DLA SMD-5962-90996 REV B-1996 MICROCIRCUIT DIGITAL CMOS 12 X 12 MULTIPLIER ACCUMULATOR MONOLITHIC SILICON《硅单块 12 X 12倍增器或蓄压器 互补金属氧化物半导体 数字微型电路》.pdf

《DLA SMD-5962-90996 REV B-1996 MICROCIRCUIT DIGITAL CMOS 12 X 12 MULTIPLIER ACCUMULATOR MONOLITHIC SILICON《硅单块 12 X 12倍增器或蓄压器 互补金属氧化物半导体 数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90996 REV B-1996 MICROCIRCUIT DIGITAL CMOS 12 X 12 MULTIPLIER ACCUMULATOR MONOLITHIC SILICON《硅单块 12 X 12倍增器或蓄压器 互补金属氧化物半导体 数字微型电路》.pdf（25页珍藏版）》请在麦多课文档分享上搜索。

1、SMD-5962-90996 REV B m 9999996 009OL22 380 m DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS 3990 EAST BROAD STREET COLUMBUS, OH 4321 6-5000 IN REPLY REFER TO: DSCC-VAC (Mr . Gauder/(DSN)850-0545/6 14-692-0545) SUBJECT: Notice of Revision (NOR) 5962-RO8-96 for Standard Microcircuit Drawing (

2、SMD) 5962-90996. Military Andustry Distribution The enclosed NOR is approved for use effective as of the date of the NOR. in accordance with MIL-STD-100 SMD holders shouid, as a minimum, handwrite those changes described in the NOR to sheet 1 of the subject SMD. After completion, the NOR should be a

3、ttached to the subject SMD for future reference. Those companies who were listed as approved sources of supply prior to this action have agreed to actions taken on devices for which they had previously provided DSCC a certificate of compliance. This is evidenced by an existing active current certifi

4、cate of compiance on file at DSCC with a DSCC record of verbal coordination. The certificate of compliance for these devices is considered concurrence with the new revision unless DSCC is otherwise notified. If you have comments or questions, please contact Larry T. Gauder at (DSN)850-0545/(614)6924

5、545. 1 Encl Monica L. Poelking Chief, Custom Microelectroncs Branch Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NOTICE OF REVISION (NOR) THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED. ublic reporUng,burden for this wii

6、eciion is estimated to average 2 hours per,response, induding the time fy reviewin instructions. searchm existing data ACTIVITY NO. ources. gathenn and maintaining the data neeped. and completing and rewemng the coiieon,of information. Sengcomments regarding add Wi. Revisions description colum; add

7、IlChanges in accordance with NOR 5962-R208-96“. Revisions date colunn; add l196-09-27I1. Revision level block; add %Il. Rev status of sheets; for sheet 1 and 6, add mnB1l. TABLE I, Output voltage, high VOH, device types 02, 03, and 04; delete “3.5 V Minns and substitute “2.4 V Mina1. Revision level

8、block; add IlBIl. a X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised document. I I b. ACTIVITY AUTHORIZED T

9、O APPROVE CHANGE FOR GOVERNMENT DSCC-VAC c. TYPED NAME (First, Middle lnitial, Last) Monica L. Poelking I d. TITLE I e. SIGNATURE I f. DATE SIGNED Chief, Custom Microelectronics 15a. ACTIVITY ACCOMPLISHING REVISION DSCC-VAC DD Form 1695, APR 92 Monica L. Poelking b. REVISION COMPLETED (Signature) La

10、rry T. Gauder Previous editions are obsolete. (YYMMDD) 96-09-27 c. DATE SIGNED (YYMMDD) 96-09-27 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-5962-90796 REV A = 9999996 0023YLi4 Ob7 = - LTR - DESCRIPTION DATE (YR-MO-DA) I A THE C - Add packag

