DLA SMD-5962-87538 REV A-2008 MICROCIRCUIT LINEAR SINGLE 16-CHANNEL ANALOG MUX DEMUX WITH OVERVOLATGE PROTECTION MONOLITHIC SILICON《线性微电路 设有过压保护的单16 信道模拟多路复用器(MUX) 多路分解器(DEMUX)和单片硅.pdf
《DLA SMD-5962-87538 REV A-2008 MICROCIRCUIT LINEAR SINGLE 16-CHANNEL ANALOG MUX DEMUX WITH OVERVOLATGE PROTECTION MONOLITHIC SILICON《线性微电路 设有过压保护的单16 信道模拟多路复用器(MUX) 多路分解器(DEMUX)和单片硅.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-87538 REV A-2008 MICROCIRCUIT LINEAR SINGLE 16-CHANNEL ANALOG MUX DEMUX WITH OVERVOLATGE PROTECTION MONOLITHIC SILICON《线性微电路 设有过压保护的单16 信道模拟多路复用器(MUX) 多路分解器(DEMUX)和单片硅.pdf(19页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Redraw. Incorporate changes from change request approval letter. - drw 08-07-07 Robert M. Heber THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV A A A A SHEET 15 16 17 18 REV STATUS REV A A A A A A A A A A A A A A OF SHEET
2、S SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James E. Nicklaus CHECKED BY Charles E. Besore DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Michael A. Frye STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS
3、AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-01-24 MICROCIRCUIT, LINEAR, SINGLE 16-CHANNEL ANALOG MUX/DEMUX WITH OVERVOLATGE PROTECTION, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-87538 SHEET 1 OF 18 DSCC FORM 2233 APR 97 5962-E444-08 Provided by I
4、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87538 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assuranc
5、e class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is
6、 reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 D 87538 01 X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Case outline (see 1.2.4)Lead finish (see 1.2.5) / / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marke
7、d devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device
8、type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 HS-1840RH Single 16-channel analog MUX/DEMUX with high impedance analog input overvoltage protection. 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows:
9、Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line Y GDFP1-F28 28 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings
10、. Supply voltage between V+ and V- 40 V dc Supply voltage between V+ and GND +20 V dc Supply voltage between V- and GND. -20 V dc VREFto GND. +20 V dc Digital input overvoltage range. (GND) 4 V) VA (VREF) + 4 V) Analog input overvoltage range (power on/off). -25 V VS +25 V Storage temperature range
11、-65C to +150C Maximum power dissipation (PD): 1/ Case X 1600 mW Case Y 1400 mW Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ). +175C _ 1/ The derating factor for case X shall be 20.4 mW/C above TA= +95C, for case
12、 Y shall be 18.5 mW/C above TA= +95C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87538 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommen
13、ded operating conditions. Positive supply voltage (V+). +15 V dc Negative supply voltage (V-) -15 V dc VREF. 5 V dc (+10 V dc) 2/ VAH. 4.0 V dc (+7 V dc) 2/ VAL. 0.8 V dc 2/ VEN. 0.8 V dc Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, sta
14、ndards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Inte
15、grated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MI
16、L-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict b
17、etween the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 2/ For VREF= 5.0 V dc, VAH= 4.0 V dc minimum. For V REF= 10 V dc,
18、 VAH= 7.0 V dc. For either VREFvoltages, VAL= 0.8 V dc maximum. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87538 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FOR
19、M 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect
20、 the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physi
21、cal dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as sp
22、ecified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 4. 3.3 Electrical performance characte
23、ristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electr
24、ical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire
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