DLA SMD-5962-88744 REV D-2004 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE DRIVER MONOLITHIC SILICON《硅单片双差分线路驱动器线性微电路》.pdf
《DLA SMD-5962-88744 REV D-2004 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE DRIVER MONOLITHIC SILICON《硅单片双差分线路驱动器线性微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-88744 REV D-2004 MICROCIRCUIT LINEAR DUAL DIFFERENTIAL LINE DRIVER MONOLITHIC SILICON《硅单片双差分线路驱动器线性微电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device type 02. Editorial changes throughout. 92-09-24 M. A. FRYE B Add case outline F. Make changes to 1.2.2, 1.3, and FIGURE 1. Changes in accordance with N.O.R. 5962-R066-94. 93-12-16 M. A. FRYE C Add case outline E. Make changes to 1.2.
2、2, 1.3, FIGURE 1, and editorial changes throughout. Redrawn. 97-11-13 R. MONNIN D Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. Drawing updated to reflect current requirements. -rrp 04-03-25 R. MONNIN REV SHET REV SHET REV STATUS REV D D D D D D D D D D D D OF SHEETS SHEET 1 2 3
3、 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY RAYMOND MONNIN MICROCIRCUIT, LINEAR, DUAL DIFFE
4、RENTIAL LINE DRIVER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 91-02-07 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-88744 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E203-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without l
5、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
6、 accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88744 01 E X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the cir
7、cuit function as follows: Device type Generic number Circuit function 01 55113 Dual differential line driver with three state outputs 02 55114 Dual differential line driver with two state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline let
8、ter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage
9、(VCC) . +7.0 V dc 1/ Input voltage +5.5 V dc Off-state output voltage +12.0 V dc Maximum power dissipation (PD): Cases E and 2 1375 mW 2/ Case F 1000 mW 2/ Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +260C Junction temperature (TJ) +150C Thermal resistance, junct
10、ion-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case E . 90C/W Case F . 165C/W Case 2 . 65C/W 1/ All voltage values are with respect to network ground terminal. 2/ With TAabove +25C, the derating factors are 8.0C/W for case F and 11.0C/W for cases E and 2. Provided by
11、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VCC) .
12、+4.5 V dc to +5.5 V dc Ambient operating temperature range (TA) . -55C to +125C Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.8 V dc Maximum low level output current (IOL) . 40 mA High level output current (IOH) -40 mA 2. APPLICABLE DOCUMENTS 2.1 Governmen
13、t specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION
14、MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Micro
15、circuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order
16、of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item
17、 requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufact
18、urer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
19、 modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option
20、is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal c
21、onnections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.2.4 Timing waveforms(s). The timing waveform(s) shall be as specified on figures 3, 4, and 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without licen
22、se from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88744 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Device ty
23、pes Group A subgroups Min Max Unit Low level output voltage VOLVCC= 4.5 V, IOL= 40 mA All 1, 2, 3 0.4 V IOH= -10 mA 2.4 V High level output voltage VOHVCC= 4.5 V, VIH= 2 V, VIL= 0.8 V IOH= -40 mA All 1, 2, 3 2.0 Input clamp voltage VIKVCC= 4.5 V, IIN= -12 mA All 1, 2, 3 -1.5 A,B,C All -1.6 Low level
24、 input current CC IILVCC= 5.5 V, VIN= 0.4 V 01 1, 2, 3 -3.2 mA A,B,C All 40 High level input current CC IIHVCC= 5.5 V, VIN= 2.4 V 01 1, 2, 3 80 A 01 1,2,3 -1.5 VCC= 5.5 V, IO= -40 mA 02 1 -1.5 Output clamp voltage VOKVCC= 5.0 V, IO= +40 mA 02 1 6.5 V VCC= 5.5 V 65 VCC= 7.0 V 01 1, 2, 3 85 VCC= 5.5 V
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