11、e types Z and U. Add device types 02, 03, and 04. Editorial changes throughout. 9 2-07- 15 SHEET Jeffery Tunstall * SHEET DEFENSE ELECIKONICS SUPPLY CIq:NII StI1.1 I 1 Il I I, Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1. SCOPE STANDARDIZED MILI

12、TARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes 8, Q, and M) and space application (devi

13、ce classes C and VI, and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjun

14、ction with compliant non-JAN devices“. available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN. When SIZE A REVISION LEVEL 1.2 m. The PIN shall be as shown in the following example: - X - X - M _ - 5962 90996 o1 I I l I I I I I I I I I I Lead Case Device Devi ce RHA

15、 Federal stock class designator type class out line finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) desiqnator. Device classes II, 8, and S RHA marked devices shall meet the Device classes P and V RH

16、A VIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. narked devices shall meet the MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA jesignator. A dash (-) indicates a non-RHA device. 1.2.2 Device typeCs). The device type(s) shall id

17、entify the circuit function as follows: Devi ce type Generic number Circuit function Mu 1 ti ply ti me o1 02 03 04 TMCZOO9 12 x 12 bit CMOS multiplier/accumulator 170 ns LMA1009/2M)9 12 x 12 bit CMOS muLtiplier/accumulator 95 ns LMA1009/2009 12 x 12 bit CMOS multiplier/accumulator 65 ns LMA1009/2009

18、 12 x 12 bit CMOS multiplier/accumulator 55 ns 1.2.3 Device class designator. The device class designator shall be a single 3ssurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for etter identifying the product non-JAN class B mic

19、rocircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 (1 or V Certification and qualification to MIL-1-38535 1.2.4 Case outline(s). For device classes M, 8, and S, case outline(s) shall meet the requirements in appendix C )f MIL-M-38510 and as liste

20、d below. For device classes Q and V, case outline(s) shall meet the requirements of VIL-1-38535, appendix C of MIL-M-38510, and as listed below. Outline letter Case outline X Y 2 U D-13 (64-lead, 3.240“ x .920“ x .225“), dual-in-line package C-7 (68-terminal, .962“ x .962“ x .120“), square leadless

21、chip carrier package C-J5 (68-terminal, .960“ x .960“ x .135“), square grid chip carrier package P-AC (68-pin, 1.180“ x 1.180“ x .345“), square pin grid array unformed lead option only 1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-1-38535 for

22、:lasses Q and V. for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without )reference. Finish letter “X“ shall not be marked on the microcircuit or its packaging. The “X“ designation is A 5962-90996 SHEET 2 DESC FORM 193A Provided by IHSNot for Re

23、saleNo reproduction or networking permitted without license from IHS-,-,-1.3 Absolute maximum ratinqs. I/ z/ STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 -0.5 to t7.0 V -0.5 to (VDD t 0.5) v -0.5 to (VDD tO.5) v -3.0 mA to t6.0 mA -60C to t130“C +175“C +3OO0C -6

24、5C to +15OoC 330 mW 138 mW See MIL-M-38510, appendix C SIZE 5962-90996 A REVISION LEVEL SHEET 4.5 v 5 VDD 5 5.5 v 0.8 V 2.0 v -55C to +125C XX percent I/ - I/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade per

25、formance and affect reliability. - 2/ Absolute maximum ratings are limiting values applied individually while all other parameters are within specified operating conditions. - 31 Applied voltage must be current limited to specified range, and measured with respect to GND - 4/ Forcing voltage must be

26、 limited to specified range - 51 Current is specified as conventional current flowing into the device. - 61 Must withstand the added PD due to short circuit test (e.g., Ias). - 7/ Values will be added when they become available. Functional operation under any of these conditions is not implied. DESC

27、 FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SflD-57b2-7099b REV A = 99b 0023Y47 878 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 2. APPLICABLE DOCUMENTS SIZE 5962-90996 A REVISION LEVEL SHEE

28、T A 4 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form

29、 a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MIL-M-38510 MIL-1-38535 STANDARDS MILITARY MII. SrD-/i8U MIL-STD 8x5 IIIJLLLT IN MILITARY M IL-BUL-1 O3 - Microcircuits, General Specification for. - Integrated Circuits, Manufacturing, General Specification for. - Confi

