DLA SMD-5962-87001 REV C-2005 MICROCIRCUIT DIGITAL ECL UNIVERSAL COUNTER MONOLITHIC SILICON《硅单块 万能计数器发射极耦合逻辑 数字微型电路》.pdf

《DLA SMD-5962-87001 REV C-2005 MICROCIRCUIT DIGITAL ECL UNIVERSAL COUNTER MONOLITHIC SILICON《硅单块 万能计数器发射极耦合逻辑 数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-87001 REV C-2005 MICROCIRCUIT DIGITAL ECL UNIVERSAL COUNTER MONOLITHIC SILICON《硅单块 万能计数器发射极耦合逻辑 数字微型电路》.pdf（15页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline 2 and data that applies. Add figure 4. Add footnote 2/ to table I. Change tH3and testing conditions for ac parameters. Change terminal connections. Add VSPN for case outline 2. Editorial changes throughout. Add subgroup 8 to tabl

2、e II. Technical changes to table I and 1.4. Add 3/ to table I. 89-02-24 M. A. FRYE B Changes in accordance with N.O.R. 5962-R038-92. 91-11-26 M. L. POELKING C Drawing updated to reflect current requirements. Redrawn. - ro 05-07-25 R. MONNIN CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DR

3、AWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY DAVID W. QUEENAN DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCENZO COLUMBUS, OHIO 43218-3990 http:/www.dscc.

4、dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY D. M. COOL AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-06-12 MICROCIRCUIT, DIGITAL, ECL, UNIVERSAL COUNTER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 14933 5962-87001 SHEET 1 OF 14 DSC

5、C FORM 2233 APR 97 5962-E640-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87001 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope

6、. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87001 01 E X Drawing number Device type (see 1.2

7、.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 10H536 Universal counter 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Ou

8、tline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply

9、 voltage range (VEE) -8.0 V dc to 0.0. V dc Input voltage range . -5.2 V dc to 0.0 V dc Storage temperature range . -65C to +165C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . +165C Maximum power dissipation (PD) 940 mW Thermal resistance, junction-to-case (JC) . See M

10、IL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VEE) -5.46 V dc minimum to -4.94 V dc maximum Ambient operating temperature range (TA) . -55C to +125C Minimum high level input voltage (VIH) : TA= +25C . -0.780 V dc TA= +125C . -0.650 V dc TA= -55C -0.840 V dc Maximum low leve

11、l input voltage (VIL) -1.950 V dc Supply voltage range (VCC) -0.02 V to 0.02 V or 1.98 V to 2.02 V Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87001 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-399

12、0 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents

13、 are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Componen

14、t Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Do

15、cument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable

16、laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced

17、by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance

18、with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certifica

19、tion mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outli

20、nes shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit a

21、nd switching waveforms. The test circuit and switching waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating te

22、mperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR

23、D MICROCIRCUIT DRAWING SIZE A 5962-87001 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Limits Unit Min Max Case

24、s E, F, and 2 Quiescent tests 1/ VIHVILHigh level output VOHOutputs 2/ -0.780 -1.950 1 -1.010 -0.780 V voltage terminated -0.650 -1.950 2 -0.860 -0.650 through -0.840 -1.950 3 -1.060 -0.840 Low level output VOL100 to -2.0 V, -0.780 -1.950 1 -1.950 -1.580 V voltage VEE= -5.2 V, -0.650 -1.950 2 -1.950

25、 -1.565 VCC= 0.0 V -0.840 -1.950 3 -1.950 -1.610 High level threshold VOHA-1.110 -1.480 1 -1.010 -0.780 V output voltage -0.960 -1.465 2 -0.860 -0.650 -1.160 -1.510 3 -1.060 -0.840 Low level threshold VOLA-1.110 -1.480 1 -1.950 -1.580 V output voltage -0.960 -1.465 2 -1.950 -1.565 -1.160 -1.510 3 -1

26、.950 -1.610 Power supply drain 3/ current IEEVEE= -5.46 V, VCC= 0.0 V, VIH= -0.780 V at +25C 1 -150 mA -0.650 V at +125C -0.840 V at -55C 2,3 -165 High level input IIHCarry in 1 240 A current 2,3 380 D0, D1, D2, D3, 1 275 clock 2,3 430 S21 335 2,3 535 S11 420 2,3 670 Low level input current IILVEE=

27、-4.94 V, VIL= -1.950 V, 1,3 0.5 A VCC= 0.0 V 2 0.3 Functional tests See 4.3.1c 7,8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87001 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS,

28、 OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Limits Unit Min Max Cases E and F DC rapid tests 4/ VIHVILHigh level output VOHOutputs 2/ -0.81

29、9 -1.950 1 -1.046 -0.819 V voltage terminated -0.692 -1.950 2 -0.899 -0.692 through -0.882 -1.950 3 -1.099 -0.882 Low level output VOL100 to -2.0 V, -0.819 -1.950 1 -1.950 -1.592 V voltage VEE= -5.2 V, -0.692 -1.950 2 -1.950 -1.578 VCC= 0.0 V -0.882 -1.950 3 -1.950 -1.623 High level threshold VOHA-1

30、.146 -1.492 1 -1.046 -0.819 V output voltage -0.999 -1.478 2 -0.899 -0.692 -1.199 -1.523 3 -1.099 -0.822 Low level threshold VOLA-1.146 -1.492 1 -1.950 -1.592 V output voltage -0.999 -1.478 2 -1.950 -1.578 -1.199 -1.523 3 -1.950 -1.623 Power supply drain 3/ current IEEVEE= -5.46 V, VCC= 0.0 V, VIH=

31、-0.780 V at +25C 1 -149 mA -0.650 V at +125C -0.840 V at -55C 2,3 -164 High level input IIHCarry in 1 225 A current 2,3 365 D0, D1, D2, D3, 1 260 clock 2,3 415 S21 320 2,3 520 S11 405 2,3 655 Low level input current IILVEE= -4.94 V, VIL= -1.950 V, 1,3 0.5 A VCC= 0.0 V 2 0.3 Functional tests See 4.3.

