DLA SMD-5962-89630 REV A-2001 MICROCIRCUIT LINEAR DUAL CMOS COMPATIBLE DIFFERENTIAL LINE RECEIVER MONOLITHIC SILICON《硅单片 双重氧化物半导体可兼容差动线路接收器 数字微型电路》.pdf
《DLA SMD-5962-89630 REV A-2001 MICROCIRCUIT LINEAR DUAL CMOS COMPATIBLE DIFFERENTIAL LINE RECEIVER MONOLITHIC SILICON《硅单片 双重氧化物半导体可兼容差动线路接收器 数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89630 REV A-2001 MICROCIRCUIT LINEAR DUAL CMOS COMPATIBLE DIFFERENTIAL LINE RECEIVER MONOLITHIC SILICON《硅单片 双重氧化物半导体可兼容差动线路接收器 数字微型电路》.pdf(11页珍藏版)》请在麦多课文档分享上搜索。
1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDA Drawing updated to reflect current requirements. - lgt 01-06-13 Raymond MonninTHE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.REVSHEETREVSHEETREV STATUS REV AAAAAAAAAAOF SHETS SHET 12345678910PMIC N/A PREPARED BY Joseph A. KirbyDEFENSE SU
2、PPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYRay MonninCOLUMBUS, OHIO 43216http:/www.dscc.dla.milTHIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYMichael FryeMICROCIRCUIT, LINEAR, DUAL CMOSCOMPATIBLE DIFFERENTIAL LINE RECEIVER,MONOLITHIC SILICONAND AGENCIES OF THEDEPARTMENT O
3、F DEFENSEDRAWING APPROVAL DATE28 June 1989AMSC N/AREVISION LEVELASIZEACAGE CODE672685962-89630SHEET1 OF 10DSCC FORM 2233APR 97 5962-E474-01DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
4、ense from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-89630DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET2DSCC FORM 2234APR 971. SCOPE1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits inaccordance with
5、MIL-PRF-38535, appendix A.1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:5962-89630 01 E XDrawing number Device type(see 1.2.1)Case outline(see 1.2.2)Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows:D
6、evice type Generic number Circuit function01 78C120 Dual CMOS compatible differentialline receiver1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleE GDIP1-T16 or CDIP2-T16 16 Dual-in-line1.2.3 Lea
7、d finish. The lead finish is as specified in MIL-PRF-38535, appendix A.1.3 Absolute maximum ratings. 1/Supply voltage (VCC). 18 V dcCommon mode input voltage (VCM) G0125 V dcDifferential input voltage (VID). G0125 V dcStrobe voltage 18 V dcOutput sink voltage. 50 mAPower dissipation (PD) 1433 mW 2/S
8、torage temperature range -65G02C to +150G02CLead temperature (soldering, 10 seconds). +260G02CJunction temperature (TJ). +150G02C 3/Thermal resistance, junction to case (G03JC) . See MIL-STD-18351/ All voltages, except differential voltages, are with respect to ground. Unless otherwise specified, al
9、l absolute maximumlimits apply over the full operating temperature range.2/ Derate linearly 9.6 mW/G02C above +25G02C case temperature. Must withstand the added PD due to short circuit test;e.g., IOS.3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in sc
10、reening conditionsin accordance with method 5004 of MIL-STD-883.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-89630DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET3DSCC FORM 2234APR 9
11、71.4 Recommended operating conditions.Supply voltage range (VCC) 4.5 V dc to 15 V dcCommon mode input voltage (VCM) G0115 V dcHigh level output current (IOH) -200 G04ALow level output current (IOL) 1.6 mACase operating temperature range (TC) . -55G02C to +125G02C2. APPLICABLE DOCUMENTS2.1 Government
12、 specification, standards, and handbooks. The following specification, standards, and handbooks form apart of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listedin the issue of the Department of Defense Index of Specifications and S
13、tandards (DoDISS) and supplement thereto, cited inthe solicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL-STD-883 - Test Method Standard Microcircuits.MIL-STD-1835 - Interface Standard Electron
14、ic Component Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings.MIL-HDBK-780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the StandardizationDocument Order Desk, 7
15、00 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the textof this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations u
16、nless aspecific exemption has been obtained.3. REQUIREMENTS3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufactur
17、erListing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifyingactivity approval in accordance with MIL-PRF-38535. This QM
18、L flow as documented in the Quality Management (QM) planmay make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with
19、 MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be asspecified in MIL-PRF-38535, appendix A and herein.3.2.1 Case outline(s). The case outline(s) shall be in accordance
20、 with 1.2.2 herein.3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.3.2.3 Switching test circuit and waveforms. The switching test circuit and waveforms shall be as specified on figure 2.Provided by IHSNot for ResaleNo reproduction or networking permitted withou
21、t license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-89630DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELASHEET4DSCC FORM 2234APR 973.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics areas specified
22、in table I and shall apply over the full case operating temperature range.3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electricaltests for each subgroup are described in table I.3.5 Marking. Marking shall be in accordance with M
23、IL-PRF-38535, appendix A. The part shall be marked with the PINlisted in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). Forpackages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has
24、 theoption of not marking the “5962-“ on the device.3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in complianceto MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark inaccordan
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