTR DESCRIPTION (YR-MO-DA) APpRclvED REV sHEE;T REV SHEET sHmr 111213 15 PREPARED BY Jeffery Tunstall SIZE A CHECKED BY Tom Hess APPROVED BY CPGE

18、 CODE 5962-92097 67268 Monica Poelktng ORAWING APPROVAL DATE 93-08-19 REVISION LEVEL DEFENSE EUXXWNCS SUPPLY CEXER DAYTON, OHIO 45444 MICROCIRCUIT, DIGITAL, FILTER MICROPROCESSOR, MONOLITHIC SILICON 5962-E403-93 Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro

19、m IHS-,-,- 7777976 0067703 54T D 1. SCOPE 1.1 W. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classgs.consisting of military high reliability (device classes Q and M) and space application (device class v), and a choice of cas

20、e outlines and Lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“. available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN

21、. Device class M microcircuits represent non-JAN class B microcircuits in accordance with Uhen I 1.2 PIN. The PIN shall be as shown in the following example: X - X - o1 M I I I I I I - 5962 92097 I I I I I I L Lead Case Device I +- RHA Devi ce stock class designator type class outline finish designa

22、tor (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) I (see 1.2.3) i Drawing number 1.2.1 RHA desiqnator. Device class M RHA marked devices shall meet the MIL-1-38535 appendix A specified RHA levels I I and shall be marked with the appropriate RHA designator. NIL-1-38535 specified RHA leve

23、ls and shall be marked with the appropriate RHA designator. non-RHA device. Device classes Q and V RHA marked devices shall meet the A dash (-1 indicates a 1.2.2 Device type(s). The device type($) shall identify the circuit function as follows: Devi ce type o1 Generi c number 43891GN-20 Circuit func

24、tion Microprocessor, digital, filter 02 43891GM-25 Microprocessor, digital, filter 1.2.3 Device class desiqnator. The device class designator shall be a single letter identifying the product assurance level as follows: I I Device class Device requirements documentation M Vendor self-certification to

25、 the requireaients for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-1-38535 1.2.4 Case outline(s). The case wtline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive desiqnator Terminals Package

26、style X CMGA3-85 85 Pin-grid array 1.2.5 Lead finish. The lead finish shall be as specified in MIL-STO-883 (see 3.1 herein) for class M or MIL-1-38535 for classer P and V. Finish letter OX“ shall not be marked on the microcircuit or its packaging. The “X I designation is for use in specifications wh

27、en lead finishes A, B, and C are considered acceptable and interchangeable STANDARD1 ZED 5962-92097 MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-m 999999b

28、OOb7902 48b STANDARDIZED MILITARY DRAWING I DEFENSE ELECTRONICS SUPPLY CENTER 1.3 Absolute maximum ratinqs. 11 Supply voltage . 8.0 V Input, Output voltage applied range Storage Temperatur range (TS) -65C to 15C Lead temperature (soldering, 10 seconds) . 3WC Thermal resistance: Power dissipatior: at

29、 115C : . 1.44 U . GND - 0.5 V to Vcc + 0.5 V Junction temperature (TJ) 175C Junction-to-ambient (eJA) . 34.66“C/U Junction-to-case (e ) . See MIL-STD-1835 5962-92097 SIZE A 1.4 Recommended operatinq conditions. Operating voltage range . 4.5 V to 5.5 V Ambient operating temperature range (TA) . -55C

30、 to 12SC 1.5 Dioital laic testing for device classes (1 and V. fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) XX percent z/ 2. APPLICABLE WCUMENTS 2.1 Government specification, standards, bulletin, and handbook. Unless otherwise specified, the following speci

31、fication, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MIL I TARY MIL-1-38535 - Integrated Circuits, Manu

32、facturing, General Specification for. STANDARDS MILITARY MIL-STO-883 - Test Methods and Procedures for Microelectronics. NIL-STD-973 - Configuration Management. MIL-STO-1835 - Microcircuit Case Outlines. BULLETIN MILITARY MIL-BUL-103 - List of Standardircd Military Drawings (SMDs). HANDBK MILITARY M

