DLA SMD-5962-87777 REV B-2001 MICROCIRCUIT LINEAR TRANSISTOR ARRAYS MATCHED PAIR MONOLITHIC SILICON《硅单片晶体管阵列 配对线性微电路》.pdf

《DLA SMD-5962-87777 REV B-2001 MICROCIRCUIT LINEAR TRANSISTOR ARRAYS MATCHED PAIR MONOLITHIC SILICON《硅单片晶体管阵列 配对线性微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-87777 REV B-2001 MICROCIRCUIT LINEAR TRANSISTOR ARRAYS MATCHED PAIR MONOLITHIC SILICON《硅单片晶体管阵列 配对线性微电路》.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDA Change for 1.3 collector-emitter voltage maximum limit. Change limits andconditions for base offset voltage, change in emitter-base offset, collectorleakage, base leakage, current gain and gain match tests.89-08-25 M. A. FryeB Drawing updated to ref

2、lect current requirements. Editorial changes throughout. drw01-01-16 Raymond MonninThe original first page of this drawing has been replaced.REVSHEETREVSHEETREV STATUS REV BBBBBBBBBOF SHETS SHET 123456789PMIC N/A PREPARED BYJoseph A. KerbyDEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHEC

3、KED BYRay MonninCOLUMBUS, OHIO 43216http:/www.dscc.dla.milTHIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYMichael A. Frye MICROCIRCUIT, LINEAR, TRANSISTORARRAYS/MATCHED PAIR, MONOLITHIC SILICONAND AGENCIES OF THEDEPARTMENT OF DEFENSEDRAWING APPROVAL DATE87-12-11AMSC N/AREVISION LEVELBSI

4、ZEACAGE CODE672685962-87777SHEET1 OF 9DSCC FORM 2233APR 97 5962-E177-01DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-87777DEFENSE

5、 SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET2DSCC FORM 2234APR 971. SCOPE1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits inaccordance with MIL-PRF-38535, appendix A.1.2 Part or Identifying Number (PIN). The

6、complete PIN is as shown in the following example:5962-87777 01 X ADrawing number Device type(see 1.2.1)Case outline(see 1.2.2)Lead finish(see 1.2.3)1.2.1 Device type. The device type identify the circuit function as follows:Device type Generic number Circuit function01 LM194 Transistor supermatch p

7、air1.2.2 Case outline. The case outline is as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX See figure 2 6 Similar to a TO-99 can1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.1.3 Absolute maximum ratings. Co

8、llector current 20 mACollector-emitter voltage 35 V dcBase-emitter current G7210 mAMaximum power dissipation (PD). 500 mWLead temperature (soldering, 60 seconds) +300G71CStorage temperature range -65G71C to +150G71CThermal resistance, junction-to-case (G54JC). 70G71C/WThermal resistance, junction-to

9、-case (G54JA). 230G71C/W1.4 Recommended operating conditions.Ambient operating temperature range (TA) -55G71C to +125G71CProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-87777DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS

10、, OHIO 43216-5000REVISION LEVELBSHEET3DSCC FORM 2234APR 972. APPLICABLE DOCUMENTS2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form apart of this drawing to the extent specified herein. Unless otherwise specified, the issues of these do

11、cuments are those listedin the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited inthe solicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEF

12、ENSEMIL-STD-883 - Test Method Standard Microcircuits.MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings.MIL-HDBK-780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the speci

13、fication, standards, and handbooks are available from the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the textof this drawing ta

14、kes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless aspecific exemption has been obtained.3. REQUIREMENTS3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices an

15、d as specified herein. Product built to this drawing that is produced by a Qualified ManufacturerListing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers

16、approved program plan and qualifyingactivity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) planmay make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications sha

17、ll not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be asspecified in MIL-PRF-

18、38535, appendix A and herein.3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein and figure 2.3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical

19、 performance characteristics areas specified in table I and shall apply over the full ambient operating temperature range.3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electricaltests for each subgroup are described in table I.Pr

20、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-87777DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET4DSCC FORM 2234APR 97TABLE I. Electrical performance characteristics.Test SymbolCondit

21、ions-55G71C G64 TA G64 +125G71CGroup AsubgroupsDevicetypeLimits UnitMin MaxEmitter: Base offset voltageVBEO VCB = 0 V, IC = 1 mA 1 All G72100 G50VVCB = 35 V, IC = 1 mA 1 All G721002, 3 G72350VCB = 0 V, IC = 0.3 mA 1 All G72100VCB = 0 V, IC = 100 G50A 1Al G72100VCB = 35 V, IC = 100 G50A 1Al G721002,

22、3 G72350VCB = 0 V, IC = 10 G50A 1Al G72100VCB = 35 V, IC = 10 G50A 1Al G72100VCB = 0 V, IC = 1 G50A 1Al G72100VCB = 35 V, IC = 1 G50A 1Al G72100Change in emitter-baseDeltaVCB = 0 to 35 V, IC = 1 mA 1 All G7225 G50Voffset VBEOVCB = 0 to 35 V, IC = 100 G50A 1Al G7225VCB = 0 to 35 V, IC = 10 G50A 1Al G

23、7225VCB = 0 to 35 V, IC = 1 G50A 1Al G7225VCB = 0 V, IC = 1 to 300 G50A 1Al G7225Collector: Collector leakageICCX VCB = 35 V, COLL 1 to COLL 2 1 All G722 nAVCB = 35 V, COLL 2 to COLL 1 1 All G722Collector: Base leakageICBX VCB = 35 V, COLL 1 to BASE 1 1 All G720.25 nAVCB = 35 V, COLL 2 to BASE 2 1 A

