DLA SMD-5962-88571 REV B-2009 MICROCIRCUIT LINEAR BALANCED MODULATOR DEMODULATOR MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add footnote 2/ to the carrier feed-thru test as specified under Table I. Add footnote 2/ to the carrier suppression test as specified under Table I. Add a new footnote 2/ to Table I which states; “Guaranteed, if not tested, to the limits specifi
2、ed in table I.” Changes in accordance with N.O.R. 5962-R150-94. 94-05-17 M. A. FRYE B Drawing being updated to reflect current requirements. Redrawn. - ro 09-02-04 R. HEBER THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B B B B B B B B OF SHEETS SHEET 1
3、2 3 4 5 6 7 8 PMIC N/A PREPARED BY JOSEPH A. KERBY CHECKED BY D. H. JOHNSON DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY MICHAEL A. FRYE STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF
4、 DEFENSE DRAWING APPROVAL DATE 88-08-18 MICROCIRCUIT, LINEAR, BALANCED MODULATOR / DEMODULATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-88571 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E032-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without
5、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88571 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits i
6、n accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88571 01 C A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circu
7、it function as follows: Device type Generic number Circuit function 01 1596 Balanced modulator / demodulator 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-
8、line I MACY1-X10 10 Can 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Differential input signal: +VCto VC+5.0 V dc +VSto VS( 5 + IBRe) V dc 1/ Maximum bias current (IB) 10 mA Applied voltage ( V ): +VOto +VC. 30 V dc -VCto +VS. 30 V dc
9、 -VOto +VC30 V dc -VOto -VC. 30 V dc +VCto -VS. 30 V dc +VCto +VS30 V dc -VCto -VS. 30 V dc +VOto VC. 30 V dc GAto VB30 V dc GBto VB30 V dc Case storage temperature -65C to +150C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) : Case C 180C/W
10、 Case I 200C/W _ 1/ Re= Emitter resistor between gain adjust pins. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88571 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC
11、FORM 2234 APR 97 1.4 Recommended operating conditions. Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified he
12、rein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Micro
13、circuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksear
14、ch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this documen
15、t, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built
16、 to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifyin
17、g activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as describe
18、d herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3
19、.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as spe
20、cified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in acco
21、rdance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN is not feasible due to space limitations, the manufacturer has the option of not marking the “596
22、2-“ on the device. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88571 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance
23、 characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input bias current, ( I+S+ I-S) / 2 IBsignal 1,2,3 01 25 A Input bias current, ( I+C+ I-C) / 2 IBcarrier 1,2,3 01 25 A Input offset current, ( I+S- I-S) IIOsignal 1,2
24、,3 01 5 A Input offset current, ( I+C- I-C) IIOcarrier 1,2,3 01 5 A Power supply current, ( I+O+ I-O) ICC1,2,3 01 3 mA Power supply current IEE1,2,3 01 4 mA Output offset current, ( I+O- I-O) IO1,2,3 01 50 A Differential output voltage swing capability VOTA= +25C 4 01 12.0 VP-PSignal gain AVS+VS= 10
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