DLA SMD-5962-92023 REV B-2011 MICROCIRCUIT DIGITAL ADVANCED CMOS 16-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf
《DLA SMD-5962-92023 REV B-2011 MICROCIRCUIT DIGITAL ADVANCED CMOS 16-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-92023 REV B-2011 MICROCIRCUIT DIGITAL ADVANCED CMOS 16-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf(21页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE F8859. Add case outline Y. Add device type 02. Add section 1.5, radiation features. Add delta limits to table III for device type 02. Update the boilerplate to add radiation hardness assurance requirements, to remove classes B and
2、 S criteria, and to reflect the changes in accordance with MIL-PRF-38535 requirements. Editorial changes throughout. jak 04-05-24 Thomas M. Hess B Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 11-04-19 David J. Corbett REV SHET REV B B B B B B SHEET 15 16 17 18 19 20
3、 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Wanda L. Meadows DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF
4、 THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Thomas J. Ricciuti APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 16-BIT BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-02-23 REVISION LEVEL B SIZE A CAGE CODE 67268 596
5、2-92023 SHEET 1 OF 20 DSCC FORM 2233 APR 97 5962-E313-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92023 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1.
6、 SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When availa
7、ble, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 F 92023 01 V Y A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish
8、 (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and ar
9、e marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT16245 16-bit bus transceiver with three-state outputs,TTL compatible inputs 02 5
10、4ACT16245 16-bit bus transceiver with three-state outputs,TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirem
11、ents for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator
12、Terminals Package style X GDFP1-48 48 Flat pack Y See figure 1 48 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
13、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92023 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc Input voltage range (VIN) . -0.5 V dc to VCC + 0.5 V
14、dc Output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Input clamp current (IIK) (VIN VCC) . 20 mA DC output clamp current (IOK) (VOUT VCC) 50 mA DC output current (IOUT) (VOUT= 0 to VCC) (per output pin) 50 mA DC VCCor GND current (ICC, IGND) . 400 mA 3/ Storage temperature range (TSTG) . -65C
15、 to +150C Maximum power dissipation (PD) . 500 mW Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC): Case outline X . See MIL-STD-1835 Case outline Y . 22C/W Junction temperature (TJ) +175 C Case operating temperature range (TC) . -55C to +125C 1.4 Recommended
16、operating conditions. 2/ 4/ 5/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) . +0.0 V dc to VCCMaximum low level input voltage (VIL) 0.8 V dc Minimum high level input voltage (VIH) . 2.0 V dc Case operating temperature range (
17、TC) . -55C to +125C Input rise and fall rate (tr, tf) maximum: (10% to 90% of VIN, 90% to 10% of VIN) 10ns/V Maximum high level output current (IOH) .-24 mA Maximum low level output current (IOL) .+24 mA 1.5 Radiation features. Device type 02: Maximum total dose available (dose rate = 50 300 rads (S
18、i)/s) 300 krads (Si) Single Event Latchup (SEL) occurs at LET (see 4.4.4.2) . 93 MeV-cm2/mg 6/ Single Event Upset (SEU) occurs at LET (see 4.4.4.2) 93 MeV-cm2/mg 6/ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may de
19、grade performance and affect reliability. The maximum junction temperature may be exceeded for allowable short duration burn-in screening conditions in accordance with 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ For packages with multiple VCCand GND pins, t
20、his value represents the maximum total current flowing into or out of all VCCand GND pins. 4/ Unless otherwise specified, the limits for parameters listed herein shall apply over the full VCCand TCrecommended operating range. 5/ Unused or floating inputs should be held high or low. 6/ Limits obtaine
21、d during technology characterization/qualification, guaranteed by design or process, but not production tested unless specified by the customer through the purchase order or contract. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRC
22、UIT DRAWING SIZE A 5962-92023 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent
23、 specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method S
24、tandard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla
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