DLA SMD-5962-89601 REV G-2012 MICROCIRCUIT DIGITAL ADVANCED CMOS RADIATION HARDENED OCTAL POSITIVE EDGED-TRIGGERED D-TYPE FLIP-FLOP WITH THREE STATE OUTPUTS AND TTL COMPATIBLE MONO.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add B, S, Q, and V test limits change to one part-one part number format. Add ground bounce and latch-up immunity tests. Add 10.1 substitution statements. Editorial changes throughout. 92-07-10 Monica L. Poelking B Changes in accordance with NOR

2、5962-R082-93. tjr 93-02-26 Monica L. Poelking C Changes in accordance with NOR 5962-R373-97. cfs 97-07-08 Monica L. Poelking D Add device type 02. Add vendor CAGE F8859. Add case outlines X and Z. Add radiation features for device type 01. Update boilerplate to MIL-PRF-38535 requirements. jak 02-09-

3、24 Thomas M. Hess E Add radiation features for device type 02 in section 1.5. Update the boilerplate to include radiation hardness assured requirements for device type 02. Editorial changes throughout. jak 05-03-18 Thomas M. Hess F Update radiation features in section 1.5. Add SEP table IB and parag

4、raph 4.4.5.2. Update the boilerplate paragraphs to current MIL-PRF-38535 requirements. MAA 11-11-10 Thomas M. Hess G Update dimensions of case outline X to figure 1. Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 12-12-19 Thomas M. Hess REV SHEET REV G G G G G G G G G

5、 G G G SHEET 15 16 17 18 19 20 21 22 23 24 25 26 REV STATUS REV G G G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Tim H. Noh DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS

6、 AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Wm J. Johnson APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ADVANCED CMOS, RADIATION HARDENED, OCTAL POSITIVE EDGED-TRIGGERED D-TYPE FLIP-FLOP WITH THREE STATE OUTPUTS AND TTL COMPATIBLE MONOLITH

7、IC SILICON DRAWING APPROVAL DATE 89-05-18 REVISION LEVEL G SIZE A CAGE CODE 67268 5962-89601 SHEET 1 OF 26 DSCC FORM 2233 APR 97 5962-E135-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89601 DLA LAND AND

8、 MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes M, B and Q) and space application (device classes S and V). A choice of case outlines and le

9、ad finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. 5962 F 89601 01 V R A Federal RHA Device Device Case Lead stock

10、class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes B, S, Q, and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA d

11、esignator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic numbe

12、r Circuit function 01 54ACT574 Octal positive-edge triggered D-type flip-flop with three-state outputs and TTL compatible inputs 02 54ACT574 Octal positive-edge triggered D-type flip-flop with three-state outputs and TTL compatible inputs 1.2.3 Device class designator. The device class designator is

13、 a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A B, S, Q, or V Certification

14、and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack X See figure 1 20 Flat pack Z G

15、DFP1-G20 20 Flat pack with gullwing 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes B, S, Q, and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted

16、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89601 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage range (VIN) -0.5 V dc to

17、VCC + 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC + 0.5 V dc Clamp diode current (IIK, IOK) . 20 mA DC output current (IOUT) . 50 mA DC VCCor GND current (ICC, IGND) . 200 mA 3/ Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW Lead temperature (

18、soldering, 10 seconds): Case outline X . +260C All other case outlines except case X +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 4/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (V

19、IN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCC Maximum low level input voltage (VIL) (VCC= 4.5 V and 5.5 V) 0.8 V Minimum high level input voltage (VIH) (VCC= 4.5 V and 5.5 V) . 2.0 V Case operating temperature range (TC) . -55C to +125C Input rise or fall rate (t/V) maximum: VCC=

20、 4.5 V 10 ns/V VCC= 5.5 V 8 ns/V Maximum high level output current (IOH). -24 mA Maximum low level output current (IOL)24 mA 1.5 Radiation features. Device type 02: Maximum total dose available (dose rate = 50 300 rads (Si)/s) 300 krads (Si) Single event phenomenon (SEP): For device type 02: No Sing

21、le Event Latch-up (SEL) occurs at effective LET (see 4.4.5.2) . 93 MeV-cm2/mg 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. The maximum junction temperature may be excee

22、ded for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ For packages with multiple VCCand GND pins, this value represents the maximum total current flowing into or out of all VCCor

23、GND pins. 4/ Unless otherwise specified, the values listed above shall apply over the full VCCand TCrecommended operating range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89601 DLA LAND AND MARITIME COL

24、UMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issu

25、es of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standar

26、d Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order

27、 Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. AST

28、M INTERNATIONAL (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of semiconductor Devices. (Copies of these documents are available online at http:/www.astm.org or from ASTM International, 100 Barr Harbor Drive, P.O. Box C700, We

29、st Conshohocken, PA, 19428-2959). JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD78 - IC Latch-up Test JESD20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid

30、State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201-2107). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes

31、applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes B, S, Q, and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Qualit

32、y Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Provided by IH

33、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89601 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, constructi

34、on, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes B, S, Q, and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The te

35、rminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 4. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be

36、as specified on figure 5. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 6. 3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall b

37、e made available to the preparing or acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table IA and s

38、hall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table IA. 3.5 Marking. The part shall be marked with the PIN listed in 1.

39、2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall sti

40、ll be marked. Marking for device classes B, S, Q, and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes B, S, Q, and V shall be a “QML“ or “Q“ a

41、s required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes B, S, Q, and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the

42、requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior t

43、o listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes B, S, Q, and V, the requirements of MIL-PRF-38535 and herein or for device class M the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance

44、. A certificate of conformance as required for device classes B, S, Q, and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M notification

45、to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquirin

46、g activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall b

47、e in microcircuit group number 38 (see MIL-PRF-38535, appendix A). 3.11 Substitution. Substitution data shall be as indicated in the appendix herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89601 DLA

48、LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test Conditions 2/ 3/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Device type 4/ and device class VCCGroup A subgroups Limits 5/ Unit Min Max High level output voltage 3006 VOH16/ For all inputs affecting output under test, VIN= VIH= 2.0 V or VIL= 0.8 V For all other inputs, VIN= VCCor GND IOH= -50 A All All 4.5 V 1, 2, 3 4.4 V VOH27/ 8/ For all inputs affecting output under