DLA SMD-5962-88764 REV C-2006 MICROCIRCUIT DIGITAL-LINEAR 8-BIT A D CONVERTERS HIGH SPEED MONOLITHIC SILICON《硅单片8位A D模数转换器高速数字线性微电路》.pdf
《DLA SMD-5962-88764 REV C-2006 MICROCIRCUIT DIGITAL-LINEAR 8-BIT A D CONVERTERS HIGH SPEED MONOLITHIC SILICON《硅单片8位A D模数转换器高速数字线性微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-88764 REV C-2006 MICROCIRCUIT DIGITAL-LINEAR 8-BIT A D CONVERTERS HIGH SPEED MONOLITHIC SILICON《硅单片8位A D模数转换器高速数字线性微电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline 3. Add vendor CAGE 1ES66. Made changes to tables I and II, and figures 1 and 2 91-09-17 M. A. FRYE B Update drawing to current requirements. Editorial changes throughout. - drw 04-07-08 R. MONNIN C Make correction to the Mode 1 t
2、iming waveform as specified under figure 3. - ro 06-01-18 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY GARY ZAHN DEFENSE SUPPLY CENTER COLUMBUS STANDARD M
3、ICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY WILLIAM K. HECKMAN AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-08-07 MICROCIRCUIT, DIGITAL-LINEAR, 8-BIT A/D CONVE
4、RTERS, HIGH SPEED, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-88764 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E104-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88764 DEFENSE
5、 SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number
6、(PIN). The complete PIN is as shown in the following example: 5962-88764 01 L A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Total un
7、adjusted error 01 7824T 4-channel 8-bit A/D converter 1.0 LSB 02 7824U 4-channel 8-bit A/D converter 0.5 LSB 03 7828T 8-channel 8-bit A/D converter 1.0 LSB 04 7828U 8-channel 8-bit A/D converter 0.5 LSB 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outl
8、ine letter Descriptive designator Terminals Package style 3 CQCC1-N28 28 Square leadless chip carrier L GDIP3-T24 or CDIP4-T24 24 Dual-in-line X GDIP1-T28 or CDIP2-T28 28 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. VDDto
9、 ground range 0 V dc to +7 V dc Digital input voltage to ground (RD , CS , A0, A1 and A2) . -0.3 V dc to VDDDigital output voltage to ground (DB0, DB7, RDY and INT ) -0.3 V dc to VDDVREF(+) to ground VREF(-) to VDDVREF(-) to ground . 0 V dc to VREF(+) Analog input, any channel -0.3 V dc to VDDStorag
10、e temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Power dissipation (PD) . 450 mW 1/ Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) (all cases) 120C/W Junction temperature (TJ) +175C _ 1/ Derate above TA= +75
11、C at 6.0 mW/C for case outlines L, X, and 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88764 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.4 R
12、ecommended operating conditions. Supply voltage range (VDD) . +4.75 V dc to +5.25 V dc Positive reference voltage VREF(+) +5.0 V dc Negative reference voltage VREF(-) . 0 V dc Ground potential (GND) . 0 V dc Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Governmen
13、t specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION
14、MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Micro
15、circuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2
16、Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.
17、1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a ma
18、nufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan ma
19、y make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow o
20、ption is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal
21、 connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full am
22、bient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I.Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro
23、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88764 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/, 2/ -55C TA +125C unless otherwise specified Group A subgroups
24、Device type Limits Unit Min MaxResolution RES Guaranteed minimum resolution for which no codes are missing 1, 2, 3 All 8.0 Bits Total unadjusted error 3/ TUE 1, 2, 3 01, 03 1.0 LSB 1 02, 04 1.02, 3, 12 0.5 Analog input leakage current IINAny channel 1, 2, 3 All 3.0 A Reference input 4/ resistance RI
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