DLA SMD-5962-92090 REV A-2004 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL 10- BIT BUFFER LINE DRIVER MONOLITHIC SILICON《硅单块 10比特缓冲器或行驱动线 改进型肖特基晶体管晶体管逻辑电路 双极数字微型电路》.pdf
《DLA SMD-5962-92090 REV A-2004 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL 10- BIT BUFFER LINE DRIVER MONOLITHIC SILICON《硅单块 10比特缓冲器或行驱动线 改进型肖特基晶体管晶体管逻辑电路 双极数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-92090 REV A-2004 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL 10- BIT BUFFER LINE DRIVER MONOLITHIC SILICON《硅单块 10比特缓冲器或行驱动线 改进型肖特基晶体管晶体管逻辑电路 双极数字微型电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to reflect latest changes in format and requirements. Editorial changes throughout.les 04-10-20 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A OF SHEETS SH
2、EET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUI
3、T, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, 10- BIT AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-03-29 BUFFER/LINE DRIVER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-92090 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E426-04 Provided by IHSNot for Res
4、aleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92090 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class level
5、s consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in
6、 the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92090 01 M K A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device
7、classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-
8、RHA device. 1.2.2 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 54F827 10-bit buffer/line driver 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows:
9、 Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines a
10、re as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-T24 or CDFP3-T24 24 dual-in-line L GDIP3-T24 or CDIP4-T24 24 flat 3 CQCC1-N28 28 square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device c
11、lasses Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92090 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FOR
12、M 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range -0.5 V dc to +7.0 V dc DC input current range -30 mA to +5.0 mA Voltage applied to a disabled three-state output range . -0.5 V dc to +5.5 V dc Voltage applied to any output in the
13、 high state -0.5 V dc to VCCCurrent into any output in the low state . 96 mA Storage temperature range -65C to +150C Maximum power dissipation (PD) 2/ 450 mW 2/ Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835
14、 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) 0.8 V dc Maximum input clamp current (IIK) -18 mA Maximum high level output current (IOH) . -12 mA Maximum low level output c
15、urrent (IOL) +48 mA Case operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the
16、issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Sta
17、ndard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the
18、 Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, sup
19、ersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation is defi
20、ned as VCCx ICC, and must withstand the added PDdue to short-circuit test e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92090 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEV
21、EL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM
22、plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, co
23、nstruction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal conne
24、ctions shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figu
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