DLA SMD-5962-87733 REV C-2011 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS BCD-TO-7 SEGMENT LATCH DECODER DRIVER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Delete vendor CAGE 27014. Change vendor CAGE 18714 to 34371. Editorial changes throughout. 90-11-26 M. A. Frye B Add notes to figure 4, switching waveforms and test circuit. Update boilerplate to MIL-PRF-38535 requirements. Editorial changes thro
2、ughout. LTG05-11-10 Thomas M. Hess C Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 11-08-25 Thomas M. Hess REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY James E. Nicklaus DLA LAND AND MAR
3、ITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY D. A. DiCenzo APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, BCD-TO-
4、7 SEGMENT LATCH/DECODER/DRIVER, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-03-03 REVISION LEVEL C SIZE A CAGE CODE 67268 5962-87733 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E465-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI
5、T DRAWING SIZE A 5962-87733 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 P
6、art or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87733 01 E A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number
7、 Circuit function 01 54HC4511 BCD-to-7 segment latch/decoder/driver 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square chip carrier 1
8、.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode cur
9、rent 20 mA DC output current (per pin) 25 mA DC VCCor GND current (per pin) . 50 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) 500 Mw 4/ Lead temperature (soldering, 10 seconds) 260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperatur
10、e (TJ) 175C 1.4 Recommended operating conditions. Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Input voltage range (VIN) 0.0 V dc to VCCOutput voltage range (VOUT) 0.0 V dc to VCCCase operating temperature range (TC) . -55C to +125C Input rise or fall time (tr, tf): VCC= 2.0 V . 0 to 1000 ns VC
11、C= 4.5 V . 0 to 500 ns VCC= 6.0 V . 0 to 400 ns 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ Th
12、e limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly at 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MIC
13、ROCIRCUIT DRAWING SIZE A 5962-87733 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions - Continued. Minimum setup time, A, B, C, or D to latch enable (ts): TC= +25C: VCC= 2.0 V . 100 ns VCC= 4.5 V . 20 ns VCC= 6.0 V . 1
14、7 ns TC= -55C to +125C: VCC= 2.0 V . 150 ns VCC= 4.5 V . 30 ns VCC= 6.0 V . 26 ns Minimum latch enable pulse width (tw): TC= +25C: VCC= 2.0 V . 80 ns VCC= 4.5 V . 16 ns VCC= 6.0 V . 14 ns TC= -55C to +125C: VCC= 2.0 V . 120 ns VCC= 4.5 V . 24 ns VCC= 6.0 V . 20 ns Minimum hold time, latch enable to
15、A, B, C, or D (th): TC= +25C: VCC= 2.0 V . 25 ns VCC= 4.5 V . 5 ns VCC= 6.0 V . 5 ns TC= -55C to +125C: VCC= 2.0 V . 40 ns VCC= 4.5 V . 8 ns VCC= 6.0 V . 7 ns 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
16、part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STA
17、NDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are availabl
18、e online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5
19、962-87733 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the soli
20、citation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard No. 7 - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Assoc
21、iation, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulati
22、ons unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Ma
23、nufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-3853
24、5. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in acco
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