DLA SMD-5962-89658 REV B-2012 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf
《DLA SMD-5962-89658 REV B-2012 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89658 REV B-2012 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add logic diagram as shown in figure 3. Redraw switching waveforms and test circuit as shown in figure 4. Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 06-05-02 Thomas M. Hess B Up
2、date the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 12-04-10 Thomas M. Hess REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Larry T. Gauder DLA LAND AND MARITIME COLUM
3、BUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas J. Ricciuti THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL D-TYPE FLIP-FLOP WITH THREE-STATE OUTPUTS, TTL COMPATIBLE IN
4、PUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-03-05 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89658 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E221-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS
5、-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89658 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF
6、-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89658 01 L A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows
7、: Device type Generic number Circuit function 01 54ACT534 Octal D-type flip-flop with three-state outputs, TTL compatible inputs 02 54ACT11534 Octal D-type flip-flop with three-state outputs, TTL compatible inputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as fo
8、llows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The
9、lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V dc to +6.0 V dc DC input voltage range (VIN) . -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Input clamp diode current (IIK) . 20 m
10、A Output clamp diode current (IOK) . 50 mA DC VCCor GND current (per pin) (ICC, IGND) 100 mA Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) . 500 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction tem
11、perature (TJ) +175C 2/ 1.4 Recommended operating conditions. 1/ Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Input voltage range (VIN) . 0.0 V dc to VCCOutput voltage range (VOUT) 0.0 V dc to VCCCase operating temperature range (TC) -55C to +125C Input rise or fall time (trand tf): VCC= 4.5 V
12、 and 5.5 V . 8 ns/V 1/ Unless other wise specified, all voltages are referenced to ground. 2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for ResaleNo reproductio
13、n or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89658 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions - Continued. Minimum setup time, Dn to CP (ts): Device type 01: T
14、C= +25C, VCC= 4.5 V . 4.5 ns TC= -55C to +125C, VCC= 4.5 V . 5.0 ns Device type 02: TC= +25C, VCC= 4.5 V . 3.0 ns TC= -55C to +125C, VCC= 4.5 V . 3.0 ns Minimum hold time, Dn to CP (th): Device type 01: TC= +25C, VCC= 4.5 V . 2.5 ns TC= -55C to +125C, VCC= 4.5 V . 3.0 ns Device type 02: TC= +25C, VC
15、C= 4.5 V . 5.5 ns TC= -55C to +125C, VCC= 4.5 V . 5.5 ns Minimum pulse width, CP (tw): Device type 01: TC= +25C, VCC= 4.5 V . 5.0 ns TC= -55C to +125C, VCC= 4.5 V . 5.0 ns Device type 02: TC= +25C, VCC= 4.5 V . 9.0 ns TC= -55C to +125C, VCC= 4.5 V . 9.0 ns Maximum clock frequency (fMAX): Device type
16、 01: TC= +25C, VCC= 4.5 V . 95 MHz TC= -55C to +125C, VCC= 4.5 V . 85 MHz Device type 02: TC= +25C, VCC= 4.5 V . 55 MHz TC= -55C to +125C, VCC= 4.5 V . 55 MHz 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
17、part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STA
18、NDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are availabl
19、e online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this d
20、rawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89658 DLA
21、LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this dr
22、awing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity
23、approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A
24、 “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case o
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