DLA SMD-5962-89617 REV B-2012 MICROCIRCUIT LINEAR 12-BIT DIGITAL-TO-ANALOG CONVERTER MONOLITHIC SILICON.pdf
《DLA SMD-5962-89617 REV B-2012 MICROCIRCUIT LINEAR 12-BIT DIGITAL-TO-ANALOG CONVERTER MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89617 REV B-2012 MICROCIRCUIT LINEAR 12-BIT DIGITAL-TO-ANALOG CONVERTER MONOLITHIC SILICON.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - lgt 01-07-06 Raymond Monnin B Redrawn. Drawing updated to current requirements. - drw 12-05-01 Charles F. Saffle THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET RE
2、V STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Rick C. Officer DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEP
3、ARTMENT OF DEFENSE CHECKED BY Charles E. Besore APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, 12-BIT DIGITAL-TO-ANALOG CONVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 90-01-23 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89617 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E333-12 Provide
4、d by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for
5、 MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89617 01 L A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.
6、2.3) 1.2.1 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 AD767 12-bit digital-to-analog converter 1.2.2 Case outline. The case outline is as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Terminal
7、s Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. VCCto power ground . 0 V dc to +18 V dc VEEto power ground 0 V dc to -18 V dc Digital inputs to power ground . -1.0 V dc to +7.0 V d
8、c Reference input to reference ground . 12 V dc Bipolar offset to reference ground . 12 V dc 10 V span R to reference ground 12 V dc 20 V span R to reference ground 24 V dc Ref out or VOUTshort circuit duration . 1/ Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +
9、300C Power dissipation 1.0 W Thermal resistance, junction to case (JC). See MIL-STD-1835 Thermal resistance, junction to ambient (JA) . 80C/W Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Positive supply voltage range (VCC) +12 V dc to +15 V dc Negative supply voltage range (
10、VEE) . -12 V dc to -15 V dc Ambient operating temperature range (TA) . -55C to +125C _ 1/ Indefinite short to power ground; momentary short to VCC. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LA
11、ND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise
12、specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835
13、- Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standa
14、rdization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes
15、 applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that
16、is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in
17、 accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QM
18、L“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The
19、 case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Functional block diagram. The Functional block diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise
20、 specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each
21、subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89617 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical perf
22、ormance characteristics. Test Symbol Conditions -55C TA+125C 1/ unless otherwise specified Group A subgroups Device type Limits Unit Min Max Relative accuracy RA All bits with positive errors on and all bits with negative errors on 1, 2, 3 01 1.0 LSB Differential nonlinearity DNL Major carry errors
23、1, 2, 3 01 1.0 LSB Gain error 2/ AEAll bits on, TA= +25C 1 01 0.2 %FSR Gain temperature coefficient TAEAll bits on 2, 3 01 30 ppm/C Unipolar offset error VOSAll bits off, TA= +25C 1 01 2.0 LSB Unipolar offset temperature coefficient TVOSAll bits off 2, 3 01 3.0 ppm/C Bipolar zero error 2/ BPZEMSB on
24、, all other bits off, bipolar mode, TA= +25C 1 01 0.1 %FSR Bipolar zero temperature coefficient TBPZEMSB on, all other bits off, bipolar mode 2, 3 01 10 ppm/C Reference input 3/ resistance RINTA= +25C 4 01 15 25 k Reference output voltage VREFUnipolar mode, 1.1 mA external load 1, 2, 3 01 9.9 10.1 V
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- DLASMD596289617REVB2012MICROCIRCUITLINEAR12BITDIGITALTOANALOGCONVERTERMONOLITHICSILICONPDF

链接地址:http://www.mydoc123.com/p-699514.html