DLA SMD-5962-89681 REV D-2006 MICROCIRCUIT LINEAR OCTAL GENERAL INTERFACE BUS TRANSCEIVER MONOLITHIC SILICON《硅单片 总线收发器八位总接口 线性微型电路》.pdf
《DLA SMD-5962-89681 REV D-2006 MICROCIRCUIT LINEAR OCTAL GENERAL INTERFACE BUS TRANSCEIVER MONOLITHIC SILICON《硅单片 总线收发器八位总接口 线性微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89681 REV D-2006 MICROCIRCUIT LINEAR OCTAL GENERAL INTERFACE BUS TRANSCEIVER MONOLITHIC SILICON《硅单片 总线收发器八位总接口 线性微型电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes to recommended operating conditions and table I. Editorial changes throughout. 95-05-10 M. A. Frye B Changes in accordance with NOR 5962-R123-96. 96-05-10 M. A. Frye C Changes in accordance with NOR 5962-R056-97. 96-10-31 Raymond Monnin D
2、 Update drawing to current requirements. Incorporate NOR revisions A and B. Editorial changes throughout. - drw 06-01-09 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC
3、 N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, OCTAL GENERAL INTERFACE B
4、US TRANSCEIVER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-08-23 MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-89681 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E177-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without licens
5、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89681 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in acco
6、rdance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89681 01 R A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identifies the circuit functio
7、n as follows: Device type Generic number Circuit function 01 55ALS161 Octal general purpose interface bus transceiver 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 dual-in
8、 line S GDFP2-F20 or CDFP3-F20 20 flat pack 2 CQCC1-N20 20 square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) +7.0 V dc Input voltage +5.5 V dc Low level driver output current. 100 mA Contin
9、uous total dissipation TA +25C 1/ 1375 mW Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +150C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.75 V dc min to +5.25 V dc max Minimum high level input voltage (VIH): T
10、E and DC, TA= -55C to +125C . 2.0 V dc Bus and terminal, TA= +25C, +125C 2.0 V dc Bus and terminal, TA= -55C . 2.1 V dc Maximum low level input voltage (VIL): TE and DC, TA= -55C to +125C . 0.8 V dc Bus and terminal, TA= -55C, +25C . 0.8 V dc Bus and terminal, TA= +125C 0.7 V dc Maximum high level o
11、utput current (IOH): Bus ports with pull-ups active (VCC= 5.0 V dc) -5.2 mA Terminal ports -800 A Maximum low level output current (IOL): Bus ports, TA= +25C, +125C 48 mA Bus ports, TA= -55C. 24 mA Terminal ports 16 mA Ambient operating temperature range (TA) -55C to +125C _ 1/ For operation above T
12、A= +25C, derate at the rate of 11.0 mW/C.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89681 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLIC
13、ABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTME
14、NT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-
15、103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philad
16、elphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been
17、obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qu
18、alified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Qua
19、lity Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to
20、identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Termin
21、al connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and
22、shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38
23、535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the devi
24、ce. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML
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