24、ll G720.25Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-87777DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET5DSCC FORM 2234APR 97TABLE I. Electrical performance characteristics - con

25、tinued.Test SymbolConditions-55G71C G64 TA G64 +125G71CGroup AsubgroupsDevicetypeLimits UnitMin MaxCurrent gainhFE VCB = 0 V, IC = 1 mA 1 All 350VCB = 35 V, IC = 1 mA 1 All 3502, 3 250VCB = 0 V, IC = 100 G50A 1 All 350VCB = 35 V, IC = 100 G50A 1 All 350VCB = 0 V, IC = 10 G50A 1 All 300VCB = 35 V, IC

26、 = 10 G50A 1 All 300VCB = 0 V, IC = 1 G50A 1 All 200VCB = 35 V, IC = 1 G50A 1 All 200Gain matchhFE VCB = 0 V, IC = 1 mA 4 All G722 %matchVCB = 35 V, IC = 1 mA 4 All G7225, 6 G726VCB = 0 V, IC = 100 G50A 4Al G722VCB = 35 V, IC = 100 G50A 4Al G722VCB = 0 V, IC = 10 G50A 4Al G722VCB = 35 V, IC = 10 G50

27、A 4Al G722Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-87777DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET6DSCC FORM 2234APR 973.5 Marking. Marking shall be in accordance with MIL-

28、PRF-38535, appendix A. The part shall be marked with the PINlisted in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). Forpackages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has th

29、eoption of not marking the “5962-“ on the device.3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in complianceto MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark inaccordance

30、with MIL-PRF-38535 to identify when the QML flow option is used.3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as anapproved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA p

31、rior tolisting as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein.3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be providedwith each

32、lot of microcircuits delivered to this drawing.3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,appendix A.3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturersfacility

33、and applicable required documentation. Offshore documentation shall be made available onshore at the option of thereviewer.Device type 01Case outline XTerminal number Terminal symbol1 Collector2Base3 Emitter4 Emitter5Base6 CollectorFIGURE 1. Terminal connections.Provided by IHSNot for ResaleNo repro

34、duction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-87777DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET7DSCC FORM 2234APR 97Inches MillimetersSymbolMin Max Min MaxA 0.165 0.185 4.191 4.699G87b 0.015 0.016 0.381 0.406G87D 0.3

35、50 0.370 8.890 9.398G87D1 0.315 0.335 8.001 8.509e 0.195 0.205 4.953 5.207e1 0.120 0.140 3.048 3.556F 0.035 0.889k 0.028 0.034 0.711 0.864k1 0.029 0.045 0.737 1.143L 0.500 12.700L1 0.025 0.635L2 0.015 0.040 0.318 1.016FIGURE 2. Case outline X.Provided by IHSNot for ResaleNo reproduction or networkin

36、g permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-87777DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET8DSCC FORM 2234APR 974. QUALITY ASSURANCE PROVISIONS4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance wi

37、th MIL-PRF-38535,appendix A.4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devicesprior to quality conformance inspection. The following additional criteria shall apply:a. Burn-in test, method 1015 of MIL-STD-883.(1) Test condition A, B

38、, C, or D. The test circuit shall be maintained by the manufacturer under document revisionlevel control and shall be made available to the preparing or acquiring activity upon request. The test circuit shallspecify the inputs, outputs, biases, and power dissipation, as applicable, in accordance wit

39、h the intent specified intest method 1015 of MIL-STD-883.(2) TA = +125G71C, minimum.b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parametertests prior to burn-in are optional at the discretion of the manufacturer.TABLE II. Electri

40、cal test requirements.MIL-STD-883 test requirements Subgroups(in accordance withMIL-STD-883, method 5005,table I)Interim electrical parameters(method 5004)- - -Final electrical test parameters(method 5004)1*, 2, 3, 4, 5, 6Group A test requirements(method 5005)1, 2, 3, 4, 5, 6Groups C and D end-point

41、electrical parameters(method 5005)1, 2, 3* PDA applies to subgroup 1.4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply.4.3.1 Group A insp

42、ection.a. Tests shall be as specified in table II herein.b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA5962-87777DEFENSE SUPPL

43、Y CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET9DSCC FORM 2234APR 974.3.2 Groups C and D inspections.a. End-point electrical parameters shall be as specified in table II herein.b. Steady-state life test conditions, method 1005 of MIL-STD-883.(1) Test condition A, B, C, or D. The test

44、circuit shall be maintained by the manufacturer under document revisionlevel control and shall be made available to the preparing or acquiring activity upon request. The test circuitshall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intentspecifie

45、d in test method 1005 of MIL-STD-883.(2) TA = +125G71C, minimum.(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.5. PACKAGING5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.6. NOTES6.1 Intended use. Mic

46、rocircuits conforming to this drawing are intended for use for Government microcircuit applications(original equipment), design applications, and logistics purposes.6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specifi

47、cation or drawing.6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record forthe individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.6.4 Record of users. Military and industrial use

48、rs shall inform Defense Supply Center Columbus when a system applicationrequires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used forcoordination and distribution of changes to the drawings. Users of drawings covering microelectronics devi

49、ces (FSC 5962)should contact DSCC-VA, telephone (614) 692-0544.6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone(614) 692-0674.6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has bee