DLA SMD-5962-86018 REV D-2006 MICROCIRCUIT LINEAR AC PLASMA DISPLAY DRIVERS MONOLITHIC SILICON《硅单块 交流型等离子体显示设备直线微型电路》.pdf

《DLA SMD-5962-86018 REV D-2006 MICROCIRCUIT LINEAR AC PLASMA DISPLAY DRIVERS MONOLITHIC SILICON《硅单块 交流型等离子体显示设备直线微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-86018 REV D-2006 MICROCIRCUIT LINEAR AC PLASMA DISPLAY DRIVERS MONOLITHIC SILICON《硅单块 交流型等离子体显示设备直线微型电路》.pdf（18页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Convert to military drawing format, page 2, case Z change from 2150 mW to 1825 mW. Page 5, table I, change VOLtest condition IOLfrom -1 mA to 1 mA. Change code identification number to 67268. 87-11-25 M. A. FRYE B Add a C-J4 package and change th

2、e vendors part number. Editorial changes throughout. 90-10-15 M. A. FRYE C Make correction to marking paragraph 3.5. Drawing updated to reflect current requirements. -rrp 05-04-04 R. MONNIN D Change to setup time, tSU, condition from 20 ns to 28 ns for device type 01 in 1.4. -rrp 06-07-07 R. MONNIN

3、THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV D D D SHEET 15 16 17 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK C. OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT

4、DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, AC PLASMA DISPLAY DRIVERS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 8

5、6-04-15 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 14933 86018 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E500-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 4

6、3218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in t

7、he following example: 86018 01 Q X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 55500 AC plasma display driver (line select) 02 55

8、501 AC plasma display driver (matrix - addressable) 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Q GDIP1-T40 or CDIP2-T40 40 Dual-in-line X CQCC2-J44 44 J-lead chip carrier Z CQCC1-N44 44 Sq

9、uare leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Input voltage VCC1+ 0.3 V Supply voltage (VCC1) . 13.8 V 1/ Supply voltage (VCC2) 100 V Storage temperature range . -65C to +150C Continuous total dissipation at

10、(or below) TA= +25C: Case Q 1650 mW Cases X and Z . 1825 mW Lead temperature soldering (0.0625 inch from case for 60 seconds): Case Q +300C Cases X and Z . +260C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 1/ Voltage values are with respect to network ground terminal. Provided by IHSN

11、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VCC1) 10.8 V to 1

12、3.2 V Supply voltage (VCC2) 0 V to 100 V High level input voltage (VIH) as a percentage of VCC1. 75% minimum Low level input voltage (VIL) as a percentage of VCC1. 25% maximum Peak high level output current . -20 mA maximum Peak low level output current 20 mA maximum High level output clamp current

13、. 20 mA maximum Low level output clamp current -20 mA maximum Clock frequency (fclock) . 0 MHz to 8 MHz 2/ Duration of high or low clock pulse (tW) . 62 ns minimum Setup time (tSU) data inputs before clock low to high, device type 01 28 ns minimum Setup time (tSU) data inputs before clock low to hig

14、h , device type 02 20 ns minimum Setup time (tSU) select inputs before strobe high to low, device type 01 50 ns minimum Hold time (tH), data inputs after clock low to high 50 ns minimum Hold time (tH), strobe input after clock low to high, device type 01 50 ns minimum Hold time (tH), strobe high hol

15、d time after clock high, device type 02 150 ns minimum Hold time (tH), select inputs after strobe low to high, device type 01 . 50 ns minimum Hold time (tH), strobe high hold time after sustain high, device type 02 . 250 ns minimum Ambient operating temperature range (TA) -55C to +125C 2. APPLICABLE

16、 DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT O

17、F DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103

18、- List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelph

19、ia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obta

20、ined. 2/ For operation above TA= +25C junction temperature (see figure 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DS

21、CC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certif

22、ied and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented

23、in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q” or “QML” certification mark in accordance with MIL-PRF-38535 is re

24、quired to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.

25、2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Logic symbols and functional block diagrams. The logic symbols and functional block diagrams shall be as specified on figure 3. 3.2.4 Switching waveforms. The switching waveforms shall be as specified on figu

26、re 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be t

27、he subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Ce

28、rtification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q” or “QML” certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option

29、 is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall

30、 affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.

