DLA SMD-5962-86052 REV C-2006 MICROCIRCUIT MEMORY DIGITAL BIPOLAR 256 X 8-BIT RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON《硅单块 双极256X8比特随机存取存储器 数字主储存器微型电路》.pdf

《DLA SMD-5962-86052 REV C-2006 MICROCIRCUIT MEMORY DIGITAL BIPOLAR 256 X 8-BIT RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON《硅单块 双极256X8比特随机存取存储器 数字主储存器微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-86052 REV C-2006 MICROCIRCUIT MEMORY DIGITAL BIPOLAR 256 X 8-BIT RANDOM ACCESS MEMORY (RAM) MONOLITHIC SILICON《硅单块 双极256X8比特随机存取存储器 数字主储存器微型电路》.pdf（15页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add a LCC package. In table I, change IIN from -8 mA to -18 mA. 87-06-08 N. A. Hauck B Changes in accordance with NOR 5962-R159-96 96-06-26 M. A. Frye C Boilerplate update, part of 5 year review. REDRAWN ksr 06-05-16 Raymond Monnin CURRENT CAGE C

2、ODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Sandra Rooney DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzio

3、 COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 86-05-02 MICROCIRCUIT, MEMORY, DIGITAL, BIPOLAR 256 X 8-BIT RANDOM ACCESS MEMORY (RAM), MONOLITHIC SILICON AM

4、SC N/A REVISION LEVEL C SIZE A CAGE CODE 14933 5962-86052 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E449-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86052 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4

5、3218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in t

6、he following example: 5962-86052 01 W A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 8X350 2048-bit bipolar RAM 1.2.2 Case outline

7、(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style W GDIP1-T22 or CDIP2-T22 22 Dual-in-line package 3 CQCC1-N28 28 Square chip carrier package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, ap

8、pendix A. 1.3 Absolute maximum ratings. Supply voltage .+7 V dc maximum Input voltage +5.5 V dc maximum Storage temperature range .-65C to +150C Maximum power dissipation (PD) 1.05 W 1/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Case W and 3 See MIL-STD

9、-1835 Junction temperature (TJ).+200C 1.4 Recommended operating conditions. Supply voltage (VCC) .+4.75 V dc to +5.25 V dc Case operating temperature range (TC) -55C to +125C Minimum high level input voltage .2.0 V dc Maximum high level input voltage 0.8 V dc 1/ Must withstand the added PDdue to sho

10、rt circuit test (e.g., IOS) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86052 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENT

11、S 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE

12、 SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of

13、 Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19

14、111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3.

15、REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manuf

16、acturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Manageme

17、nt (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when

18、 the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.2 Truth table.

19、 The truth table shall be as specified on figure 2. 3.2.3 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.4 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical

20、 performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3

21、.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufact

22、urer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark

23、 in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86052 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C

24、SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TC +125C 4.75 V VCC 5.25 Group A subgroups Device type Limits Unit unless otherwise specified Min Max Input voltage low VIL1, 2, 3 All 0.8 V Input voltage high VIH1, 2, 3 All 2.0 V Input

25、clamp voltage 3/ VICVCC= min, IIN= -18 mA 1, 2, 3 All -1.2 V Output voltage low VOLVCC= min, IOL= 9.6 mA 1, 2, 3 All 0.5 V 4/ Output voltage high VOHVCC= min, IOH= -2 mA 1, 2, 3 All 2.4 V 5/ Input current low IILVCC= max, VIN= 0.45 V 1, 2, 3 All -150 A Input current high IIHVCC= max, VIN= 5.5 V 1, 2

26、, 3 All 50 A CC= max 1, 2, 3 All Output current high Z state IOZME = high, VOUT= 5.5 V 80 A ME = high, VOUT= 0.5 V -100 Output current short circuit IOSSC = WC, ME = high, VOUT= 0 V, stored high, 1, 2, 3 -15 -85 mA 3/ 6/ VCC= max All VCCsupply current 7/ ICCME = high, VCC= max 1, 2, 3 All 200 mA Out

27、put enable time from SC - to data out TE140 Output enable time from ME - to data out TE240 Output disable time from SC + to data out TD1All 40 ns Output disable time from ME + to data out TD240 Pulse width master clock 8/ TWSee figures 6 and 7 9, 10, 11 50 See footnotes at end of table. Provided by

28、IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86052 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol C

29、onditions 1/ 2/ -55C TC +125C 4.75 V VCC 5.25 Group A subgroups Device type Limits Unit unless otherwise specified Min Max Setup time from address to MCLK TSA40 Hold time from MCLK to address THASee figures 6 and 7 9, 10, 11 All 10 ns Setup time from data in to MCLK TSD45 Hold time from MCLK to data

30、 in THD10 Setup time from ME to MCLK TS350 Hold time from MCLK to ME TH35 Setup time from ME to MCLK TS140 Hold time from MCLK to ME TH25 Setup time from SC, WC to ME TS25 Hold time from MCLK to SC TH15 Hold time from MCLK to WC TH45 1/ All voltage values are with respect to network ground terminal.

31、 2/ The operating case temperature ranges are guaranteed with transverse air flow exceeding 400 linear feet per minute and a 2 minute warm-up. Typical thermal resistance values of the packaging at maximum temperature are: JC junction-to-case at 400 fpm air flow: 50C/W JC junction-to-case at still ai

32、r: 90C/W JC junction-to-case: 20C/W 3/ Test each pin one at a time. 4/ Measured with a logic low stored. Output sink current is supplied through a resistor to VCC. 5/ Measured with a logic high. 6/ Duration of the short circuit should not exceed 1 second. 7/ ICCis measured with the write enable and

33、memory enable inputs grounded, all other inputs at 4.5 V and the output open. 8/ Minimum required to guarantee a write into the slowest bit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86052 DEFENSE SUPPL

34、Y CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compl

35、iance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix

36、 A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to rev

37、iew the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Scree

38、ning. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall

39、be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method

40、 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conforman

41、ce inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-88

42、3 shall be omitted. c. Subgroup 7 functional testing shall include verification of instruction set. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B

43、, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance w

44、ith the intent specified in method 1005 of MIL-STD-883. (2) TA = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59

45、62-86052 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Device Type 01 Case Outline W 3 Terminal Number Terminal Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 D7D6D5D4D3D2D1D0ME WC GND SC MCLK A0A1A2A3A4A5A6

46、A7VCC - - - - - -NC D7D6D5D4D3D2NC D1D0ME NC WC GND NC SC MCLK NC A0A1A2NC A3A4A5A6A7VCC FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86052 DEFENSE SUPPLY CENTER COLUMBUS CO

47、LUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 Mode ME SC WC MCLK Address Data Bus Lines Hold address Disable data out 1 X X X High Z data out Input new address 0 1 0 1 Address High Z Hold address Disable data out 0 1 0 0 High Z data out Hold address Write data 0 0 1 1 Data i

48、n Hold address Disable data out 0 0 1 0 High Z data out Hold address Read data 0 0 0 X Data out Undefined state 0 1 1 1 - Hold address Disable data out 0 1 1 0 High Z data out NOTES: X = DONT CARE The SC and WC outputs from the 8X300 are never at 1 simultaneously. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86052 DEFENSE SUPPLY CENTER COLUMBUS COLU