DLA SMD-5962-89689 REV D-2010 MICROCIRCUIT DIGITAL ADVANCED CMOS QUAD 2-INPUT MULTIPLEXER WITH THREESTATE OUTPUTS TTL COMPATIBILE INPUTS MONOLITHIC SILICON.pdf
《DLA SMD-5962-89689 REV D-2010 MICROCIRCUIT DIGITAL ADVANCED CMOS QUAD 2-INPUT MULTIPLEXER WITH THREESTATE OUTPUTS TTL COMPATIBILE INPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89689 REV D-2010 MICROCIRCUIT DIGITAL ADVANCED CMOS QUAD 2-INPUT MULTIPLEXER WITH THREESTATE OUTPUTS TTL COMPATIBILE INPUTS MONOLITHIC SILICON.pdf(18页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device class V criteria. Editorial changes throughout - jak. 98-05-06 Monica L. Poelking B Add RHA limits. Editorial changes throughout jak. 99-03-10 Monica L. Poelking C Add device type 02. Make change to radiation features. Add vendor CAGE
2、F8859. Add case outline X. Add table III, delta limits. Update drawing to MIL-PRF-38535 requirements. Editorial changes throughout. jak 03-03-20 Thomas M. Hess D Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 10-02-12 Thomas M. Hess REV SHET REV D D D SHEET 15 16 17 R
3、EV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Marcia B. Kelleher DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AG
4、ENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Ray Monnin APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ADVANCED CMOS, QUAD 2-INPUT MULTIPLEXER WITH THREE- STATE OUTPUTS, TTL COMPATIBILE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 89-06-13 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5
5、962-89689 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E203-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89689 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 223
6、4 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN).
7、When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 R 89689 01 E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Case outline (see 1.
8、2.4)Lead finish (see 1.2.5) / /Drawing number For device class V: 5962 R 89689 01 V E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) /Drawing number 1.2.1 RHA designator. Device c
9、lasses Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-R
10、HA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT257 Quad 2-input multiplexer with three-state outputs, TTL compatible inputs 02 54ACT257 Quad 2-input multiplexer with three-state outputs, TTL compatible
11、 inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the
12、PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535
13、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89689 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as
14、 designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack X CDFP4-F16 16 Flat pack2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specif
15、ied in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V
16、dc Clamp diode current (IIK, IOK) . 20 mA DC output current (IOUT) (per pin) 50 mA DC VCCor GND current (ICC, IGND) (per pin) 100 mA Maximum power dissipation (PD) 500 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-c
17、ase (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) 4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) . +0.0 V dc to VCCMaximum low level input voltage (VIL) 0.8 V dc Minimum high l
18、evel input voltage (VIH) . 2.0 V dc Case operating temperature range (TC) . -55C to +125C Input rise or fall times (VCC= 4.5 V to 5.5 V) 0 to 8 ns/V 1.5 Radiation features. Device type 01: Maximum total dose available (dose rate = 50 300 rads (Si)/s) . 100 Krads (Si) No Single Event Latch-up (SEL) a
19、t LET =100 MeV/(mg/cm2) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Maximum junction temperature shall not be exceeded except for allowable short duration burn-in scre
20、ening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Provided by IHSNot for ResaleNo r
21、eproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89689 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The
22、 following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufactu
23、ring, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Micr
24、ocircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this
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