DLA SMD-5962-87741 REV J-2010 MICROCIRCUIT LINEAR NEGATIVE ADJUSTABLE REGULATOR MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE 69210. Add case outline U. Editorial changes throughout. 91-05-07 M. A. FRYE B Changes in accordance with NOR 5962-R088-93. 93-03-15 M. A. FRYE C Changes in accordance with NOR 5962-R206-94. 94-06-14 M. A. FRYE D Changes in accord
2、ance with NOR 5962-R216-96. 96-09-12 R. MONNIN E Add radiation hardness requirements. Redrawn. rrp 00-04-19 R. MONNIN F Add case outline Y. - ro 02-04-30 R. MONNIN G Drawing updated to reflect current requirements. - rrp 05-07-19 R. MONNIN H Make correction to Load regulation test unit column as spe
3、cified under Table I. Make a change to IOUTunder footnote 3/ as specified under Table I. - ro 05-08-10 R. MONNIN J Update drawing as part of the 5 year review. - jt 10-11-17 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV J J J J J J J J J J J
4、 J OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY MARCIA B. KELLEHER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES
5、 REUSING APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, NEGATIVE ADJUSTABLE REGULATOR MONOLITHIC SILICON DRAWING APPROVAL DATE 88-01-08 AMSC N/A REVISION LEVEL J SIZE A CAGE CODE 67268 5962-87741 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E084-11 Provided by IHSNot for ResaleNo reproduction or netw
6、orking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87741 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B
7、 microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87741 01 X A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type. The device type ident
8、ify the circuit function as follows: Device type Generic number Circuit function 01 1033 3.0 A negative regulator, adjustable 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style T See figure 1 3 TO-257
9、 flange mounted with non-isolated tab and glass sealed U See figure 1 3 TO-257 flange mounted with isolated tab and glass sealed X MBFM1-P2 2 TO-3 can Y See figure 1 3 Flange mount, glass sealed with gull wing leads 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3
10、 Absolute maximum ratings. Input to output voltage differential . 35 V dc Power dissipation (PD) . Internally limited Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +150C Storage temperature range . -65C to +150C Thermal resistance, junction-to-case (JC): Case T 2.3C/W
11、Cases U and Y 3.5C/W Case X 3.0C/W 1.4 Recommended operating conditions. Ambient operating temperature range (TA) -55C to +125C 1.5 Radiation features: Maximum total dose available (dose rate = 50 300 rads(Si) / s) . 30 Krads (Si) 1/ _ 1/ These parts may be dose rate sensitive in a space environment
12、 and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STA
13、NDARD MICROCIRCUIT DRAWING SIZE A 5962-87741 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawin
14、g to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883
15、- Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/
16、assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes preced
17、ence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as sp
18、ecified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approv
19、ed program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall n
20、ot affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38
21、535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on
22、figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall
23、be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For
24、packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PR
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