33、IL-HDBK-780 - Standardized Military Drawings. (Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) - I/ Stresses above

34、the absolute maximum rating may cause permanent damage to the device. maximum levels may degrade performance and affect reliability. 2/ Values will be added when they become available. - Extended operation at the I DAYTON, OHIO 45444 IREVrSIrnLEvEL IsHEEr I DESC FORM 193A JUL 91 Provided by IHSNot f

35、or ResaleNo reproduction or networking permitted without license from IHS-,-,-9b 0067903 332 STANDARDIZED SIZE MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISIONLEVEL 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references

36、 cited ?erein, the text of this drawing shall take precedence. - 3. REQUIREMENTS . . 3.1 Item requirements. The individual item requirements for device class N shall be in accordance with 1.2.1 of NIL-STO-883, “Provisions for the use of flIL-STD-883 in conjunction with compliant non-JAN devices“ and

37、 as specified ierein. device manufacturers Quality Management (QM) plan, and as specified herein. - The individual item requirements for device classes O and V shall be in accordance uith MIL-1-38535, the 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimen

38、sions shall be as specified in MIL-STD-883 (see 3.1 herein) for device class M and MIL-1-38535 for device classes Q and V and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on fig

39、ure 1 . 3.2.3 Block diagram. The block diagram shall be as specified on figure 2 . 3.2.4 Timing waveforms. The timing waveforms shall be as specified on figure 3. 5962-92097 SHEET 4 3.3 Electrical performance characteristics and wstirradiation parameter limits. Unless otherwise specified herein, the

40、 electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tes

41、ts for each subgroup are defined in table I. 3.5 Markinq. The part shall be marked with the PIN listed iri 1.2 herein. Marking for device class M shall be in accordance with MIL-STO-883 (see 3.1 herein). MIL-BUL-103. In addition, the manufacturers PIN may also be marked as listed in Marking for devi

42、ce classes Q and V shall be in accordance with MIL-1-38535. 3.5.1 Certification/compliance mark. The compliance mark for device class H shall be a “C“ as required in MIL-STO-883 (see 3.1 herein). in MIL-1-38535. The certification mark for device classes Q and V shall be a “QflL“ or “Q“ as rquired 3.

43、6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufactrer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.2 herein). classes Q and V, a certificate of compliance shall be required from a QHL-38535 listed manufactur

44、er in order to suppl) to the requirements of this drawing (see 6.7.1 herein). The certificate of compliance submitted to DESC-Et prior to listing as an approved source of supply for this drawing shall affirm that the nanufacturers product meets, for device class il, the requirements of MIL-STO-883 (

45、see 3.1 herein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. 3.1 herein) or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered tc this drawing. For device 3.7 Certificate of conformance. A certificate o

46、f conformance as required for device class M in flIL-STD-883 (see 3.8 Notification of chanqe for device class M. For device class M, notification to DESC-EC of change of product (see 6.2 herein) involving devices acquired to this drawing is rquired for any change as defined in MIL-STD-9?3. 3.9 Verif

47、ication and review for device class M. For device class M, DESC, OESCs agent, and the acquiring activit Offshore documentatio retain the option to review the nanufacturers facility and applicable rquired documentation. shall be made available onshore at the option of the reviewer. 3.10 Microcircuit

48、amuo assianaent for device class M. microcircuit group nuder 105 (see MIL-1-38535, appendix A). Device class M devices covered by this drawing shall be in 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device class H, sampling and inspection procedures shall be in accordance with F

49、or device classes Q and V, sampling and inspection procedures shaC1 be in accordance HIL-STO-883 (see 3.1 herein). with HIL-1-38535 and the device nanufacturers QM plan. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-b 00b7904 259 STANDARD i ZED MILITARY DRAWING I DEFENSE ELECTRONICS SUPPLY CENTER SIZE 5962-92097 A l?EvISIoN LEVEL sm 5 I I