DLA SMD-5962-89678 REV A-2001 MICROCIRCUIT LINEAR QUAD 8-BIT MULTIPLYING CMOS DIGITAL-TO-ANALOG CONVERTER WITH MEMORY MONOLITHIC SILICON《硅单片 装有记忆装置的四重8位多路复用数字模拟转变器 氧化物半导体线性微型电路》.pdf
《DLA SMD-5962-89678 REV A-2001 MICROCIRCUIT LINEAR QUAD 8-BIT MULTIPLYING CMOS DIGITAL-TO-ANALOG CONVERTER WITH MEMORY MONOLITHIC SILICON《硅单片 装有记忆装置的四重8位多路复用数字模拟转变器 氧化物半导体线性微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89678 REV A-2001 MICROCIRCUIT LINEAR QUAD 8-BIT MULTIPLYING CMOS DIGITAL-TO-ANALOG CONVERTER WITH MEMORY MONOLITHIC SILICON《硅单片 装有记忆装置的四重8位多路复用数字模拟转变器 氧化物半导体线性微型电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDA Drawing updated to reflect current requirements. - lgt 01-08-03 Raymond MonninTHE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.REVSHEETREVSHEETREV STATUS REV AAAAAAAAAAAAOF SHETS SHET 12345678910112PMIC N/A PREPARED BY Rick C. OfficerDEFEN
2、SE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYCharles ReusingCOLUMBUS, OHIO 43216http:/www.dscc.dla.milTHIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYMichael FryeMICROCIRCUIT, LINEAR, QUAD 8-BITMULTIPLYING CMOS, DIGITAL-TO-ANALOGCONVERTER WITH MEMORY, MONOLITHICSILICONA
3、ND AGENCIES OF THEDEPARTMENT OF DEFENSEDRAWING APPROVAL DATE03 November 1989AMSC N/AREVISION LEVELASIZEACAGE CODE672685962-89678SHEET1 OF 12DSCC FORM 2233APR 97 5962-E543-01DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction o
4、r networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-89678DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET2DSCC FORM 2234APR 971. SCOPE1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level
5、B microcircuits inaccordance with MIL-PRF-38535, appendix A.1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:5962-89678 01 X XDrawing number Device type(see 1.2.1)Case outline(see 1.2.2)Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify
6、 the circuit function as follows:Device type Generic number Circuit function01 DAC-8408A Quad 8-bit multiplying CMOS, digital-to-analog converter with memory02 DAC-8408B Quad 8-bit multiplying CMOS, digital-to-analog converter with memory1.2.2 Case outline(s). The case outline(s) are as designated i
7、n MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX GDIP1-T28 or CDIP2-T28 28 Dual-in-line1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.1.3 Absolute maximum ratings. VDD to IOUT2 (pins 5, 24) 0 V dc to +7.0 V dcVDD to DGND 0
8、V dc to +7.0 V dcIOUT2 (pins 5, 24) to DGND . -0.3 V dc to VDD +0.3 V dcDigital input voltage to DGND -0.3 V dc to VDD +0.3 V dcOutput voltage (pins 4, 6, 23, 25) to DGND -0.3 V dc to VDD +0.3 V dcVREFA, VREFB, VREFC, VREFD to DGND G0125 V dcVoltage from RFBA, RFBB, RFBC, RFBD to DGND. G0125 V dcPow
9、er dissipation (PD) to +75G02C. 45 mW 1/Storage temperature range -65G02C to +150G02CLead temperature (soldering, 60 seconds). +300G02CThermal resistance, junction-to-case (G03JC) . See MIL-STD-1835Thermal resistance, junction-to-ambient (G03JA) 120G02C/W1.4 Recommended operating conditions.Ambient
10、operating temperature range (TA) -55G02C to +125G02CReference voltage (VREF) +10 VVOUT1 and VOUT2 0 VVDD +5 V G0110%Source resistance (RS) 50G041/ Derate above +75G02C at 6.0 mW/G02C.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUI
11、T DRAWINGSIZEA5962-89678DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET3DSCC FORM 2234APR 972. APPLICABLE DOCUMENTS2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form apart of this drawing to the extent specif
12、ied herein. Unless otherwise specified, the issues of these documents are those listedin the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited inthe solicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manuf
13、acturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 - Test Method Standard Microcircuits.MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings.MIL-HDBK-780 - Standard Microcir
14、cuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence. In the event of a conflict between the text of this drawi
15、ng and the references cited herein, the textof this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless aspecific exemption has been obtained.3. REQUIREMENTS3.1 Item requirements. The individual item requirements shall be in accordance with
16、MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified ManufacturerListing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be
17、processed as QML product in accordance with the manufacturers approved program plan and qualifyingactivity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) planmay make modifications to the requirements herein. These modifications shall not affect
18、 form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, constru
19、ction, and physical dimensions shall be asspecified in MIL-PRF-38535, appendix A and herein.3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.3.2.2 Truth table. The truth table shall be as specified on figure 2.3.2.3 Functional diagram. The functional diagram sha
20、ll be as specified on figure 3.3.2.4 Case outline. The case outline shall be in accordance with 1.2.2 herein.3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics areas specified in table I and shall apply over the full ambient oper
21、ating temperature range.3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electricaltests for each subgroup are described in table I.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ST
22、ANDARDMICROCIRCUIT DRAWINGSIZEA5962-89678DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET4DSCC FORM 2234APR 973.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PINlisted in 1.2 herein. In addition, the manufacture
23、rs PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). Forpackages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has theoption of not marking the “5962-“ on the device.3.5.1 Certification/compliance mark. A compliance indicator “
24、C” shall be marked on all non-JAN devices built in complianceto MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark inaccordance with MIL-PRF-38535 to identify when the QML flow option is used.3.6 Certificate of compliance. A certificate o
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