DLA SMD-5962-87551 REV D-2008 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL BUFFER LINE DRIVER WITH THREESTATE OUTPUTS MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Changes IAW NOR 5962-R087-93. tjr 93-02-25 Monica L. Poelking C Add case outline Z. Update boilerplate to MIL-PRF-38535 requirements. jak 01-08-27 Thomas M. Hess D Update boilerplate to MIL-PRF-38535 requirements. - LTG 08-04-16 Thomas M. Hess Cu
2、rrent CAGE CODE is 67268 REV SHET REV SHET REV STATUS REV D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Greg A. Pitz DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Daniel A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil TH
3、IS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Nelson A. Hauck AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-05-12 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL BUFFER/LINE DRIVER WITH THREE- STATE OUTPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE C
4、ODE 14933 5962-87551 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E305-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87551 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DS
5、CC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87551 01 L
6、 A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC241 Octal buffer/line driver with three-state outputs 02 54AC11241 Octal buffe
7、r/line driver with three-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line R GDIP1-T20 or CDIP4-T24 20 Dual-in-line S GDFP2-F20 or CDFP3-F20
8、 20 Flat pack Z GDFP1-G20 20 Flat pack with gull wing 2 CQCC1-N20 20 Square leadless chip carrier 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range (VCC) -0.5 V dc to +6.0 V
9、dc 1/ DC Input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc 1/ DC Output voltage range (VIN) . -0.5 V dc to VCC+ 0.5 V dc 1/ Clamp diode current. 20 mA DC output current (per pin) 50 mA DC VCCor GND current 100 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 50
10、0 mW Lead temperature (soldering, 10 seconds). +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 2/ 1/ Unless otherwise specified, all voltages are referenced to GND. 2/ Maximum junction temperature shall not be exceeded except for allowable short dur
11、ation burn-in screening conditions in accordance with method 5004 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87551 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL
12、D SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage range (VCC) +3.0 V dc to +5.5 V dc 1/ Input voltage range (VIN) 0.0 V dc to VCCOutput voltage range (VOUT). 0.0 V dc to VCCCase operating temperature range (TC). -55C to +125C Input rise or fall times: Device type 0
13、1; Data inputs, VCC= 3.6 V, VCC= 5.5 V 0 to 8 ns/V Output enable inputs, VCC= 3.6 V, VCC= 5.5 V . 0 to 8 ns/V Device type 02; Data inputs, VCC= 3.6 V, VCC= 5.5 V 0 to 8 ns/V Output enable inputs, VCC= 3.6 V, VCC= 5.5 V . 0 to 5 ns/V 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, an
14、d handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Cir
15、cuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780
16、 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the ev
17、ent of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 1/ Operation from 2.0 V dc to 3.0 V dc is provid
18、ed for compatibility with data retention and battery backup systems. Data retention implies no input transitions and no stored data loss with the following conditions: VIH 70% VCC, VIL 30% VCC, VOH 70% VCC -20 A, VOL 30% VCC 20 A. Provided by IHSNot for ResaleNo reproduction or networking permitted
19、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87551 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appe
20、ndix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML p
21、roduct in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or f
22、unction of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physi
23、cal dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specif
24、ied on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electr
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