DLA SMD-5962-91630-1991 MICROCIRCUITS DIGITAL HIGH-SPEED CMOS ANALOG MULTIPLEXER DEMULTIPLEXER MONOLITHIC SILICON《硅单块 模拟多路转换器与多路分配器 高速互补金属氧化物半导体 数字微型电路》.pdf
《DLA SMD-5962-91630-1991 MICROCIRCUITS DIGITAL HIGH-SPEED CMOS ANALOG MULTIPLEXER DEMULTIPLEXER MONOLITHIC SILICON《硅单块 模拟多路转换器与多路分配器 高速互补金属氧化物半导体 数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-91630-1991 MICROCIRCUITS DIGITAL HIGH-SPEED CMOS ANALOG MULTIPLEXER DEMULTIPLEXER MONOLITHIC SILICON《硅单块 模拟多路转换器与多路分配器 高速互补金属氧化物半导体 数字微型电路》.pdf(16页珍藏版)》请在麦多课文档分享上搜索。
1、. REV SHEET REVSTATUS . REV OF SHEETS SHEET c 12 34 56 78-+ 1c 11 12 13 14 15 SMD-5962-93630 59 m 9999996 O008543 5 m I PMIC NA PREPARED BY, STANDARDIZED MILITARY DRAWING MIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE APPROVAL DATE 91-12-31 I REVISION L
2、EVEL 1 AMSC k/A 1 DESC FORM 193 SEP 87 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 MICROCIRCUITSy DIGITAL, HIGH-SPEED CMOS, ANALOG MULTIPLEXER/DEMULTIPLEXER, MONOLITHIC SILICON SIZE A I 67268 CAGE CODE )596-1830 . SHEET 1 OF 15 U.S. COVIRNMINT PRINTING OFFICE: 1987 - 748.119/6991 I 5962-E20
3、7 DISTRIBUTION STATEMENT A. Approved for publlc release; dlstrlbullon is unllmiled. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-59b2-9Lb30 59 9999996 0008542 7 * 1. SCOPE 1.1 Scqee. This drawing form 8 part of a one part - one part nunber do
4、cunentation system (see 6.6 herein). TM product assurme classes consisting of military high reliability (device classes B, (Il atxi M) esxl space application (device classes S end VI, mi a choice of case outlines ami lead finishes are aviilable end are reflected in the Part or Identifying N = 0.0 v
5、Vcc 9 .O v for all eppl iceble corrbinations of both v and v vafying fPb VEE to - See footnotes at end of tab1 STANDARDIZED MBLmARY DRAWING DEFENSE ELEC“K=S SUPPLY CEMR DAYTON, OHK) 45444 SIEE A I I 5962-91630 5C FORM 193A EP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted wi
6、thout license from IHS-,-,-. SMD-59b2-91b30 59 9799996 00085Ll b = . TABLE I. Electrical wrfomnce characteristic8 - Continued. Test Cornnon capacitance Control input leakage Functionel tests current IoNl res i s tance (square wave inpit) Peak Will resistance (all inpit waveform types) Propagation de
7、lay, switch in to out Propagation delay, sui tch turn-IlOf f1I dela) from Sn or E to switch output propagation delay, sui tch turn-WrP delay from Sn or E to switch output See footnotes on next page. IN PZH PZL I I Limits -. Unit MtX Conditions Groy,A - -55C 5 T 5 +125“C 1/ subgrocps Min unless oth6r
8、wise swif ied . f = 1 MHr, powr off, COCIMQW WT/IN A wxl Comcwr WT/IN 6 to GNO, VEE, or Vcc, see 4.4.1 4 Vcc = 5.5 V, VI, = Vcc or GIID 11,2,31 = 4.5 v F1 vcc- :IS =:EE-“ - 0.0 v 1.0 IlA, SdS vcc = 4.5 v 1 mfi;do; :IH v 2.3 maxim, I I! . figure 4 9 VEE = -4.5 V 2.3 = 4.5 v .1 vcc- stb in VEE - 0.0 v
9、 = v to 2Km increments- 2.3 -9 10. Il VEE = -Y VEE = 0.0 V _, 9 I- VEE = -4.5 v -9 VEE = 0.0 v ., 9 10. 11 10, 11 v 10. 11 VEE = -4.5 v -9 10. 11 v 18 pF :1.0 1M). n 240. m. 180 180. n 270. m. 195 12 ns 18 ns 8 ns 12 ns 50 ns 75 - ns 38 ns 57 ns 70 ns 105 ns 48 ns i2 ns SIZE 5962-91630 STANDARDIZED
10、MILITARY DRAWING A 1 DEFENSE ELECTAOFJKS SUPPLY CENER RW!WNLEvEL SHEET 7 DAYTDN, OH 45444 ;C FORM 197A Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-9Lb30 59 9999996 0008548 8 . I/ For hi power supply of 5.0 V F go%T avec VEE 50% SWITCH OU
11、TPUT tr6nsi t i I-+ tf-6ns m 3.0 t Ih 0.3 6ND I E OR sn OUTPUT TO LOU I vcc VEE 50% OF (Vcc - VEE) I I 90% OUTPUT HIGH TO HIGH SWITCH O SWITCH OFF FIGURE 5. Test circuit and suitchins waveforms. SIZE 5962-91630 STANDARDIZED MILITARY DRAWING A I DEFENSE ELECfRoNICS PPLY CENTER mnw, OHIO 45444 ISC FOR
