DLA SMD-5962-88613 REV B-1991 MICROCIRCUIT DIGITAL CMOS 16-BIT ERROR DETECTION AND CORRECTION UNIT MONOLITHIC SILICON《硅单片16位误码检测与校正部件互补型金属氧化物半导体数字微电路》.pdf
《DLA SMD-5962-88613 REV B-1991 MICROCIRCUIT DIGITAL CMOS 16-BIT ERROR DETECTION AND CORRECTION UNIT MONOLITHIC SILICON《硅单片16位误码检测与校正部件互补型金属氧化物半导体数字微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-88613 REV B-1991 MICROCIRCUIT DIGITAL CMOS 16-BIT ERROR DETECTION AND CORRECTION UNIT MONOLITHIC SILICON《硅单片16位误码检测与校正部件互补型金属氧化物半导体数字微电路》.pdf(24页珍藏版)》请在麦多课文档分享上搜索。
1、SMD-5962-bL3 REV B 59 9999996 0007934 2 ? ? NOTICE OF REVISION (NOR) (See MIL-STO-460 for instructions) I I DATE (YYMMDD) Form Approved OMB NO, 0704-0166 Quiescent input power supply current (per input at TTL high) 4/ 1, ORIGINATOR NAME AND ADDRESS Defense Electronics Supply Center Dayton, Ohio 4544
2、4-5277 I, V, 5,s V, VIN = 3.4 V, 1, 2, 3 01,02 2.0 mA/ fop 0 input 03 0,5 6, TITLE OF DOCUMENT MICROCIRCUIT, DIGITAL, CMOS, 16-BIT ERROR DETECTION ANO CORRECTION UNIT, MONOLITHIC SIL ICON 9. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES 2. CAGE CODE 4. CAGE CODE 5. DOCUMENT NO, 7. REVISION LET
3、TER 6, ECP NO, 10, DESCRIPTION OF REVISION Sheet 1: Revisions ltr column; add “8“ Revisions descriEtion colmn; add “Changes in accordance with Revisions date column; add “91-11-25“. Table I, ICCT, Quiescent input power supply current (per input at TTL high), Correct as follows: NOR 5962-R003-92 , Sh
4、eet 4: *Sheet 5: Table I, t, Combinational delay, DATA,-, to SC,-, Max limit column, device types O1 and 03, FROM: 22 ns TO: 24 ns *Sheet 9: Table I, t, Combinational delay, LE, to SC,-, Max limit column, device types O1 and 03, FROM: 24 ns TO: 26 ns *These changes wre previously approved for incorp
5、oration into the next action of drawing 5962-88613 on 21 May 1990, 11. THIS SECTION FOR GOVERN MENT USE ONLY CHECK ONE BXISTING DOCUMENT SUPPLEMENTED BY THIS NOR MAY BE USED IN c I REVISED DOCUMENT MUST BE CUSTODIAN OF MASTER DOCUMENT RECEIVED BEFORE MANUFACTURER SHALL MAKE ABOVE REVISION AND b, ACT
6、IVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT DESC-ECC 91/11/25 Previ ous edit ions are obsolete, D Form 1693 s JuL 88 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I -TR A SMD-5962-BBbL3 REV B 59 9999996 0007935 4 I DESCRIPTION DATE (MI-MO-W A
7、PPROVED Technical changes to table I. Device types OJTX and 02TX not available from an approved source. 199 SEPT 24; 1 SEPTEMBER 1988 REVISION LEVEL CURRENT CAGE CODE 67268 A I 14933 15962-8861: PMIC NA STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE 3R USE BY ALL DEPARTMENTS AND AGENCIES OF
8、 THE DEPAMMENT OF DEFENSE DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I DRAWING APPROVAL DATE -1 SIZE I CAGECODE -1- AMCC NIA I A I SHEET 1 OF 23 :SC FORM 193-1 i1 US. GOVERNMENT PRINTING OfFKt: 1987- 748-119160912 5962-El 748 EP a7 DISTRIBUTION STATEMENT A. Approved lor publlc rolease; dls
9、lribullon Is unllmiled. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1. SCOPE 1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance iith 1,nf MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunctio
10、n with compliant ion-JAN devi ces“ . 1.2 Part number. The coinplete part number shall be as shown in the following example: SIZE A STANDARDIZED MILITARY DRAWING 5962-88613 -I- I I 5962-88613 o1 l- I I X 7- I I X T I I I I I I Drawing number Device type Case outl ine Lead finish per (1.2.1) (1.2.2) M
11、IL-M-38510 1.2.1 Device types. Device type o1 u2 o3 1.2.2 Case outlines is follows: Out1 i ne 1 etter The device types shall identify the circuit function as follows: Generic nunber Circuit function Detect time Correct time 39C60A 16-bi t EDCU 24 ns 35 ns 39C60 16-bit EDCU 36 ns 73 ns 29CtjOA 16-bi
