DLA SMD-5962-89695-1990 MICROCIRCUITS DIGITAL HIGH SPEED CMOS DUAL J-K FLIP FLOP MONOLITHIC SILICON《硅单片 双重J-K触发器 高速氧化物半导体数字微型电路》.pdf

《DLA SMD-5962-89695-1990 MICROCIRCUITS DIGITAL HIGH SPEED CMOS DUAL J-K FLIP FLOP MONOLITHIC SILICON《硅单片 双重J-K触发器 高速氧化物半导体数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-89695-1990 MICROCIRCUITS DIGITAL HIGH SPEED CMOS DUAL J-K FLIP FLOP MONOLITHIC SILICON《硅单片 双重J-K触发器 高速氧化物半导体数字微型电路》.pdf（13页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDREV SHEETREVSHEET REV STATUSOF SHEETSREVSHEET 1 2 3 4 5 6 7 8 9 10 11 12 13PMIC N/APREPARED BY Larry T. Gauder DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 STANDARDIZEDMILITARYDRAWINGTHIS DRAWING IS AVAILABLEFOR USE BY ALL DEPARTMENTSAND AGENC

2、IES OF THEDEPARTMENT OF DEFENSEAMSC N/A CHECKED BYThomas S. RiccutiMICROCIRCUITS, DIGITAL, HIGH SPEEDCMOS, DUAL J-K FLIP FLOP, MONOLITHICSILICONAPPROVED BYMichael A. FryeDRAWING APPROVAL DATE 9 APRIL1990SIZEACAGE CODE672685962-89695REVISION LEVELSHEET 1 OF 13DESC FORM 193 * US GOVERNMENT PRINTING OF

3、FICE: 1987-748-129/60912SEP 87 5962-E1347DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444S

4、IZEA5962-89695REVISION LEVEL SHEET2DESC FORM 193ASEP 871. SCOPE1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883,“Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“.1.2 Part number. The complete p

5、art number shall be as shown in the following example:5962-89695 01 C X G0DG0DG0D G0DG0D G0D G0D G0D Drawing number Device type Case outline Lead finish per(1.2.1) (1.2.2) MIL-M-385101.2.1 Device types. The device type shall identify the circuit function as follows:Device type Generic number Circuit

6、 function01 54HC113 Dual, negative edge triggered J-K flip flop with asynchronouspreset1.2.2 Case outlines. The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:Outline letter Case outlineC D-1 (14-lead, .785“ x .310“ x .200“), dual-in-line package2 C-2 (20-terminal,

7、 .358“ x .358“ x .100“), square chip carrier package1.3 Absolute maximum ratings. 1/Supply voltage range - -0.5 V dc to +7.0 V dcDC input voltage range - -0.5 V dc to V +0.5 V dcCCDC output voltage range- -0.5 V dc to V +0.5 V dcCCClamp diode current- 20 mA DC output current (per pin)- 25 mA DC V or

8、 GND current (per pin) - 50 mACCStorage temperature range- -65G28C to +150G28CMaximum power dissipation, (P ) - 500 mWDLead temperature (soldering, 10 seconds) - +260G28CThermal resistance, junction-to-case (G14 ) - See MIL-M-38510, appendix C.JCJunction temperature (T ) 2/- +175G28CJ1.4 Recommended

9、 operating conditions.Supply voltage range (V ) - +2.0 V dc to +6.0 V dcCCCase operating temperature range (T )- -55G28C to +125G28CCInput rise and fall times:V = 2.0 V - 0 to 500 ns CCV = 4.5 V - 0 to 500 ns CCV = 6.0 V - 0 to 400 ns CCInput voltage (V ) - 0 V dc to VIN CCOutput voltage (V )- 0 V d

10、c to VOUT CC1/ Unless otherwise specified all voltages are referenced to GND.,2/ For TC = +100 to +125G28C, derate linearly at 12 mW/G28C.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAY

11、TON, OHIO 45444SIZEA5962-89695REVISION LEVEL SHEET3DESC FORM 193ASEP 87Minimum setup time, J or K to clock (t ):sTC = +25G28C, V = 2.0 V - 100 nsCCV = 4.5 V - 20 nsCCV = 6.0 V - 17 nsCCTC = -55G28C/+125G28C, V = 2.0 V - 150 nsCCV = 4.5 V - 30 nsCCV = 6.0 V - 26 nsCCMinimum recovery time, set inactiv

12、e to clock (t ):recTC = +25G28C, V = 2.0 V - 100 nsCCV = 4.5 V - 20 nsCCV = 6.0 V - 17 nsCCTC = -55G28C/+125G28C, V = 2.0 V - 150 nsCCV = 4.5 V - 30 nsCCV = 6.0 V - 26 nsCCMinimum clock pulse width (t ):w1TC = +25G28C, V = 2.0 V - 80 nsCCV = 4.5 V - 16 nsCCV = 6.0 V - 14 nsCCTC = -55G28C/+125G28C, V