12、M 193A !EP 07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_ SMD-59b2-9Lb30 59 999999b 0008552 T 4.3 Qualification inspection. 4.3.1 Qualification inspection for device classes B end S. Qualification inspection for device classes B and S shall be
13、in accordence with MIL-M-38510. specified in method 5005 of MIL-STD-883 and herein for groups A, E, C, D, and E inspections (see 4.4.1 through 4.4.5). classes Q and V shall be in accordence with MIL-1-38535. specified in MIL-1-38535 and herein for grows A, B, Cl D, wxl E inspections (see 4.4.1 throu
14、gh 4.4.5). accordance with MIL-STD-883 (see 3.1 herein) and as specified herein. Quality conformance inspection for device classes B and S shall be in accordance with MIL-M-38510 and as specifigd herein. Inspections to be performed for device classes M, 8, wxl S shall be those specified in method 50
15、05 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.5). Technology conformance inspection for classes Q end V shall be in accordenc with MIL-1-38535 incbuding groups A, 6, C, Dl and E inspections end as specified herein except where option 2 of MIL-1-38535 pe
16、rmits alternete in-line control testing. Inspections to be performed shall be those 4.3.2 Qualification inspection for device classes P and V. Qualification inspection for device Inspections ta be performed shall be those 4.4 Conformence inspection. Puality conformance inspection for device class M
17、shall be in 4.4.1 Grw A inspection. a. b. Tests shall be as specified in table IIA herein. For device class Ml subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes B and S, subgrolps 7 and 8 tests shall be sufficient to verify the truth table as approved by the q
18、ualifying activity. For device classes Q d V, subgroups 7 and 8 shall include verifying the functionality of the device; these tests shall have been fault graded in accordance with MIL-STD-883, test method 5012 (see 1.5 herein). measurements) shall be measured only for the initial test and after Bro
19、ck or &I changes which may affect capacitance. Capacitance shall be measured between the designated terminal and GND at a frequency of 1 MHr. Test all epplicabCe pins on five devices with zero failures, Subgrolps 5 and 6 in table I, method 5005 of NIL-STD-883 shall be omitted. c. Swroq 4, (CI , c an
20、d C d. 4.4.2 Group B inspection. The grow B inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.3 Group C inspection. The grorp C inspection end-point electrice1 parameters shall be as specified in table IIA herein. 4.4.3.1 Additional criteria for device classes
21、 M. B. and S. Steady-state life test Conditions, Test condition A, 6, Cl or D. For device classM, the test circuit shall be srknitted to DESC-ECS for review with the certificate of conplience. circuit shall be suknitted to the qualifying activity. method 1005 of MIL-STD-883: a. For device classes B
22、wid S, the test .I b. TA = +125*C, minim. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. CIZE 5962-91630 A STANDARDIZED MILTTARY DRAWING DEFENCE UECTRONiCS SUPPLY CEHiEA REVISION LEVU SMJ3 12 1 DAWN, OHIO 45644 . OESC FORM 193A SEP 07 Provided by IHSNot for ResaleN
23、o reproduction or networking permitted without license from IHS-,-,-SMD-5962-9Lb30 59 9999996 O008553 L i TABLE IIA. Electrice1 test reaiiranents. r/ 2/ 3/ lest requi rmnts Interim electrical Finel electrical Deremeters (see 4.2) parcnieters (see 4.2) Slrbgroiips (per method 5005, t class class 1 A3
24、 1 ,7,9 I/ Blank spaces indicate tests are not applicable. 2/ * indicates PDA applies to sribgroup 1. 3J * indicates PDA applies to subgroip 1 and 7. Subgrorps teble III) ile I). (per MIL-1-38535, Device . Device Device class class class S Q V (1111 4.4.3.2 Additional criteria for device classes Q a
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