DLA SMD-5962-89921 REV B-2009 MICROCIRCUIT LINEAR PRECISION MULTI-CURRENT ZENER REFERENCE MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - ro 01-01-17 R. MONNIN B Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 09-09-15 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET
2、REV STATUS REV B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 PMIC N/A PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE
3、 CHECKED BY CHARLES E. BESORE APPROVED BY MONICA L. POELKING MICROCIRCUIT, LINEAR, PRECISION, MULTI-CURRENT, ZENER, REFERENCE, MONOLITHIC SILICON DRAWING APPROVAL DATE 90-04-19 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89921 SHEET 1 OF 7 DSCC FORM 2233 APR 97 5962-E481-09 Provided by IHS
4、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89921 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements fo
5、r MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89921 01 X A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2
6、.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LM129A 6.9 volt precision reference 02 LM129B 6.9 volt precision reference 03 LM129C 6.9 volt precision reference 1.2.2 Case outline(s). The case outline(s) are as des
7、ignated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 2 TO-46 metal can 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Reverse breakdown current (IR) . 30 mA Forward current
8、 (IF) 2 mA Power dissipation (PD) . 210 mW Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . 300C Thermal resistance, junction-to-case (JC) . 80C/W Thermal resistance, junction-to-ambient (JA) 440C/W 1.4 Recommended operating conditions. Reverse breakdown current (
9、IR) . 0.6 mA to 15 mA Ambient operating temperature range (TA) -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89921 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHE
10、ET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in th
11、e solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPAR
12、TMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
13、 Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption ha
14、s been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified
15、 and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in
16、the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is requi
17、red to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein and figu
18、re 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperat
19、ure range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the P
20、IN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A complianc
21、e indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleN
22、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89921 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+
23、125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Reverse breakdown voltage VR0.6 mA IR 15 mA, TA= +25C 1 All 6.7 7.2 V Reverse breakdown change with current VR(I) 0.6 mA IR 15 mA, TA= +25C 1 All 14 mV RMS noise VN10 Hz F 10 kHz, TA= +25C 4 All 20 V Quiescent current
24、IQTA= +25C 1 All 0.6 mA Zener peak noise 1/ VNPK10 Hz F 10 kHz, TA= +25C 4 All 80 V Forward voltage VFIF= 1 mA, TA= +25C 1 All -1 -0.2 V Temperature coefficient TCIR= 1.0 mA, 2,3 01 -12.4 12.4 mV TA= +125C, -55C 02 -24.8 24.8 03 -62.1 62.1 1/ If not tested, shall be guaranteed to the limits specifie
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