DLA SMD-5962-89640 REV C-2011 MICROCIRCUIT LINEAR WIDEBAND FAST SETTLING OPERATIONAL AMPLIFIER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Sheet 4. TABLE I. Input bias current test. For group A subgroup 1, delete -8 A minimum limit. For group A subgroups 2 and 3, delete -12 A minimum limit. Output current test. For +IOUT, under the conditions column, delete “VOUT= 10 V” and substitu
2、te “VOUT= 0 V”. For -IOUT, under the conditions column, delete “VOUT= 10 V” and substitute “VOUT= 0 V”. Changes in accordance with N.O.R. 5962-R002-94 94-01-03 M. A. FRYE B Drawing updated to reflect current requirements. Redrawn. - ro 01-04-09 R. MONNIN C Update boilerplate paragraphs to current MI
3、L-PRF-38535 requirements. - ro 11-03-10 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK C. OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.
4、dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, WIDEBAND, FAST SETTLING OPERATIONAL AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE
5、92-04-16 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-89640 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E208-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89640 DLA LAND AND MARITIME COLUMBUS, OHIO
6、 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in
7、 the following example: 5962-89640 01 C A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD840 Wideband, fast settling operational a
8、mplifier 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified
9、in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ Voltage between +VSand VSterminals . 36 V dc Differential input voltage . 6.0 V dc Voltage at either input terminal . +VSand VSPeak output current ( 10 % duty cycle) . 100 mA Power dissipation (PD): Case C 1.3 W 3/ Case 2 . 1.0 W 3/ J
10、unction temperature (TJ) . +175C Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC): Case C 30C/W Case 2 . 35C/W Thermal resistance, junction-to-case (JA): Case C 110C/W Case 2 . 150C/W _ 1/ Stresses above the absolute
11、 maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, TA= +25C. 3/ Derate linearly above TA= +25C for case C at 8.7mw/C and case 2 at 6.7 mW/C. Provided by IHSNot for ResaleNo
12、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89640 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Positive supply voltage range (+VS) . +5 V dc to +15
13、V dc Negative supply voltage range (-VS) -5 V dc to 15 V dc Common mode input voltage (VCM) . 10 V dc Load resistance (RL) . 500 Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standar
14、ds, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
15、DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of the
16、se documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited h
17、erein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A
18、 for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product
19、 in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or functio
20、n of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical di
21、mensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwis
22、e specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89
23、640 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking sh
24、all be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of
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