30、guration Control-Engineering Changes, Deviations and Ilaivers. - lest Methods arid Procedures for Microelectronics. - List of Standardized Military Drawings (SMDs). HANDBOOK MILITARY MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specifications, standards, bulletin, and handbook requi

31、red by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.7 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this

32、drawing shall take precedence. 3. REQUIREMENTS 3.1 The individual item requirements for device class M shall be in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein. The individual item requirements for

33、 device classes B and S shall be in accordance with MIL-M-38510 and as specified herein. included in this SMD. MIL-1-38535, the device manufacturers Quality Management (QM) plan, and as specified herein. Item requirements. For device classes B and S, a full electrical characterization table for each

34、 device type shall be The individual item requirements for device classes Q and V shall be in accordance with 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-M-38510 for device classes M, B, and S and MIL-1-38535 for d

35、evice classes Q and V and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Block or loqic diagram. The block or logic diagram shall be as specified on f

36、igure 3. 3.2.5 Radiation exposure circuit. The terminal connections shall be as specified on figure I. The radiation exposure circuit shall be specified when available. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5b2-9b REV A = b 0023Y48 7OY

37、= DESC FORM 193A JUL 91 3.11 Serialization for device class S. All device class S devices shall be serialized in accordance with IIIL-PI-38510. STANDARDIZED SIZE 5962-90996 MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL SHEET 3.2.6 Input/output data format. Th

38、e input/output data format shall be as specified on figure 4. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall appl

39、y over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified 1n table IIA The electrical tests for each subgroup are defined in table I. 3.5 Markinq. The part shall be marked with the PIN listed in 1.2 herein. M

40、arking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). MIL-BUL-103. GI and V shall be in accordance with MIL-1-38535. In addition, the manufacturers PIN may also be marked as listed in Marking for device classes B and S shall be in accordance with MIL-M-38510. Marking fo

41、r device classes 3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a “C“ as required in MIL-STD-883 (see 3.1 herein). in MIL-M-38510. The certification mark for device classes E and S shall be a “J“ or “JAN“ as required The certification mark for device classes Q a

42、nd V shall be a “QML“ as required in MIL-1-38535. 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). classes Q and V, a certificate of compliance

43、 shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.2 herein). listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class M the requirements of MIL-STD-883 (see 3.1 h

44、erein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. For device The certificate of compliance submitted to DESC-ECC prior to 3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein) or d

45、evice classes B and S in MIL-M-38510 or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of chanqe for device class M. For device class M, notification to DESC-ECC of change of product (see 6.2 herein) involving de

46、vices acquired to this drawing is required for any change as defined in MIL-STD-480. 3.9 Verification and review for device class M. For device class M, DESC, DESCs agent, and the acquiring activity Offshore documentation retain the option to review the manufacturers facility and applicable required

47、 documentation. sha:L be made available onshore at the option of the reviewer. 3.10 Microcircuit qroup assignment for device classes M, 6, and S. Device classes M, B, and S devices covered by thi; drawing shall be in microcircuit group number 105 (see MIL-M-38510, appendix E). I I I Provided by IHSN

48、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-9099b REV A W 999939b 0023449 640 = I I TABLE 1. Electrical performance characteristics. I I Unit I I I subgroups I type I _I I I I I I Conditions I/ Group A /Device I Limits I I Test I Symbol 1 I I 55C C TC 9

49、 t125OC I I 4.5 v 5 VOD 5 5.5 v I iirilpc-.oi)ierwisespecified 1 1 1 Min tlax I I I current, . low Supply current, loaded current, high I IDDL I I current i IIL Input current, low I STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I Input current, high I IIH I SIZE 5962-90996 A REVISION LEVEL SHEET Input current I I IIX 3ut put voltage, low I 1 I l I I I I I I 3utput volta