13、 = 2.0 V - 120 nsCCV = 4.5 V - 24 nsCCV = 6.0 V - 20 nsCCMinimum set pulse width (t ):w2TC = +25G28C, V = 2.0 V - 100 nsCCV = 4.5 V - 20 nsCCV = 6.0 V - 17 nsCCTC = -55G28C/+125G28C, V = 2.0 V - 150 nsCCV = 4.5 V - 30 nsCCV = 6.0 V - 26 nsCCMinimum hold time, clock to J or K (t ):hTC = +25G28C, V =

14、2.0 V - 25 nsCCV = 4.5 V - 5 nsCCV = 6.0 V - 5 nsCCTC = -55G28C/+125G28C, V = 2.0 V - 40 nsCCV = 4.5 V - 8 nsCCV = 6.0 V - 7 nsCCMinimum clock frequency (f ):maxTC = +25G28C, V = 2.0 V - 5.4 MHzCCV = 4.5 V - 27 MHzCCV = 6.0 V - 32 MHzCCTC = -55G28C/+125G28C, V = 2.0 V - 3.6 MHZCCV = 4.5 V - 18 MHzCC

15、V = 6.0 V - 21 MHzCCProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-89695REVISION LEVEL SHEET4DESC FORM 193ASEP 872. APPLICABLE DOCUMENTS2.1 Government specifica

16、tion, standard, and bulletin. Unless otherwise specified, the following specification, standard, andbulletin of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in thesolicitation, form a part of this drawing to the extent specified herein.S

17、PECIFICATIONMILITARYMIL-M-38510 - Microcircuits, General Specification for.STANDARDMILITARYMIL-STD-883 - Test Methods and Procedures for Microelectronics.BULLETINMILITARYMIL-BUL-103 - List of Standardized Military Drawings (SMDs).(Copies of the specification, standard and bulletin required by manufa

18、cturers in connection with specific acquisition functionsshould be obtained from the contracting activity or as directed by the contracting activity.)2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text ofthis drawing shall ta

19、ke precedence.3. REQUIREMENTS3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, “Provisions for theuse of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein.3.2 1 Design, construction, and physical dimensions. The

20、 design, construction, and physical dimensions shall be as specified inMIL-M-38510 and herein.3.2.2 Terminal connections. The terminal connections table shall be as specified on figure 1.3.2.3 Truth table. The truth table shall be as specified on figure 2.3.2.4 Case outlines. The case outlines shall

21、 be in accordance with 1.2.2 herein.3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are asspecified in table I and apply over the full case operating temperature range.3.4 Electrical test requirements. The electrical test requ

22、irements shall be the subgroups specified in table II. The electrical testsfor each subgroup are described in table I.3.5 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall be marked with the partnumber listed in 1.2 herein. In addition, the manufacturers part

23、number may also be marked as listed in MIL-BUL-103 (see 6.6herein).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-89695REVISION LEVEL SHEET5DESC FORM 193ASEP 87

24、TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/-55G28C G06 T G06 +125G28CCunless otherwise specifiedGroup AsubgroupsLimits UnitMin MaxHigh level outputvoltageVOHV = V minimumIN IHor V maximumILG0DI G0D G06 20 G29A OV = 2.0 VCC1, 2, 3 1.9 VV = 4.5 VCC4.4V = 6.0 VCC5.9V = V

25、minimumIN IHor V maximumILG0DI G0D G06 4.0 mA OV = 4.5 VCC3.7V = V minimumIN IHor V maximumILG0DI G0D G06 5.2 mA OV = 6.0 VCC5.2Low level outputvoltageVOLV = V minimumIN IHor V maximumILG0DI G0D G06 20 G29A OV = 2.0 VCC1, 2, 3 0.1 VV = 4.5 VCC0.1V = 6.0 VCC0.1V = V minimumIN IHor V maximumILG0DI G0D

26、 G06 4.0 mA OV = 4.5 VCC0.4V = V minimumIN IHor V maximumILG0DI G0D G06 5.2 mA OV = 6.0 VCC0.4High level inputvoltageVIH2/ V = 2.0 VCC1, 2, 3 1.5 VV = 4.5 VCC3.15V = 6.0 VCC4.2See footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-

27、,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-89695REVISION LEVEL SHEET6DESC FORM 193ASEP 87TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions-55G28C G06 T G06 +125G28CCunless otherwise specifiedGroup AsubgroupsLimits Un

28、itMin MaxLow level inputvoltageVIL2/ V = 2.0 VCC1, 2, 3 0.3 VV = 4.5 VCC0.9V = 6.0 VCC1.2Input capacitance CINSee 4.3.1c 4 10 pFQuiescent current ICCV = 6.0 V, V = V or GNDCC IN CC1, 2, 3 80 G29AInput leakage current IINV = 6.0 V, V = V or GNDCC IN CC1, 2, 3 1 G29AFunctional tests See 4.3.1d 7Propag

