DLA SMD-5962-90522 REV B-2002 MICROCIRCUIT LINEAR DUAL PERIPHERAL DRIVER MONOLITHIC SILICON《硅单片 双重外围驱动器 线性微型电路》.pdf
《DLA SMD-5962-90522 REV B-2002 MICROCIRCUIT LINEAR DUAL PERIPHERAL DRIVER MONOLITHIC SILICON《硅单片 双重外围驱动器 线性微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-90522 REV B-2002 MICROCIRCUIT LINEAR DUAL PERIPHERAL DRIVER MONOLITHIC SILICON《硅单片 双重外围驱动器 线性微型电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes made to IOH, VOL, tPHL, and tPLHtests in table I. Deleted VOHtest in table I. Added vendor CAGE 0DKS7. - rrp 02-02-01 R. MONNIN B Add case outline X. - ro 02-08-21 R. MONNIN REV SHET REV SHET REV STATUS REV B B B B B B B B B B B B OF SHEE
2、TS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT
3、, LINEAR, DUAL PERIPHERAL DRIVER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-01-16 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-90522 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E532-02 DISTRIBUTION STATEMENT A. Approved for public release; distributi
4、on is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90522 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing
5、describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-90522 01 G X Drawing number Device type (see 1.2.1) Case outlin
6、e (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 DS1632 Dual NAND peripheral driver, CMOS compatible 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and
7、 as follows: Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can P GDIP1-T8 or CDIP2-T8 8 Dual-in-line X See figure 1 8 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) 16 V dc
8、Input voltage range (VIN) -0.3 V dc to VCC+ 0.3 V dc Output voltage 56 V dc Storage temperature range . -65C to +150C Maximum power dissipation: 1/ Case G 787 mW Cases P and X 1133 mW Lead temperature (soldering, 10 seconds) . +260C Junction temperature (TJ) . +175C Thermal resistance, junction-to-c
9、ase (JC) Cases G and P See MIL-STD-1835 Case X 90C/W 1.4 Recommended operating conditions. Case operating temperature range (TA) . -55C to +125C Operating supply voltage range (VCC) . 4.5 V dc to 15 V dc 1/ For cases P and X, derate 7.6 mW/C above TA= +25C; for case G, derate 5.2 mW/C above TA= +25C
10、. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90522 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specifica
11、tion, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards
12、 (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electron
13、ic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order D
14、esk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regul
15、ations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified
16、 Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-3
17、8535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in a
18、ccordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be i
19、n accordance with 1.2.2 herein and figure 1 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Test circuits and switching waveforms. The test circuits and switching waveforms shall be as
20、 specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking
21、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90522 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. 1/ Test Symbol Conditions -55C TA +125C unless otherwise spe
22、cified Group A subgroups Device type Limits Unit Min Max VCC= 5 V, see figure 4 3.5 VCC= 10 V, see figure 4 8.0 High-level input voltage VIHVCC= 15 V, see figure 4 1,2,3 01 12.5 V VCC= 5 V, see figure 4 1.5 VCC= 10 V, see figure 4 2.0 Low-level input voltage VILVCC= 15 V, see figure 4 1,2,3 01 2.5 V
23、 High-level output current IOHVIN= 2.5 V (all inputs), VCC= 15 V, VOUT= 54 V, see figure 4 1,2,3 01 250 A VIN= 3.5 V (all inputs), VCC= 4.5 V, IOL= 100 mA, see figure 4 1.1 Low-level output voltage VOLVIN= 3.5 V (all inputs), VCC= 4.5 V, IOL= 300 mA, see figure 4 1,2,3 01 1.4 V High level input curr
24、ent IIHVIN= 15 V, VCC= 15 V, other input of driver = 0.0 V, see figure 4 1,2,3 01 10 A VIN= 0.4 V, VCC= 15 V, other input of driver = 15 V, see figure 4 -360 Low level input current IILVIN= 0.4 V, VCC= 5 V, other input of driver = 5 V, see figure 4 1,2,3 01 -115.5 A Functional tests See 4.3.1c 7,8 0
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