DLA SMD-5962-89920 REV C-2011 MICROCIRCUIT LINEAR PROGRAMMABLE PULSE WIDTH MODULATOR MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - ro 01-01-17 R. MONNIN B Make correction to max limit for VREFin table I from 5.05 to 5.10. Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. -rrp 04-10-14 R. MONNIN C Update draw
2、ing to current requirements of MIL-PRF-38535. -rrp 11-07-19 C. SAFFLE REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY MARCIA B. KELLEHER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil S
3、TANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY SANDRA ROONEY APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, PROGRAMMABLE PULSE WIDTH MODULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-08-25 AMSC N/A REVISI
4、ON LEVEL C SIZE A CAGE CODE 67268 5962-89920 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E440-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89920 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEV
5、EL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
6、5962-89920 01 V A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 UC1840 Programmable, off-line, PWM controller 02 UC1841 Programm
7、able, off-line, PWM controller 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style V GDIP1-T18 or CDIP2-T18 18 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead f
8、inish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Input voltage (+VIN): Voltage driven . +32 V dc Current driven, 100 mA maximum . Self-limiting PWM output voltage . 40 V PWM output current, steady-state 400 mA PWM output peak energy discharge . 20 J Driver bias cu
9、rrent -200 mA Reference output current -50 mA Slow-start sink current 20 mA VINsense current . 10 mA Current limit inputs -0.5 V to +5.5 V Comparator inputs: Device type 01 -0.3 V to +32 V Device type 02 Internally clamped at 12 V Stop input, device type 02 -0.3 V to +5.5 V 1/ All voltages are with
10、respect to GND. Currents are positive-into, negative-out of the specified terminal. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89920 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET
11、 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings continued. 1/ Power dissipation, (PD) TA= 25C . 1 W 2/ Power dissipation, (PD) TC= 25C . 2 W 3/ Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +150C Thermal resistance, junct
12、ion-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) 100C/W 1.4 Recommended operating conditions. Input voltage (VIN) 20 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The follo
13、wing specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing,
14、General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircu
15、it Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing
16、 and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 2/ Derate at 10 mW/C for TAabove 50C. 3/ Derate at 16 mW/C for TCabove 25C. Provided by IHSNot for
17、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89920 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be
18、in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to M
19、IL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifica
20、tions shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimension
21、s. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic dia
22、grams. The logic diagrams shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test re
23、quirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addit
24、ion, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked o
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