DLA SMD-5962-88745 REV B-2004 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE RECEIVERS MONOLITHIC SILICON《硅单片双差分线路接收器线性微电路》.pdf

《DLA SMD-5962-88745 REV B-2004 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE RECEIVERS MONOLITHIC SILICON《硅单片双差分线路接收器线性微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-88745 REV B-2004 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE RECEIVERS MONOLITHIC SILICON《硅单片双差分线路接收器线性微电路》.pdf（9页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline F. Editorial changes throughout. drw 99-02-26 Raymond Monnin B Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. Drawing updated to reflect current requirements. -rrp 04-04-08 Raymond Monnin THE ORIGINAL FIRST SH

2、EET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAW

3、ING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, DUAL, DIFFERENTIAL LINE RECEIVERS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 91-02-07 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-88745 SHEET 1 OF 8 DSCC F

4、ORM 2233 APR 97 5962-E215-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88745 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. T

5、his drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88745 01 F A Drawing number Device type (see 1.2.1)

6、 Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 55115 Dual, differential line receiver 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and

7、as follows: Outline letter Descriptive designator Terminals Package style 2 CQCC1-N20 20 Square leadless chip carrier F GDFP2-F16 16 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) 7.0 V dc Input voltage at

8、 A, B, and RTinputs 25 V dc Input voltage at strobe input 5.5 V dc Off-state voltage applied to open collector inputs . 14 V dc Power dissipation (PD). 1375 mW 1/ Storage temperature range . -65C to 150C Lead temperature (60 seconds) 260C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Th

9、ermal resistance, junction-to-ambient (JA): Case outline 2 65C/W Case outline F 165C/W 1.4 Recommended operating conditions. Ambient operating temperature range. -55C to +125C Supply voltage (VCC) 4.5 to 5.5 V dc High level (strobe) input voltage (VIH) 2.4 V dc Low level (strobe) input voltage (VIL)

10、. 0.4 V dc High level output current (IOH) . -5 mA Low level output current (IOL). 15 mA 1/ Must withstand the added PDdue to short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-887

11、45 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein.

12、 Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircu

13、its. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ o

14、r www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothi

15、ng in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified her

16、ein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program

17、plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect t

18、he PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, append

19、ix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.3 Electrical performance characteristics.

20、Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

21、 tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is

22、 not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88745 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS,

23、 OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Differential input high threshold voltage VTHVO= 0.4 V, IOL= 15 mA, VI

24、C= 0 1, 2, 3 01 500 mV Differential input low threshold voltage VTLVO= 2.4 V, IOH= -5 mA, VIC= 0 1, 2, 3 01 -500 mV High level output voltage VOHVCC= 4.5 V, IOH= -5 mA, 3 01 2.2 V ID= -0.5 V 1, 2 2.4 Low level output voltage VOLVCC= 4.5 V, IOL= 15 mA, VID= 0.5 V 1, 2, 3 01 0.4 V Low level input curr

25、ent IILVCC= 5.5 V, VID= 0.4 V 3 01 -0.9 mA Other input = 5.5 V 1, 2 -0.7 High level strobe current ISHVCC= 4.5 V, VID= -0.5 V, 1 01 2 A VSTROBE= 4.5 V, 2 5 TA= +25C, +125C Low level strobe current ISLVCC= 5.5 V, VID= 0.5 V, 1 01 -2.4 mA STROBE= 0.4 V, TA= +25C Response time control IRTC VCC= 5.5 V,

26、VID= 0.5 V, 1 01 -1.2 mA current VRC= 0 V, TA= +25C Off-state open collector IOVCC= 4.5 V, VID= -4.5 V, 1 01 100 A output current VOH= 12 V, 2 200 TA= +25C, +125C Line terminating resistance RTVCC= 5 V, TA= +25C 1 01 77 176 Common-mode input VICM VID = 1.0 V 1, 2, 3 01 +15 V voltage to -15 Short cir

27、cuit output current IOS VCC= 5.5 V, VID= -0.5 V 1 01 -15 -80 mA 2/ VO= 0 V, TA= +25C Functional test see 4.3.1c 7, 8 01 Supply current ICCVCC= 5.5 V, VID= 0.5 V, 1, 2, 3 01 50 mA (both receivers) VIC= 0 V Propagation delay time tPLH RL = 3.9 k, CL = 30 pF, 9 01 50 ns low-to-high level output VCC= 5.

28、0 V, TA= +25C, see figure 3 Propagation delay time tPHLRL= 390, CL= 30 pF, 9 01 50 ns low-to-high level output VCC= 5.0 V, TA= +25C, see figure 3 1/ VSTROBE= 2.4 V unless other wise specified. All parameters with the exception of off-state open collector output current (IO), are measured with active

29、 pull-up connected to the sink output. 2/ Only one output shall be shorted at a time with duration not to exceed 1 second. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88745 DEFENSE SUPPLY CENTER COLUMBUS

30、COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 Device type 01 Case outlines 2 F Terminal number Terminal symbol 1 NC 1YS 2 1YS 1YP 3 1YP 1STROBE 4 1STROBE 1RTC 5 1RTC 1B 6 NC 1RT7 1B 1A 8 1RTGND 9 1A 2A 10 GND 2RT11 NC 2B 12 2A 2RTC13 2RT2STROBE 14 2B 2YP 15 2RTC 2YS 16 NC

31、VCC17 2STROBE - 18 2YP - 19 2YS - 20 VCC- FIGURE 1. Terminal connections. STROBE DIFF INPUT OUTPUT (YP and YS tied together L X H H L H H H LH = VI VIHmin or VIDmore positive than VTHmax. L = VI VILmax or VIDmore negative than VTLmax. X = Irelevant FIGURE 2. Truth table. Provided by IHSNot for Resal

32、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88745 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 NOTES: A. The pulse generator has the following characteristics: ZO= 50, PRR 5

33、00 kHz, tW= 100 ns, duty cycle = 50%. B. CLincludes probe and jig capacitance. FIGURE 3. Delay waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88745 DEFENSE SUPPLY CENTER COLUMBUS

34、COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certifi

35、cation mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compl

36、iance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix

37、 A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to rev

38、iew the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Scree

39、ning. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall

40、be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method

41、 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conforman

42、ce inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 10, and 11 in table I, method 5005 of MI

43、L-STD-883 shall be omitted. c. Subgroup 7 and 8 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88745 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 RE

44、VISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test re

45、quirements (method 5005) 1, 2, 3, 9 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MI

46、L-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipati

47、on, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL

48、-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accom