DLA SMD-5962-88622 REV C-2008 MICROCIRCUIT LINEAR LOW NOISE HIGH SPEED PRECISION OPERATIONAL AMPLIFIER MONOLITHIC SILICON《单片硅运算放大器高速精密低噪音线性微电路》.pdf
《DLA SMD-5962-88622 REV C-2008 MICROCIRCUIT LINEAR LOW NOISE HIGH SPEED PRECISION OPERATIONAL AMPLIFIER MONOLITHIC SILICON《单片硅运算放大器高速精密低噪音线性微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-88622 REV C-2008 MICROCIRCUIT LINEAR LOW NOISE HIGH SPEED PRECISION OPERATIONAL AMPLIFIER MONOLITHIC SILICON《单片硅运算放大器高速精密低噪音线性微电路》.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make change to the power dissipation and derating limits for case outline G. Delete +125C and substitute +150C in footnote 4/ under 1.4. Add footnote 2/ to the input voltage range test under Table I. Delete footnote 2/ from the input noise voltag
2、e and current density tests under Table I. Delete the input noise voltage test entirely. Delete footnote 2/ from the slew rate test under Table I. Add footnote 4/ to the gain bandwidth product test under Table I. Average temperature coefficient on input offset voltage test, renumber footnote 2/ as f
3、ootnote 4/ under Table I. Change the note under Table II. Changes in accordance with N.O.R. 5962-R050-95. 95-01-24 M. A. FRYE B Add case outline X. Remove vendor CAGE for case outline G. Editorial and technical changes throughout. Redrawn. 96-01-30 M. A. FRYE C Drawing updated to reflect current req
4、uirements. - ro 08-04-03 R. HEBER THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY GARY ZAHN DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAY MONN
5、IN COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-07-27 MICROCIRCUIT, LINEAR, LOW NOISE, HIGH SPEED PRECISION, OPERATIONAL AMPLIFIER, MONOLITHIC SILIC
6、ON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-88622 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E187-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88622 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, O
7、HIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown
8、 in the following example: 5962-88622 01 G A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function VOS_ _ _ _ 01 LT1028M Operational amplifier
9、 80 V 02 LT1028AM Operational amplifier 40 V 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can P GDIP1-T8 or CDIP2-T8 8 Dual-in-line X See figure 1 8 Can 1.2.3 Lead finish. The l
10、ead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage: TA= -55C to +105C . 22 V TA= +105C to +125C 16 V Input voltage . Equal to supply voltage Differential input current 25 mA 2/ Output short circuit duration Indefinite Storage temperature range .
11、-65C to +150C Power dissipation (PD) : 3/ Cases G and X 500 mW at +75C Case P 750 mW at +75C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) : Cases G and X 15
12、0C/W Case P 100C/W _ 1/ Internal thermal limiting prevents excessive heating that could result in sudden failure. The device can be subjected to accelerated stress with a shorted output and worst case conditions. 2/ The inputs are protected by back-to-back diodes. Current limiting resistors are not
13、used in order to achieve low noise. If differential input voltage exceeds 1.8 V, the input current should be limited to 25 mA. 3/ Derate: Case G, 6.7 mW/C above 75C; case P, 10 mW/C above 75C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
14、MICROCIRCUIT DRAWING SIZE A 5962-88622 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VS) 4.5 V to 15 V Ambient operating temperature range (TA) . -55C to +125C 4/ 2. APPLICABLE DOCUMENTS 2
15、.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SP
16、ECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of St
17、andard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111
18、-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQ
19、UIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufact
20、urer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management
21、(QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when th
22、e QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal
23、connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electr
24、ical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. _ 4/ The maximum operating junction temperature is +150C. At elevated temperatures, the device must be derated based on package ther
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