29、ation delay time; clock to Q or QG09t,PHL1tPLH1C = 50 pFLSee figure 3 3/V = 2.0 VCC910, 11170225nsV = 4.5 VCC910, 113045V = 6.0 VCC910, 112638Propagation delay time; set to Q or QG09t,PHL2tPLH2C = 50 pFLSee figure 3 3/V = 2.0 VCC910, 11165250nsV = 4.5 VCC910, 113350V = 6.0 VCC910, 112843Transition t

30、ime, any outputt,THLtTLHC = 50 pFLSee figure 3 4/V = 2.0 VCC910, 1175110nsV = 4.5 VCC910, 111522V = 6.0 VCC910, 111319See footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY

31、 CENTERDAYTON, OHIO 45444SIZEA5962-89695REVISION LEVEL SHEET7DESC FORM 193ASEP 871/ For a power supply of 5 V 10%, the worse case output voltages (V and V ) occur for HC at 4.5 V. Thus, the 4.5 VOH OLvalues should be used when designing with this supply. Worst case V and V occur at V = 5.5 V and 4.5

32、 V respectively. IH IL CC(The V value at 5.5 V is 3.85 V.) The worst case leakage current (I , I , and I ) occur for CMOS at the higher voltageIH IN CC OZand so the 6.0 V values should be used. Power dissipation capacitance (C ), typically 40 pF, determines the no loadPDdynamic power consumption, P

33、= C V 2f + I V , and the no load dynamic current consumption, I = C V f +DPDC CC SPDCI.CC2/ V and V tests are not required and shall be applied as forcing functions for V or V .IH IL OH OL3/ AC testing at V = 2.0 V and V = 6.0 V shall be guaranteed, if not tested, to the specified limits.CC CC4/ Tra

34、nsition times (t , t ), if not tested, shall be guaranteed to the specified limits.TLH THL3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as anapproved source of supply in 6.4. The certificate of compliance submitted to DESC-ECS

35、prior to listing as an approved source ofsupply shall state that the manufacturers product meets the requirements of MIL-STD-883 (see 3.1 herein) and the requirementsherein.3.7 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 herein) shall be provided with

36、each lot of microcircuits delivered to this drawing.3.8 Notification of change. Notification of change to DESC-ECS shall be required in accordance with MIL-STD-883 (see 3.1herein).3.9 Verification and review. DESC, DESCs agent, and the acquiring activity retain the option to review the manufacturers

37、 facilityand applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer.4. QUALITY ASSURANCE PROVISIONS4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with section 4 of MIL-M-38510 to theextent specif

38、ied in MIL-STD-883 (see 3.1 herein).4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices priorto quality conformance inspection. The following additional criteria shall apply:a. Burn-in test, method 1015 of MIL-STD-883.(1) Test condit

39、ion A, B, C, or D using the circuit submitted with the certificate of compliance (see 3.6 herein).(2) T = +125G28C, minimum.Ab. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter testsprior to burn-in are optional at the discret

40、ion of the manufacturer.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-89695REVISION LEVEL SHEET8DESC FORM 193ASEP 87Device type 01Case outlines C 2Terminal num

41、ber Terminal Symbol1234567891011121314151617181920Clock 1K1J1Set 1Q1QG091G09GNDQG092G09Q2Set 2J2K2Clock 2VCC- - - - - - - - -NCClock 1K1J1NCSet 1NCQ1QG091G09GNDNCQG092G09Q2Set 2NCJ2NCK2Clock 2VCCFIGURE 1. Terminal connections.Provided by IHSNot for ResaleNo reproduction or networking permitted witho

42、ut license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444SIZEA5962-89695REVISION LEVEL SHEET9DESC FORM 193ASEP 87Inputs OutputSet Clock J K Q QG09LXX X H LHG1C L L No change H G1C LH L HHG1CHL H LHG1CH H ToggleH H X X No changeH L X X No changeH G1B X X

43、No changeH = High level voltageL = Low level voltage X = IrrelevantG1C = High to low transitionG1B = Low to high transitionFIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY C

44、ENTERDAYTON, OHIO 45444SIZEA5962-89695REVISION LEVEL SHEET10DESC FORM 193ASEP 87FIGURE 3. Test circuit and switching waveforms.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGDEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 4

45、5444SIZEA5962-89695REVISION LEVEL SHEET11DESC FORM 193ASEP 874.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 ofMIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.4.3.1 Group A inspection.a. Tests shall be as specified in table II herein.b. Subgroups 5, 6, and 8 in table I, method 5005 of MIL-STD-883, shall be omitted.c. Subgroup 4 (C measurements) shall be measured only for the initial test and after process or design changes whichINmay aff