DLA SMD-5962-87540 REV D-2009 MICROCIRCUIT LINEAR HIGH SPEED SAMPLE AND HOLD AMPLIFIER MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in table I. Change CAGE code identification number to 67268. 87-08-03 M. A. FRYE B Add case outline 2. Editorial changes throughout. 90-06-04 M. A. FRYE C Drawing updated to reflect current requirements. - ro 02-08-06 R. MONNIN D Update d

2、rawing as part of 5 year review. -rrp 09-01-20 R. HEBER CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY CHARLES J. PHILLIPS DEFENSE SUPPLY CENTER COLUMBUS

3、 STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCENZO COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR, HIGH SPEED, SAMPLE AND HOLD AMPLIFIER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFE

4、NSE DRAWING APPROVAL DATE 87-04-16 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-87540 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E406-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87540 DEFENSE SU

5、PPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PI

6、N). The complete PIN is as shown in the following example: 5962-87540 01 C X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD585 Hi

7、gh speed, sample and hold amplifier 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual in line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The l

8、ead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltages ( +VS, -VS) . 18 V dc Logic inputs . VSAnalog inputs VSRIN, RFBpins VSOutput short circuit to ground Indefinite TTL logic reference short circuit to ground Indefinite Storage temperature range . -6

9、5C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction to case (JC) See MIL-STD-1835 Thermal resistance, junction to ambient (JA) . 110C/W 1.4 Recommended operating conditions. Positive supply voltage (+VS) +5 V dc to +18 V dc Negative supply voltage (-VS) . -12 V dc

10、 to -18 V dc Ambient operating temperature range (TA) . -55C to +125C 1/ Unless otherwise specified, all voltages referenced to ground. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87540 DEFENSE SUPPLY CEN

11、TER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise spe

12、cified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - I

13、nterface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardiz

14、ation Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes app

15、licable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is p

16、roduced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in acc

17、ordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ c

18、ertification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The cas

19、e outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram. The block diagram shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the ele

20、ctrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in

21、table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, th

22、e manufacturer has the option of not marking the “5962-“ on the device. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87540 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4

23、DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Offset voltage VOSVOUT= 0 V 1,2,3 01 -3 +3 mV 4 -2 +2 Bias current IBVIN= 0 V 1 01 -2 +2 nA Bias current over tem

24、perature IBT VIN= 0 V 2 01 -50 +50 nA TTL reference output VLREF50 A load 1 01 1.2 1.6 V TTL reference output over temperature VLREFT 50 A load 2,3 01 0.8 1.9 V Logic input high voltage VIHHold = VLREF1 01 2.0 V Logic input high voltage over temperature VIHT Hold = VLREF2,3 01 2.0 V Logic input low

25、voltage VILHold = VLREF1 01 0.8 V Logic input low 2/ over voltage temperature VILT Hold = VLREF2,3 01 0.7 V Logic input current IILVS= 18 V 1,2,3 01 50 A Supply current ISSRL= infinite 1,2,3 01 10 mA Power supply rejection PSRR +VS= +5 V to +18 V, -VS= -12 V to 18 V, VIN= VOUT= 0 V, TA= +25C 1 01 70

26、 dB Acquisition time tacq10 V step to 0.01 %, TA= +25C 7 01 3 s 20 V step to 0.01 %, 3/ TA= +25C 5 Droop rate 2/ 4/ VDRPVIN= 0 V, TA= +25C 4 01 1 mV/ms See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU

27、IT DRAWING SIZE A 5962-87540 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit

28、Min Max Sample to hold offset 2/ SHOSVIN= 0 V, TA= +25C 4 01 3 mV Application resistor mismatch RM 1,2,3 01 0.3 Common mode rejection CMRR VCM= 10 V, TA= +25C 1 01 80 dB Common mode rejection over temperature CMRRT VCM= 10 V 2,3 01 77 dB Slew current 5/ ISLTA= +25C 4 01 850 A Slew current over 5/ te

29、mperature ISLT 2,3 01 600 A Output resistor ROUTIOUT= 10 mA, TA= +25C 1 01 0.05 Output resistor over temperature ROUTT IOUT= 10 mA 2,3 01 0.10 Output current IOUTRL= 100 , TA= +25C 1 01 12 mA 1/ Unless otherwise specified, VS= 15 V, CH= internal, RL= infinite, A = +1, HOLD active, sample mode. 2/ Te

30、sted in hold mode. 3/ Guaranteed, if not tested, to the limits specified in table I herein. 4/ Doubles every 10C. 5/ VOUT= 20 Vp-p. Slew rate = slew current / CH. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59

31、62-87540 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 NOTE: For case outline 2, it is recommended that terminals 1 and 11 be connected to ground. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking perm

32、itted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87540 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Block diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro

33、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87540 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-3853

34、5, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed a

35、s an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certif

36、icate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verifi

37、cation and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling a

38、nd inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in te

39、st, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases

40、, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at

41、the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as spe

42、cified in table II herein. b. Subgroups 5, 6, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87540 DEFENSE SUPPLY CENTER COLUMBUS COL

43、UMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*

44、, 2, 3, 4 Group A test requirements (method 5005) 1, 2, 3, 4, 7 Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditi

45、ons, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biase

46、s, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be

47、in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing

48、 will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,