32、1c 7,8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87001 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Ele

33、ctrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Limits Unit Min Max Case 2 DC rapid tests 4/ VIHVILHigh level output VOHOutputs 2/ -0.818 -1.950 1 -1.045 -0.818 V voltage terminated -0.692 -1.950 2 -0.898 -0.692 through

34、 -0.882 -1.950 3 -1.098 -0.882 Low level output VOL100 to -2.0 V, -0.818 -1.950 1 -1.950 -1.592 V voltage VEE= -5.2 V, -0.692 -1.950 2 -1.950 -1.578 VCC= 0.0 V -0.882 -1.950 3 -1.950 -1.623 High level threshold VOHA-1.145 -1.492 1 -1.045 -0.818 V output voltage -0.998 -1.478 2 -0.898 -0.692 -1.198 -

35、1.523 3 -1.098 -0.882 Low level threshold VOLA-1.145 -1.492 1 -1.950 -1.592 V output voltage -0.998 -1.478 2 -1.950 -1.578 -1.199 -1.523 3 -1.950 -1.623 Power supply drain 3/ current IEEVEE= -5.46 V, VCC= 0.0 V, VIH= -0.780 V at +25C 1 -149 mA -0.650 V at +125C -0.840 V at -55C 2,3 -164 High level i

36、nput IIHCarry in 1 225 A current 2,3 365 D0, D1, D2, D3, 1 260 clock 2,3 415 S21 320 2,3 520 S11 405 2,3 655 Low level input current IILVEE= -4.94 V, VIL= -1.950 V, 1,3 0.5 A VCC= 0.0 V 2 0.3 Functional tests See 4.3.1c 7,8 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction

37、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87001 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C

38、 unless otherwise specified Group A subgroups Limits Unit Min Max Cases E, F, and 2 AC tests Transition time low to high tTLH, VEE= -2.94 V, VCC= 2.0 V, 9 0.7 2.1 ns or high to low tTHLCL 5 pF, 10,11 0.7 2.3 Propagation delay time, tPHH1, load all outputs through 100 to 9 0.7 3.2 ns CLOCK high to Q0

39、high or low tPHL1ground, see figure 4 10,11 0.7 3.5 Propagation delay time, tPHH2, 9 0.7 7.0 ns CLOCK high to OUTCARRY high or low tPHL210,11 0.7 7.7 Propagation delay time, tPHH39 0.7 3.0 ns INCARRY high to OUTCARRY high 10,11 0.7 3.5 Propagation delay time, tPLL9 0.7 3.0 ns INCARRY low to OUTCARRY

40、 low 10,11 0.7 3.5 Maximum count frequency fMAX9,10,11 250 MHz Setup time, D0high or low to CLOCK high tS19,10,11 2.0 ns Setup time, S1or S2high to CLOCK high tS29,10,11 3.5 ns Setup time, INCARRY low to CLOCK high tS39,10,11 2.0 ns Setup time, CLOCK high to INCARRY high tS49,10,11 0.0 ns Hold time,

41、 CLOCK high to D0high or low tH19,10,11 0.0 ns Hold time, CLOCK high to S1or S2high tH29,10,11 -0.5 ns Hold time, CLOCK high to INCARRY low tH39,10,11 150 ps See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICR

42、OCIRCUIT DRAWING SIZE A 5962-87001 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Limits Unit Min Max

43、Cases E, F, and 2 AC tests - continued Hold time, INCARRY high to CLOCK high tH4VEE= -2.94 V, VCC= 2.0 V, CL 5 pF, 9 2.0 ns load all outputs through 100 to ground, see figure 4 10,11 2.2 1/ The quiescent limits are determined after a device has reached thermal equilibrium. This is defined as the rea

44、ding taken with the device in a socket with 500 LFPM of +25C, +125C or -55C (as applicable) air blowing on the unit in a transverse direction with power applied for at least four (4) minutes before the reading is taken. This method was used for theoretical limit establishment only. All devices shall

45、 be tested to the delta V (rapid test) conditions specified herein. The rapid test method is an equivalent method of testing quiescent conditions. 2/ The high and low level output current varies with temperature, and shall be calculated using the following formulas: IOH= ( -2 - VOH) / 100 IOL= ( -2

46、- VOL) / 100 3/ The IEElimit, although specified in the minimum column, shall not be exceeded in magnitude, as a maximum value. 4/ The dc rapid test forcing functions and limits are used for all dc testing. These limits are determined for each device type based on the power dissipation and package t

47、ype. The rapid test (delta V) limits and forcing functions are skewed allowing rapid testing to be performed at standard temperatures without the addition of delta Ts. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 here

48、in. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is u