DLA SMD-5962-88542 REV E-2006 MICROCIRCUIT HYBRID LINEAR 12-BIT ANALOG TO DIGITAL CONVERTER《类比数位转换器12位混合微电路》.pdf
《DLA SMD-5962-88542 REV E-2006 MICROCIRCUIT HYBRID LINEAR 12-BIT ANALOG TO DIGITAL CONVERTER《类比数位转换器12位混合微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-88542 REV E-2006 MICROCIRCUIT HYBRID LINEAR 12-BIT ANALOG TO DIGITAL CONVERTER《类比数位转换器12位混合微电路》.pdf(15页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added end-point limit to table I, SNR test. Update document to current requirements of MIL-H-38534. Editorial changes throughout. 93-01-25 K. A. Cottongim B Table I; deleted tests Aperture jitter (tAJ), Aperture delay (tAD), and track/hold acquis
2、ition tA (T/H). Table I; For the VOLtest changed IOL= 4.8 mA to 3.2 mA. For the VOLtest changed the max limit from 0.4 V to 0.5 V. 95-06-16 K. A. Cottongim C Table I; For the enable data input loading current (ILED) changed the min/max limits from -100/+100 A to -150/+150 A. 97-04-03 K. A. Cottongim
3、 D Figure 1; corrected the width of case outline Y. Changed from .120 inches maximum to 1.20 inches maximum. Redrew entire document. -sld 99-09-29 Raymond Monnin E Update drawing. 06-04-11 Raymond Monnin REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9
4、 10 11 12 13 14 PMIC N/A PREPARED BY Robert M. Heber DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Donald R. Osborne POST OFFICE BOX 3990 COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY William K. Heckman MIC
5、ROCIRCUIT, HYBRID, LINEAR, 12-BIT, ANALOG TO DIGITAL CONVERTER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-05-31 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-88542 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E382-06 Provided by IHSNot for ResaleNo reproduction or network
6、ing permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88542 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be pro
7、cessed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2 PIN. The PIN shall be as shown in the following example: 5962-88542 01 X X Drawing number Device type Case outline Lead finish (see 1.2
8、.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function 01 ADC00300II A/D converter, track/hold, 12-bit 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows
9、: Outline letter Descriptive designator Terminals Package style X See figure 1 40 Dual-in-line Y See figure 1 40 Flat package 1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Positive supply voltage range (VCC) . -0.3 V dc to +18 V dc Negati
10、ve supply voltage range (VEE) +0.3 V dc to -18 V dc Logic supply voltage range (VDD) . -0.3 V dc to +7.0 V dc Analog input voltage 20 V dc Logic input voltage range. -0.3 V dc to VDDPower dissipation (TC= +125C) . 4.5 W Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds)
11、 +300C Junction temperature (TJ) +150C Thermal resistance, junction-to-case (JC). 5.7C/W Thermal resistance, case-to-ambient (CA) 15C/W 1.4 Recommended operating conditions. Positive supply voltage range (VCC) . +14.25 V dc to +15.75 V dc Negative supply voltage range (VEE) -14.25 V dc to -15.75 V d
12、c Logic supply voltage range (VDD) . +4.75 V dc to +5.25 V dc Logic input voltage range. 0 V dc to +5.0 V dc Analog input voltage 10 V dc Case operating temperature range (TC). -55C to +125C 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation a
13、t the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88542 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSC
14、C FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solici
15、tation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. DEPARTMENT OF DEFENSE H
16、ANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, B
17、uilding 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific e
18、xemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturers Qua
19、lity Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modificatio
20、n in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(
21、s) shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figure 4
22、. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the
23、 subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN m
24、ay also be marked. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88542 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.6 Data. In addition to the ge
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