DLA SMD-5962-92046 REV A-2004 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL VOLTAGE-CONTROLLED OSCILLATOR MONOLITHIC SILICON《硅单块 稳压器振动器 小功率肖特基晶体管晶体管逻辑电路 双极数字微型电路》.pdf

《DLA SMD-5962-92046 REV A-2004 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL VOLTAGE-CONTROLLED OSCILLATOR MONOLITHIC SILICON《硅单块 稳压器振动器 小功率肖特基晶体管晶体管逻辑电路 双极数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-92046 REV A-2004 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL VOLTAGE-CONTROLLED OSCILLATOR MONOLITHIC SILICON《硅单块 稳压器振动器 小功率肖特基晶体管晶体管逻辑电路 双极数字微型电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 04-09-16 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A A A OF SHEETS SHEE

2、T 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGIT

3、AL, BIPOLAR, LOW-POWER SCHOTTKY, TTL, VOLTAGE- AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-04-12 CONTROLLED OSCILLATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-92046 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E424-04 Provided by IHSNot for Resale

4、No reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels c

5、onsisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in th

6、e PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92046 01 M C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device cla

7、sses Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA

8、 device. 1.2.2 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 54LS628 Voltage-controlled oscillator 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follow

9、s: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outlines. The case outlines

10、 are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 dual-in-line 2 CQCC1-N20 20 square chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535

11、, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maxi

12、mum ratings. 1/ Supply voltage range . -0.5 V dc minimum to +7.0 V dc maximum Input voltage range: Enable input . -1.5 V dc at 18 mA to +7.0 V dc Frequency control or range input . VCCStorage temperature range -65C to +150C Maximum power dissipation (PD) . 192.5 mW 2/ Lead temperature (soldering, 10

13、 seconds) +300C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) 3/ . +4.5 V dc minimum to +5.5 V dc maximum Input voltage at frequency control or range input (VIN(fre)or VIN(rng) 0.0 V dc mi

14、nimum to +5.0 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Maximum input clamp current (IIK) -18 mA Maximum high level output current (IOH) . -1.2 mA Maximum low level output current (IOL) 12 mA Output frequency (fOUT) 1 Hz to 20 MHz Cas

15、e operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documen

16、ts are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Compon

17、ent Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Docume

18、nt Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws

19、 and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation is defined as VCCx ICC, and

20、must withstand the added PDdue to short-circuit test e.g., IOS. 3/ Symbol VCCis used for the voltage applied to both the VCCand OSC VCCterminals unless otherwise noted. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZ

21、E A 5962-92046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified i

22、n the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as

23、 specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shal

24、l be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3 3.3 Electrical performance char

25、acteristics and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The ele

26、ctrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the ent

27、ire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking fo

28、r device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, app

29、endix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a m

30、anufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, th

31、e requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be

32、 provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Ve

33、rification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microci

34、rcuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 11 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5

35、962-92046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C +4.5 V VCC +5.5 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max High

36、level output voltage VOHVCC= 4.5 V, IOH = -1.2 mA 1, 2, 3 All 2.5 V Low level output voltage VOLVIL= 0.7 V 1/ IOL = 12 mA 1, 2, 3 All 0.4 V Input clamp voltage at enable VIKVCC= 4.5 V IIN = -18 mA 1, 2, 3 All -1.5 V Input current at frequency IIVCC= 5.5 V VIN= 5.0 V 1, 2, 3 All 250 A control or rang

37、e VIN= 1.0 V 50 High level input current IIH1VCC= 5.5 V VIN= 2.7 V 1, 2, 3 All 40 A at enable IIH2VIN= 7.0 V 200 Low level input current at enable IILVCC= 5.5 V VIN= 0.4 V 1, 2, 3 All -0.8 mA Short-circuit output current IOSVCC= 5.5 V 2/ VOUT= 0.0 V 1, 2, 3 All -40 -225 mA Supply current ICCVCC= 5.5

38、 V 3/ EN = 4.5 V 1, 2, 3 All 35 mA Functional tests See 4.4.1b, VCC= 4.5 V and 5.5 V 7, 8 All Output frequency fOUTVCC= 5.0 V, VIN(fre)= 5.0 V 9 All 15 25 MHz RL= 667, VIN(rng) = 0.0 V 10, 11 10 30 CL= 45 pF, VIN(fre)= 1.0 V 9 All 1.1 2.1 Cext= 50 pF 4/ VIN(rng)= 5.0 V 10, 11 0.8 2.5 1/ VOHfor Y out

39、put and VOLfor Z output are measured while enable input is at VIL= 0.7 V with individual 1 k resistors connected from CX1 to VCCand from CX2 to ground. The resistors connected are reversed for testing VOHfor Z output and VOLfor Y output. 2/ Not more than one output shall be shorted at a time, and th

40、e duration of the short-circuit should not exceed one second. 3/ ICCis measured with the outputs disabled and open. 4/ Sample testing of output frequency may be performed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING

41、SIZE A 5962-92046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines C 2 Terminal number Terminal symbol 1 OSC GND NC 2 RNG OSC GND 3 CX1 RNG 4 CX2 CX1 5 EN NC 6 Y CX2 7 GND NC 8 Z EN 9 VCCY 10 NC GND 11 RX NC 12 RX Z

42、13 FC VCC14 OSC VCCNC 15 - - - NC 16 - - - RX 17 - - - NC 18 - - - RX 19 - - - FC 20 - - - OSC VCCNC = No connection FIGURE 1. Terminal connections. Input Outputs EN Y Z L Enabled Enabled H H L H = High level voltage level L = Low level voltage FIGURE 2. Truth table. Provided by IHSNot for ResaleNo

43、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networkin

44、g permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92046 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures

45、 shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-

46、PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-

47、883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level cont

48、rol and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance