DLA SMD-5962-90946 REV D-1996 MICROCIRCUIT DIGITAL 32-BIT MICROPROCESSOR FLOATING POINT UNIT AND MEMORY MANAGEMENT UNIT MONOLITHIC SILICON《硅单块 浮点装置和存储管理装置 32比特微处理器 数字微型电路》.pdf

《DLA SMD-5962-90946 REV D-1996 MICROCIRCUIT DIGITAL 32-BIT MICROPROCESSOR FLOATING POINT UNIT AND MEMORY MANAGEMENT UNIT MONOLITHIC SILICON《硅单块 浮点装置和存储管理装置 32比特微处理器 数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90946 REV D-1996 MICROCIRCUIT DIGITAL 32-BIT MICROPROCESSOR FLOATING POINT UNIT AND MEMORY MANAGEMENT UNIT MONOLITHIC SILICON《硅单块 浮点装置和存储管理装置 32比特微处理器 数字微型电路》.pdf（36页珍藏版）》请在麦多课文档分享上搜索。

1、NOTICE OF REVISION (NOR)THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENTLISTED.1. DATE(YYMMDD)96-06-18Form ApprovedOMB No. 0704-0188Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewinginstructions, searching exis

2、ting data sources, gathering and maintaining the data needed, and completing and reviewing thecollection of information. Send comments regarding this burden estimate or any other aspect of this collection of information,including suggestions for reducing this burden, to Department of Defense, Washin

3、gtion Headquarters Services, Directorate forInformation Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office ofManagement and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503.PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EIT

4、HER OF THESE ADDRESSED. RETURN COMPLETEDFORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITYNUMBER LISTED IN ITEM 2 OF THIS FORM.2. PROCURINGACTIVITY NO.3. DODAAC4. ORIGINATORb. ADDRESS (Street, City, State, Zip Code)Defense Electronics Supply Center1507 Wilmington

5、 PikeDayton, OH 45444-57655. CAGE CODE672686. NOR NO.5962-R145-96a. TYPED NAME (First, MiddleInitial,Last)7. CAGE CODE672688. DOCUMENT NO.5962-909469. TITLE OF DOCUMENTMICROCIRCUIT, DIGITAL, 32-BIT MICROPROCESSOR,FLOATING POINT UNIT AND MEMORY MANAGEMENT UNIT, MONOLITHIC SILICON10. REVISION LETTER11

6、. ECP NO.N/Aa. CURRENTCb. NEWD12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIESAll13. DESCRIPTION OF REVISIONSheet 1: Revisions ltr column; add “B“.Revisions description column; add “Changes in accordance with NOR 5962-R145-96“.Revisions date column; add “96-06-18“.Revision level block; change

7、 from “C“ to D“.Rev status of sheets; for sheet 1, 8 change from “C“ to “D“. Sheet 8: Add the following: Note: A terminal 1 identification mark shall be located in the index corner. However, terminal 1 shall be located on the first side clockwise from the index corner and is the terminal in the cent

8、er of the side. Terminal numbers shall increase in a counterclockwise direction when viewed from the top (See figure 2).Change status of revision level to “D“.14. THIS SECTION FOR GOVERNMENT USE ONLYa. (X one)X (1) Existing document supplemented by the NOR may be used in manufacture.(2) Revised docu

9、ment must be received before manufacturer may incorporate this change.(3) Custodian of master document shall make above revision and furnish revised document.b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENTDESC-ELDc. TYPED NAME (First, Middle Initial, Last)Monica L. Poelkingd. TITLEChief, Cus

10、tom Microelectronicse. SIGNATUREMonica L. Poelkingf. DATE SIGNED(YYMMDD)96-06-1815a. ACTIVITY ACCOMPLISHING REVISIONDESC-ELDb. REVISION COMPLETED (Signature)Thomas M. Hessc. DATE SIGNED(YYMMDD)96-06-18DD Form 1695, APR 92 Previous editions are obsolete.Provided by IHSNot for ResaleNo reproduction or

11、 networking permitted without license from IHS-,-,-NOTICE OF REVISION (NOR)THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED.1. DATE(YYMMDD)93-11-04Form ApprovedOMB No. 0704-0188Public reporting burden for this collection is estimated to average 2 hours per response, includin

12、g the time for reviewinginstructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing thecollection of information. Send comments regarding this burden estimate or any other aspect of this collection of information,including suggestions for re

13、ducing this burden, to Department of Defense, Washingtion Headquarters Services, Directorate forInformation Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office ofManagement and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 2

14、0503.PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EITHER OF THESE ADDRESSED. RETURN COMPLETEDFORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITYNUMBER LISTED IN ITEM 2 OF THIS FORM.2. PROCURINGACTIVITY NO.3. DODAAC4. ORIGINATORb. ADDRESS (Street, City, State, Zip C

15、ode)Defense Electronics Supply Center1507 Wilmington PikeDayton, OH 45444-57655. CAGE CODE672686. NOR NO.5962-R012-96a. TYPED NAME (First, Middle Initial,Last)7. CAGE CODE672688. DOCUMENT NO.5962-909469. TITLE OF DOCUMENTMICROCIRCUIT, DIGITAL, 32-BIT MICROPROCESSOR, FLOATING POINT UNIT AND MEMORY MA

16、NAGEMENT UNIT, MONOLITHIC SILICON10. REVISION LETTER11. ECP NO.a. CURRENTBb. NEWC12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIESAll13. DESCRIPTION OF REVISIONSheet 1: Revisions ltr column; add “C“.Revisions description column; add “Changes in accordance with NOR 5962-R012-94“.Revisions date

17、column; add “93-11-04“.Revision level block; add “C“.Rev status of sheets; For sheets 1, 13, and 14 add “C“.Sheet 13: Figure 2. Terminal connections: Change signal pin# 1 from:BE to: BE .0 0Change signal pin# 2 from: BE to:BE .33Change signal pin# 3 from: READY to: READY.Change signal pin# 4 from: B

18、E to: BE .11Change signal pin# 6 from: DT/R to:DT/RChange signal pin# 8 from: W/R to: W/R.Change signal pin# 13 from: ALE to: ALE.Change signal pin # 15 from: ADS to: ADS.Revison level block; add“C“.14. THIS SECTION FOR GOVERNMENT USE ONLYa. (X one)X (1) Existing document supplemented by the NOR may

19、 be used in manufacture.(2) Revised document must be received before manufacturer may incorporate this change.(3) Custodian of master document shall make above revision and furnish revised document.b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENTDESC-ECCc. TYPED NAME (First, Middle Initial, L

20、ast)Monica L. Poelkingd. TITLEChief, Custom Microelectronicse. SIGNATUREMonica L. Poelkingf. DATE SIGNED(YYMMDD)93/11/0415a. ACTIVITY ACCOMPLISHING REVISIONDESC-ECCb. REVISION COMPLETED (Signature)Jeffery Tunstallc. DATE SIGNED(YYMMDD)93/11/04DD Form 1695, APR 92 Previous editions are obsolete.Provi

21、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-G0D Document No.: 5902-90946G0D Revision: CG0D NOR No.: 5962-R1012-94G0D Sheet: 1 of 2 G0D 10. Description of Revision- Continued.Change signal pin # 28 from: BADAC to: BACDC.Change signal pin # 56 from: LAD

22、 to LAD . 10Change signal pin # 58 from: INT to INT . 33Change signal pin # 75 from: INT to INT . 00Change signal pin # 160 from: LOCK to LOCK. Change signal pin # 161 from: FAIL to FAIL. Change signal pin # 162 from: DEN to DEN. Change signal pin # 163 from: BE to BE . 2Revision level block; add “C

23、“.Sheet 14: Figure 2. Terminal connections:Change signal pin # 1 from: BE to: BE .00Change signal pin # 2 from: BE to: BE .33 Change signal pin # 3 from: READY to: READY .Change signal pin # 4 from: BE to: BE .11 Change signal pin # 6 from:DT/R to: DT/R.Change signal pin # 8 from: W/R to: W/R.Change

24、 signal pin # 13 from: ALE to: ALE.Change signal pin # 15 from: ADS to: ADS.Change signal pin # 28 from: BADAC to: BADAC.Change signal pin # 56 from: LAD to:LAD .10Change signal pin # 58 from: INT to: INT .33Change signal pin # 75 from: INT to: INT .00Change signal pin # 160 from: LOCK to: LOCK.Chan

25、ge signal pin # 161 from: FAIL to: FAIL.Change signal pin # 162 from: DEN to: DEN.Change signal pin # 163 from: BE to: BE .2Revision level block; add “C“.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVE

26、DABAdd case outline Y, correct associated paragraphs and tables. Editorialchanges throughout.Add device 04, 05, 06. Editorial changes throughout.92-06-2493-02-12Tim Noh Monica PoelkingTHE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACEDREV SHEETREVBBBBBBBBBBBBBBBBBBSHEET15 16 17 18 19 20 21 22

27、23 24 25 26 27 28 29 30 31 32REV STATUSOF SHEETSREVBBBBBBBBBBBBBBSHEET123456789101121314PMIC N/APREPARED BY Christopher A. Rauch DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 STANDARDIZEDMILITARYDRAWINGTHIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAND AGENCIES OF THEDEPARTMENT OF DEFENSEA