31、8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore do

32、cumentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DS

33、CC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxInput clamp voltage VIKVCC1= 12 V, II= -12 mA 1, 2, 3 01 -1.5 V VCC1= 13.2 V, IOH= -1 mA, VCC2= 100 V 94 VCC1= 13.2 V,

34、 IOH= -10 mA, VCC2= 100 V 92 High level output voltage VOHVCC1= 13.2 V, IOH= -15 mA, VCC2= 100 V 1, 2, 3 01 90 V VCC1= 13.2 V, IOL= 1 mA, VCC2= 100 V 2.0 VCC1= 13.2 V, IOL= 10 mA, VCC2= 100 V 4.0 Low level output voltage VOLVCC1= 13.2 V, IOL= 15 mA, VCC2= 100 V 1, 2, 3 01 5.0 V VCC2= 0 V, IO= 20 mA

35、2.5 Output clamp voltage VOKVCC2= 0 V, IO= -20 mA 1, 2, 3 01 -2.5 V High level input current IIHVCC1=13.2 V, VI= VIHminimum 1, 2, 3 01 1.0 A Low level input current IILVCC1=13.2 V, VI= VILmaximum 1, 2, 3 01 -1.0 A VCC1= 13.2 V, VI= VCC1 max 1.0 Supply current ICC1VCC1= 13.2 V, VI= 0 1, 2, 3 01 1.0 m

36、A VCC2= 100 V, 8 outputs high 5.0 Supply current ICC2VCC2= 100 V, all output low 1, 2, 3 01 3.0 mA 9 250 Delay time, high to low level output from strobe input tDHLCL= 30 pF, VCC1= 12 V, VCC2= 100 V 10, 11 01 350 ns 9 450 Delay time, low to high level output from strobe input tDLHCL= 30 pF, VCC1= 12

37、 V, VCC2= 100 V 10, 11 01 550 ns Transition time, high to low level output tTHLCL= 30 pF, VCC1= 12 V, VCC2= 100 V 9, 10, 11 01 200 ns Transition time, low to high level output tTLHCL= 30 pF, VCC1= 12 V, VCC2= 100 V 9, 10, 11 01 250 ns Provided by IHSNot for ResaleNo reproduction or networking permit

38、ted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA +125C unless otherwise specifi

39、ed Group A subgroups Device type Limits Unit Min Max Input clamp voltage VIKVCC1= 12 V, II= -12 mA 1, 2, 3 02 -1.5 V VCC1= 13.2 V, IOH= -1 mA, VCC2= 100 V, Q outputs 94 VCC1= 13.2 V, IOH= -10 mA, VCC2= 100 V, Q outputs 92 VCC1= 13.2 V, IOH= -15 mA, VCC2= 100 V, Q outputs 90 High level output voltage

40、 VOHVCC1= 10.8 V, IOH= -100 A, VCC2= 100 V, serial data 1, 2, 3 02 9 V VCC1= 13.2 V, IOL= 1 mA, VCC2= 100 V, Q outputs 2.0 VCC1= 13.2 V, IOL= 10 mA, VCC2= 100 V, Q outputs 4.0 VCC1= 13.2 V, IOL= 15 mA, VCC2= 100 V, Q outputs 5.0 Low level output voltage VOLVCC1= 10.8 V, IOL= 100 A, VCC2= 100 V, seri

41、al data 1, 2, 3 02 1.0 V VCC2 = 0 V, IO= 20 mA 2.5 Q output clamp voltage VOKVCC2 = 0 V, IO= -20 mA 1, 2, 3 02 -2.5 V High level input current IIHVCC1=13.2 V, VCC2= 100 V VIH= VIHminimum 1, 2, 3 02 1.0 A Low level input current IILVCC1=13.2 V, VCC2= 100 V VIL= VILmaximum 1, 2, 3 02 -1.0 A VCC1= 13.2

42、 V, VI= VCC1, VCC2= 100 V 1.0 Low voltage supply current ICC1VCC1= 13.2 V, VI= GND, VCC2= 100 V 1, 2, 3 02 1.0 mA VCC2= 100 V, outputs low 1.0 High voltage supply current ICC2VCC2= 100 V, outputs high 1, 2, 3 02 5.0 mA Transition time high to low level Q output tTHLCL= 30 pF, VCC1= 12 V, VCC2= 100 V

43、 9, 10, 11 02 200 ns Transition time low to high level Q output tTLHCL= 30 pF, VCC1= 12 V, VCC2= 100 V 9, 10, 11 02 250 ns 9 250 CL= 30 pF, VCC1= 12 V, VCC2= 100 V, from strobe to Q outputs 10, 11 300 9 250 Delay time to high to low transition tDHLCL= 30 pF, VCC1= 12 V, VCC2= 100 V, from sustain to

44、Q outputs 10, 11 02 300 ns Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86018 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performa

45、nce characteristics Continued. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max 9 450 CL= 30 pF, VCC1= 12 V, VCC2= 100 V, from strobe to Q outputs 10, 11 650 9 450 Delay time to low to high transition tDLHCL= 30 pF, VCC1= 12 V, VCC2= 1

46、00 V, from sustain to Q outputs 10, 11 02 650 ns 9 147 tDHL10, 11 300 9 147 Delay time to high to low from clock to serial data output tDLHCL= 20 pF, VCC1= 12 V, VCC2= 100 V 10, 11 02 300 ns 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with M

47、IL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A,

48、B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical t