DLA SMD-5962-87668 REV C-1991 MICROCIRCUITS 32-BIT MICROPROCESSOR DIGITAL CHMOS MONOLITHIC SILICON《硅单块 互补高性能金属氧化物半导体结构 32比特微处理器数字微型电路》.pdf

《DLA SMD-5962-87668 REV C-1991 MICROCIRCUITS 32-BIT MICROPROCESSOR DIGITAL CHMOS MONOLITHIC SILICON《硅单块 互补高性能金属氧化物半导体结构 32比特微处理器数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-87668 REV C-1991 MICROCIRCUITS 32-BIT MICROPROCESSOR DIGITAL CHMOS MONOLITHIC SILICON《硅单块 互补高性能金属氧化物半导体结构 32比特微处理器数字微型电路》.pdf（27页珍藏版）》请在麦多课文档分享上搜索。

1、SMD-5762-87668 REV C 59 = 9999996 0006092 3 i A B C REVISIONS Change C and Cou limits. Add ac test points to figure 4. Edi toriat changes ihroughout . Table I, ac test limits corrected. to group A inspection. case outline Y. Editorial chanaes throughout. Technical changes to absolute maximum ratings

2、. changes to table I. figure 1, figure 2, and figure 4. throughout. Table II, subgroup 4 added Added device types 03 and 04. Added Technical Clarifications and corrections on Editorial changes DESCRIPTION 1988 SEP 29 DEFENSE ELECTRONICS SUPPLY CENTER THIS DRAWING IS AVAILABLE OR USE BY ALL DEPARTMEN

3、TS AMSC NIA C SHEET 1 OF 25 D U.S. GOMRNMIHT PRlHTlNGWrlCE: I917 - 748-12916Op11 DESC FORM 193 SEP 87 5962-E269 DISTRIBUTION STATEMENT A. Approved for public release; dlrtrlbutlon Is unlimiled. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SND-5962

4、-87bb REV C 59 M 9999996 O006093 5 I, - I. SCOPE 1.1 SGope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes 8, QI and M) and space application (device classes $ and

5、VI, and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compli

6、ant non-JAN devices. When available, a choice of radiation hardness assurance (RHA) levels are reflected In the PIN. 1.2 p-. The PIN shall be as shown in the following example: - 1 I , 5962 87668 o1 I I I I I I I i Lead i Case i Devi ce Devi ce stock class designator type class out line finish I (Se

7、e 1.2.3) II Federal RHA designator (See 1.2.1) (See 1.2.2) designator (See 1-2.4) (See 1.2.5) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. Device classes M, EI, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate

8、RHA designator. V RHA marked devices shall meet the MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. Device classes Q and 1.2.2 Device type(s). The device type(s) shall identify the circuit function a$ follows: Device ty

9、pe Generic numbeq ci.rcuit function Frequency O1 80386-16 32-bi t mi croprocessor 16 MH2 02 80386-12 32-bi t microprocessor 12.5 MHt 03 80386-20 32-bit microprocessor 20 MHz 04 80386-25 32-bit microprocessor 25 MHt 1.2.3 Device class desimator. The device class designator shall be a single letter Sd

10、entifying the product assurance level as follows: Device class Dev.ice requirements documentation M Vendor self-certification to the reqiairerqnts Sor non-JAN class B microcircuit$ in accordance with 1,2.1 of MIL-STD-883 , B or s Q or W Certification and qualSfication to MIL-M-38510 Certification an

11、d qualification to MIL-1-38535 SIZE 5962-87668 STANDARDIZED A MILITARY DRAWING I DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I REVSION LEVEL SHEET c 2 JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-87bh REV C 59 999939b OOOb

12、094 7 -5 1.2.4 Case outlinek). For device classes M, 8, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. MIL-1-38535, appendix C of MIL-H-38510, and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of Outline

13、 letter Case outline X Y See figure 1 (164-terminal, 1.140t1 x 1.140“ x .115“), leaded chip P-AF (132-terminal, 1.480“ x 1.480“ x .345“), pin grid array carrier with unformed leads 1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-1-38535 for clas

14、ses Q and V. Finish letter “X8I shall not be marked on the microcircuit or its packaging. The “X“ designation is for use in specifications when lead finishes A, 8, and C are considered acceptable and interchangeable without preference. 1.3 Absolute maximum ratincis. Storage temperature range - - - -

15、 - - - - - - - - Supply voltage with respect to ground - - - - - - Voltage on other pins - - - - - - - - - - - - - - Lead temperature (soldering, 10 seconds)- - - - - Thermal resistance, junction-to-case (eJc): Junction temperature (TJ) - - - - - - - - - - - - Maximum power dissipation (PD)- - - - -

16、 - - - - - Casex CaseY _-_-_- 1.4 Recommended operating conditions. Supply voltage (V )- - - - - - - - - - - - - - - Minimum high levefCinput voltage (VIH): Maximum low level input voltage (VIL) - - - - - - Frequency of operat i on: Logic inputs- - - - - - - - - - - - - Clock input - - - - - - - - -

17、 - - - - - - - - - Device 01 - - - - - Device 02 - - - - - - - - - - - - - - - - - - - Device 03 I - - - - - - - - - - - - - - - - Device 04 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Case operating temperature range (TC) - - - - - - 1.5 Digital laic testing for device classes Q

18、 and V. -65OC to +15OoC -0.5 V dc to t6.5 V dc -0.5 V dc to Vcc +0.5 V dc +27SoC See MIL-M-38510, appendix C 4OCfU tlMC 3.6 U 5.0 V dc *5 percent 2.0 V dc to Vc t0.3 V dc V -6c3 V dc to 0.8 V 8c 16 MHz 12.5 MHz 20 MHz 25 MHz -0.8 V dc $o Vc t0.3 V dc -55OC to t125OC Fault coverage measurement of man

19、ufacturing Logic tests (MIL-STD-883, test method 5012) - - - - - - - 98.4 percent STANDARDIZED MILITARY DRAWING I YE I I 5962-87668 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I REVISION LEVEL I SHEET c 3 JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without li

20、cense from IHS-,-,-;SmD-59b2-87bb8 REV C 59 999799b 0006095 9 m j .- - e 2. APPLICABLE DOCUMENTS 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Depa

21、rtment of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MIL-M-38510 - Microcircuits, General Specification for. MIL-1-38535 - Integrated Circuits, Manufacturing, General Specification f

22、or. STANDARDS WILITARY MIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers. MIL-STD-883 - Test Methods and Procedures for Microelectronics. BULLETIN MILITARY Pl IL-BUL-1 O3 - List of Standardized Military Drawings (SMDIS). HANDBOOK MILITARY MIL-HDBK-780 - Standardized Mil

23、itary Drawings. (Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity. 1 herein, the text of this drawing shall take prec

24、edence. 2.2 Order of precedence. In the event of a conf Lict between the text of this drawing and the references cited 3. REQUIREMENTS 3.1 Item requirements, The individual item requirements for device class I4 shall be in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883

25、in conjunction with compliant non-JAN devices“ and as specified herein. The individual item requirements for device classes B and S shall be in accordance with MIL-M-38510 and as specified herein. be included in this SMD. MIL-1-38535, the device manufacturers Quality Management (QM) plan, and as spe

26、cified herein. as specified in MIL-M-38510 for device classes M, B, and S and MIL-1-38535 for device classes Q and V and herein. For device classes B and S, a full electrical characterization table for each device type shall The individual item requirements for device classes Q and V shall be in acc

27、ordance with 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be 3.2.1 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. I 3.2.3 Block diauram. The block diagram shall be as specified on figure 3. Case ou

28、tline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 5962-87668 REVISION LEVEL SHEET STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 3SC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without li

29、cense from IHS-,-,-. SIZE A STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SMD-5962-87668 REV C 59 9999996 0006096 O H 5962-87668 REVISION LEVEL SHEET C 5 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified h

30、erein, the electrical performance Characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. IIA. 3.4 Electrical test requirements. 3.5 Marking. The electrical test requirements shall be the subgroups specified in

31、table The electrical tests for each subgroup are defined in table 1. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be In addition, the manufacturers PIN may also be marked as listed in accordance with MIL-STD-883 (see 3.1 herein). in MIL-BUL-103. classe

32、s Q and V shall be in accordance with MIL-1-38535. MIL-STD-883 (see 3.1 herein). in MIL-M-38510. manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer i

33、n order to supply to the requirements of this drawing (see 6.7.2 herein). The certificate of compliance submitted to DESC-ECC prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class M the requirements of MIL-STD-883 (see 3

34、.1 herein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. 3.1 herein) or device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. product (see 6.2 herei

35、n) involving devices acquired to this drawing is required for any change as defined in Marking for device classes B and S shall be in accordance with MIL-M-38510. The compliance mark for device class M shall be a Marking for device as required in The certification mark for device classes Q and V sha

36、ll be a “QML“ as required in MIL-1-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes B and S shall be a “JI or “JAN“ as requir,ed 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a For device 3.7 Certificate of

37、conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.8 Notification of chanae for device class M. For device class M, notification to DESC-ECC of change of MIL-STD-480. 3.9 Verification and review for device class M. For device class M, DESC, DESCs agent, an

38、d the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. documentation shall be made available onshore at the option of the reviewer. Offshore 3.10 Microcircuit woup assianment for device classes M, B. and S. Device classes M, 8, and S de

39、vices covered by this drawing shall be in microcircuit group number 105 (see MIL-M-38510, appendix E). 3.11 Serialization for device class S. All device class S devices shall be serialized in accordance with MIL-M-38510. 3.12 PIN supersession information. The PIN supersession information shall be as

40、 specified in the appendix. 4. QUALITY ASSURANCE PROVISIONS 4.1 Samplina and inspection. For device class M, sampling and inspection procedures shall be in accordance with section 4 of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). sampling and inspection procedures shall be in

41、 accordance with MIL-M-38510 and method 5005 of MIL-STD-883, except as modified herein. MIL-1-38535 and the device manufacturers QM plan. be conducted on all devices prior to quality conformance inspection. in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to

42、 qualification and quality conformance inspection. shall be conducted on all devices prior to qualification and technology conformance inspection. For device classes 8 and S, For device classes Q and V, sampling and inspection procedures shall be in accordance with 4.2 Screeninq. For device class M,

43、 screening shall be in accordance with method 5004 of MIL-STD-883, and shall For device classes Q and V, screening shall be in accordance with MIL-1-38535, and For device classes B and S, screening shall be Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS

44、-,-,-SMD-5962-87668 REV C 59 W 9999996 0006097 2 = 4.2.1 Additional criteria for device classes M. B, and S. Burn-in test, method 1015 of MXL-STD-883, (1) Test condition A, B, C, or D. to DESC-ECC for review with the certificate of compliance. the test circuit shall he submitted to the qualifying ac

45、tivity. a. For device class M, the test circuit shall be submitted For device classes B and S, (2) TA = +125C, minimum. Interim and final electrical test parameters shall be as specified in table IIA herein. b. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test

46、condition and test temperature or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-1-38535. shall be submitted to DESC-ECC with the certificate of compliance and shall be under the control of the device manufacturers Technology Review Board (TRB)

47、 in accordance with MIL-1-38535. Interim and final electrical test parameters shall be as specified in table IIA herein. Additional screening for device class V beyond the requirements of device class Q shall be as specified in appendix of MIL-1-38535 and as detailed in table IIB herein. The burn-in

48、 test circuit b. c. 4.3 Qualification inspection. 4.3.1 Qualification inspection for device classes B and S. Qualification inspection for device classes B and S shall be in accordance with MXL-M-38510. MIL-STD-883 and herein for groups A, 8, C, D, and E inspections (see 4.4.1 through 4.4.5). Inspect

49、ions to be performed shall be those specified in method 5005 of 4.3.2 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and Y shall be in accordance with MIL-1-38535. herein for groups A, 8, C, D, and E inspections (see 4.4.1 through 4.4.5). MIL-STD-883 (see 3.1 herein) and as specified herein. Quality conformance inspection for device classes B and S shall be in accordance with MIL-M-38510 and