12、t EDCU 24 ns 35 ns The case outlines shall be as designated in appendix C of MIL-M-38510, and Case outl ine T U X Y Z See figure 1 (48-lead, 1.730“ x ,410“ x e190“1, dual-in-line package C-6 (52 teminal, .761“ x .761“ x .120“), square chip carrier package D-14 148-lead, 2,435“ x ,620“ x .225“), dual
13、-in-line package See figure 1 (48-leadS 1.235“ x ,660“ x .060“), flat package See fiyure 1 (52 terminal, .761“ x .761“ x .075“), square chip carrier package 1.3 Absolute maximum rdtings. Voltage on any pin relative to yround- - - - - - - - C output current into outputs - - - - - - - - - - - Stordge
14、temperature range- - - - - - - - - - - - - - Leaa temperature (soldering, 10 seconds) - - - - - - Thermal resistance, junction-to-case QJc) : Cases T, y, Z- - - - - - - - - - - - - - - - - - - Cases X and U- - - - - - - - - - - - - - - - - - Junction temperature (TJ)- - - - - - - - - - - - - - -0.5
15、V dc to +7,0 V dc 30 mA -65G to +15OQC +300 C 30 “C/W c/ See MIL-M-38510, appendix C +175OC Maximum power dissipation (PD) - - - - - - - - - - - 1.0 y y 1.4 Recomnended operating conditions. Supply voltage (VCC) - - - - - - - - - - - - - - - - Minimum input high voltage (VIH) - - - - - - - - - - Max
16、imum input low voltage (VIL)- - - - - - - - - - - Case operating temperature range (TC)- - - - - - - - 4.5 V dc to 5.5 V dc 2.0 V dc 0.8 V dc -55C to +125C /st withstana the added PD due to short circuit test, e.g., 10s. / When a thermal resistance value is included in MIL-M-38510, appendix C, it sh
17、all supersede the value herein. . SEP 87 t U.S.QOVERNHEKT PRINTINQ OFFICE: 1988-549-904 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-b13 REV B 59 m 9999996 0007917 8 m I 2. APPLICABLE DOCUMENTS 2.1 Government specification, standard, and
18、bulletin. Unless otherwise specified, the following stecification, standard, and bulletin of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MILI
19、TARY MIL-M-38510 - Microcircuits, General Specification far. STANDARD MILITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawing (SMDs). (Copies of the specification, standard, and bulletin required by manufacturers
20、in connection with s ecific acquisition functions should be obtained from the contracting activity or as directed by tRe contracting activity.) references cited herein, the text of this drawing shall take precedence. 2.2 Order of precedence. 3. REQUIREMENTS 3.1 MIL-STD- and as s;:z!fi$ herein. In th
21、e event of a conflict between the text of this drawing and the Item re uirements. The individual item requirements shall be in accordance with 1.2.1 of “qrovisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices” 3.2 Design, construction, and physical dimensions. The design,
22、 construction, and physical dimensions shall be as specified in MIL-M-38510 and herein. 3.2.1 Terminal connections. 3.2.2 Block diagram. 3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein, 3.3 Electrical performance characteristics. Unless otherwise specified herein, the
23、 electrical The terminal connections shall be as specified on figure 2. ! The block diagram shall be as specified on figure 3. 4 performance characteristics are as specified in table I and apply over the full case operating temperature range. i specified in table II. be marked with the part number l
24、isted in 1.2 herein. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups a The electrical tests for each subgroup are described in table I. 3.5 Marking, Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall ! 1 : In addition, the manuf
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