DLA SMD-5962-87699 REV J-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS QUAD TWO-INPUT NAND GATE TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add B, S, Q, and V test limits. Change to one part-one part number format. Add ground bounce and latch-up immunity tests. Add 10.1 substitution statement. Editorial changes throughout. 92-07-10 Monica L. Poelking B Changes in accordance with NOR

2、5962-R041-93. 92-12-29 Monica L. Poelking C Changes in accordance with NOR 5962-R095-98. 98-04-24 Monica L. Poelking D Incorporate NOR 5962-R041-93 and NOR 5962-R095-98. Add V device class level. Add vendor CAGE code F8859. Add device type 03. Add case outlines X and Z. Add radiation features for de

3、vice type 01. Update boilerplate to MIL-PRF-38535 requirements. LTG 02-07-12 Thomas M. Hess E Add radiation features for device type 03 in section 1.5. Update the boilerplate to include radiation hardness assured requirements for device type 03. Editorial changes throughout. - jak 04-09-09 Thomas M.

4、 Hess E Add radiation features for device type 03 in section 1.5. Update the boilerplate to include radiation hardness assured requirements for device type 03. Editorial changes throughout. - jak 04-09-09 Thomas M. Hess F Change ICCLand ICCHmaximum limits I for device type 03 in table I. Correct the

5、 test circuit in figure 5. - jak 05-08-31 Thomas M. Hess G Add appendix A, microcircuit die. Update the boilerplate to MIL-PRF-38535 requirements and to include radiation hardness assurance requirements. - jak 07-03-07 Thomas M. Hess H Correct test condition VCCand value for VOH3in table IA. - PHN 0

6、7-10-16 Thomas M. Hess J Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 13-09-24 Thomas M. Hess REV SHEET REV J J J J J J J J J J J J J SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 REV STATUS REV J J J J J J J J J J J J J J OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 1

7、3 14 PMIC N/A PREPARED BY Jeffery Tunstall DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Ray Monnin APPROVED BY Michael

8、 A. Frye MICROCIRCUIT, DIGITAL, ADVANCED CMOS, QUAD TWO-INPUT NAND GATE, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-09-30 REVISION LEVEL J SIZE A CAGE CODE 67268 5962-87699 SHEET 1 OF 27 DSCC FORM 2233 APR 97 5962-E578-13 Provided by IHSNot for ResaleNo reproduction or networ

9、king permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87699 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (dev

10、ice classes M, B, and Q) and space application (device classes S and V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PI

11、N is as shown in the following example: 5962 F 87699 01 V X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes B, S, Q and V R

12、HA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2

13、 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACT00 Quad 2-input NAND gate, TTL compatible inputs 02 54ACT11000 Quad 2-input NAND gate, TTL compatible inputs 03 54ACT00 Quad 2-input NAND gate, TTL compatible inputs 1.2.

14、3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance wi

15、th MIL-PRF-38535, appendix A B, S, Q, or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14

16、or CDFP2-F14 14 Flat pack X CDFP3-F14 14 Flat pack E GDIP1-T16 or CDIP2-T16 16 Dual-in-line Z GDFP1-G14 14 Flat pack with gullwing leads 2 CQCC1-N20 20 Square leadless chip carrier Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT

17、 DRAWING SIZE A 5962-87699 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 3 DSCC FORM 2234 APR 97 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes B, S, Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings

18、. 1/ 2/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+0.5 V dc Clamp diode current (IIK, IOK) . 20 mA DC output current (IOUT) . 50 mA DC VCCor GND current (ICC, IGND) . 100 mA 3/ Storage tem

19、perature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW Lead temperature (soldering, 10 seconds): Case outline X . +260C All other case outlines except case X +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C Case operating tempe

20、rature (TC) . -55C to +125C 1.4 Recommended operating conditions. 2/ 4/ Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) +0.0 V dc to VCCMaximum low level input voltage (VIL) . 0.8 V dc at VCC= 4.5 V dc 0.8 V dc at VCC= 5.5 V d

21、c Minimum high level input voltage (VIH) 2.0 V dc at VCC= 4.5 V dc 2.0 V dc at VCC= 5.5 V dc Case operating temperature range (TC). -55C to +125C Input rise and fall rate (tr, tf) maximum: VCC= 4.5 V . 10 ns/V VCC= 5.5 V . 8.0 ns/V Maximum high level output current (IOH) -24 mA Maximum low level out

22、put current (IOL) 24 mA 1.5 Radiation features. Device type 01: Maximum total dose available (dose rate = 50 300 rads (Si)/s) 100 krads (Si) No single Event Latch-up (SEL) occurs at LET (see 4.4.5.2) 120 MeV-cm2/mg 5/ Device type 03: Maximum total dose available (dose rate = 50 300 rads (Si)/s) 300

23、krads (Si) No single Event Latchup (SEL) occurs at LET (see 4.4.5.2) . 93 MeV-cm2/mg 5/ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. The maximum junction temperature ma

24、y be exceeded for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 2/ Unless otherwise specified, all voltages are referenced to GND. 3/ For packages with multiple VCCand GND pins, this value represents the maximum total current flowing into or out

25、 of all VCCor GND pins. 4/ Unless otherwise specified, the values listed above shall apply over the full VCCand TCrecommended operating range. 5/ Limits obtained during technology characterization/qualification, guaranteed by design or process, but not production tested unless specified by the custo

26、mer through the purchase order or contract. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87699 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE D

27、OCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF

28、DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 -

29、List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.2 Non-Government publi

30、cations. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD20 - Standard for Description of 54/74ACXXXXX and 54/7

31、4ACTXXXXX Advanced High-Speed CMOS Devices. JESD78 - IC Latch-Up Test. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201-2107). ASTM INTERNATIONAL (ASTM) ASTM F1192 - Standar

32、d Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices. (Copies of this document is available online at http:/www.astm.org/ or from ASTM International, 100 Barr Harbor Drive, P. O. Box C700, West Conshohocken, PA 19428-2959). 2.3 Order o

33、f precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item

34、requirements. The individual item requirements for device classes B, S, Q, and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as desc

35、ribed herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document. 3.2 Design, constructi

36、on, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes B, S, Q, and V or MIL-PRF-38535, appendix A and herein for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without

37、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87699 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 5 DSCC FORM 2234 APR 97 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections sh

38、all be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce waveforms and test circuit. The ground bounce waveforms and test circuit shall be as specified on figur

39、e 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.2.7 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to t

40、he preparing and acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the

41、full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table IA. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In additio

42、n, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Markin

43、g for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes B, S, Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535.

44、 The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes B, S, Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing

45、(see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved sour

46、ce of supply for this drawing shall affirm that the manufacturers product meets, for device classes B, S, Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformanc

47、e as required for device classes B, S, Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA o

48、f change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option

49、to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for Re