28、MSC N/A CHECKED BY Tim NohMICROCIRCUIT, DIGITAL, 32-BIT MICROPROCESSOR,FLOATING POINT UNIT AND MEMORY MANAGEMENT UNIT,MONOLITHIC SILICONAPPROVED BY William K. HeckmanDRAWING APPROVAL DATE91/05/30SIZEACAGE CODE672685962-90946REVISION LEVELBSHEET 1 OF 32DESC FORM 193JUL 91 5962-E096-93DISTRIBUTION STA

29、TEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-90946REVISION LEVELBSHEET2DESC FORM 193AJUL 911. SCO

30、PE1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two productassurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), anda choice of case outlines and lead finish

31、es are available and are reflected in the Part or Identifying Number (PIN). Device class Mmicrocircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883in conjunction with compliant non-JAN devices“. When available, a choice of r

32、adiation hardness assurance (RHA) levels are reflectedin the PIN.1.2 PIN. The PIN shall be as shown in the following example:5962 - 90946 01 M X X | | | | | | | | | | | | | | | | Federal RHA Device Device Case Leadstock class designator type class outline finishdesignator (see 1.2.1) (see 1.2.2) des

33、ignator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number1.2.1 Radiation hardness assurance (RHA) designator. Device classes M, B, and S RHA marked devices shall meet theMIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA markedde

34、vices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicatesa non-RHA device.1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:Device type Generic number Circuit function Speed01 80960MC-16 3

35、2-bit microprocessor with floating point and MMU 16 MHz02 80960MC-20 32-bit microprocessor with floating point and MMU 20 MHz03 80960MC-25 32-bit microprocessor with floating point and MMU 25 MHz04 80960XA-16 32-bit microprocessor with floating point and MMU 16 MHz 1/05 80960XA-20 32-bit microproces

36、sor with floating point and MMU 20 MHz 1/06 80960XA-25 32-bit microprocessor with floating point and MMU 25 MHz 1/1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as follows:Device class Device requirements documentationM Ven

37、dor self-certification to the requirements for non-JAN class Bmicrocircuits in accordance with 1.2.1 of MIL-STD-883B or S Certification and qualification to MIL-M-38510Q or V Certification and qualification to MIL-I-385351.2.4 Case outline(s). For device classes M, B, and S, case outline(s) shall me

38、et the requirements in appendix C of MIL-M-38510and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C ofMIL-M-38510, and as listed below.Outline letter Case outlineX P-AF (132-pin, 1.480“ x 1.480“ x .345“), pin grid array packageY See

39、 figure 1 (164-terminal, 1.140“ x 1.140“ x .115“), leaded chip carrier with unformed leads.1/ Devices 04, 05 and 06 have a 33rd tag bit to distinguish data from object pointer.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMILITARY DRAWINGDE

40、FENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-90946REVISION LEVELBSHEET3DESC FORM 193AJUL 911.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V.Finish letter “X“ shall not be marked on the microcircuit or its

41、 packaging. The “X“ designation is for use in specifications when leadfinishes A, B, and C are considered acceptable and interchangeable without preference.1.3 Absolute maximum ratings. 2/Storage temperature range - -65G28C to +150G28CVoltage on any pin with respect to ground - -0.5 V to V +0.5 VCCP

42、ower dissipation (P ) - - - - - - - - - - - - - - - - - - 2.6 WDLead temperature (soldering, 10 seconds) - - - - - - - - +275G28CThermal resistance, junction-to-case (G14 ) - - - - - - - See MIL-STD-1835 JCCase Y - - - - - - - - - - - - - - - - - - - - - - - - 8G28C/WJunction temperature (T ) - - -

43、- - - - - - - - - - - - - - +150G28CJ1.4 Recommended operating conditions.Case operating temperature range (T ) - - - - - - - - - - -55G28C to +125G28CCSupply voltage (V ) - - - - - - - - - - - - - - - - - - - 4.75 V dc to 5.25 V dcCC1.5 Digital logic testing for device classes Q and V.Fault coverag

44、e measurement of manufacturinglogic tests (MIL-STD-883, test method 5012) - - - - - - - XX percent 2/2. APPLICABLE DOCUMENTS2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards,bulletin, and handbook of the issue listed

45、 in that issue of the Department of Defense Index of Specifications and Standards specifiedin the solicitation, form a part of this drawing to the extent specified herein.SPECIFICATIONSMILITARYMIL-M-38510 - Microcircuits, General Specification for.MIL-I-38535 - Integrated Circuits, Manufacturing, Ge

46、neral Specification for.STANDARDSMILITARYMIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers.MIL-STD-883 - Test Methods and Procedures for Microelectronics.MIL-STD-1835 - Microcircuit Case Outlines.BULLETINMILITARYMIL-BUL-103 - List of Standardized Military Drawings (SMDs).HANDBOOKMILITARYMIL-HDBK-780 - Standardized Military Drawings.(Copies of the specifications, stan